LabCompanion TH-225-8 Rapid Temperature Change Test Chamber
| Brand | LabCompanion |
|---|---|
| Origin | Guangdong, China |
| Manufacturer Type | Direct Manufacturer |
| Model | TH-225-8 |
| Temperature Range | −70 °C to +150 °C |
| Temperature Fluctuation | ±0.5 °C |
| Temperature Uniformity | ≤2.0 °C |
| Temperature Deviation | ±2.0 °C |
| Ramp Rate (Heating/Cooling) | 1–25 °C/min (linear or non-linear) |
| Internal Chamber Dimensions | 600 × 750 × 500 mm (W × H × D) |
Overview
The LabCompanion TH-225-8 Rapid Temperature Change Test Chamber is an engineered environmental simulation system designed for accelerated thermal stress testing of electronic components, automotive modules, aerospace subsystems, and advanced materials. It operates on a dual-refrigeration + electric heating architecture with independent cascade refrigeration circuits and high-efficiency forced-air convection, enabling precise, repeatable, and programmable transitions between extreme temperature extremes. Unlike standard thermal chambers, the TH-225-8 delivers controlled ramp rates ranging from 1 °C/min up to 25 °C/min—both in heating and cooling phases—supporting industry-standard thermal shock profiles per MIL-STD-810H Method 503.7, IEC 60068-2-14, and JEDEC JESD22-A104E. Its chamber core features insulated stainless-steel construction with low-thermal-mass internal walls and calibrated platinum resistance thermometers (PRTs) at multiple spatial locations to ensure traceable thermal field stability.
Key Features
- High-fidelity temperature control with ±0.5 °C fluctuation and ≤2.0 °C uniformity across the full working volume
- Independent dual-stage refrigeration system with environmentally compliant R404A/R23 mixed refrigerant circuitry
- Programmable linear and non-linear ramp profiles, including dwell-hold, step-and-soak, and custom multi-segment cycles
- Touchscreen HMI with embedded real-time data logging, alarm history, and user-level access control (operator/engineer/admin)
- Robust structural design: 1.2 mm SUS304 stainless steel interior, 100 mm polyurethane foam insulation (λ = 0.022 W/m·K), and reinforced double-glazed observation window
- Integrated safety systems: over-temperature cut-off, refrigerant pressure monitoring, door interlock, and emergency power-off with mechanical latch
Sample Compatibility & Compliance
The TH-225-8 accommodates test specimens up to 600 × 750 × 500 mm (W × H × D) with maximum payload capacity of 50 kg under dynamic thermal cycling conditions. It supports mounting fixtures, cable ports (standard 3 × Φ50 mm), and optional humidity integration (not included). The chamber meets essential electromagnetic compatibility (EMC) requirements per EN 61326-1 and conforms to electrical safety standards IEC 61010-1. For regulated industries, its firmware supports audit trail generation, electronic signature capability (21 CFR Part 11 compliant when paired with validated LabCompanion LMS software), and calibration traceability to NIST-traceable references. Routine verification follows ISO/IEC 17025-compliant procedures documented in the supplied IQ/OQ/PQ protocol package.
Software & Data Management
The embedded controller runs LabCompanion’s proprietary TC-OS v4.2 firmware, offering intuitive cycle programming via drag-and-drop sequence builder and CSV-based batch import/export. Real-time graphical display shows setpoint vs. actual curves for all monitored zones, with configurable alarms (deviation, rate-of-change, duration breach). Raw sensor data (10 Hz sampling) is stored internally (32 GB SSD) and exportable via USB or Ethernet (Modbus TCP, FTP, or optional OPC UA). Optional LabCompanion DataHub™ software provides centralized fleet monitoring, remote diagnostics, automated report generation (PDF/Excel), and integration with MES/QMS platforms such as Siemens Opcenter, ETQ Reliance, or Qualio.
Applications
- Thermal shock validation of PCB assemblies and solder joints per IPC-9701A and IPC-J-STD-020D
- Reliability screening of EV battery modules and power electronics under repeated low-high temperature excursions
- Material coefficient-of-thermal-expansion (CTE) characterization using strain gauge or DIC-coupled setups
- Qualification testing of avionics enclosures subjected to rapid ambient shifts during flight envelope simulation
- Accelerated life testing (ALT) of optical sensors, MEMS devices, and packaging adhesives
- Pre-compliance evaluation for automotive AEC-Q200 stress tests and ISO 16750-4 environmental robustness protocols
FAQ
What is the minimum achievable ramp rate for non-linear profiles?
The system supports ramp rates as low as 0.1 °C/min in extended dwell mode when configured with optional low-power heating modulation—subject to thermal load and chamber loading conditions.
Can the TH-225-8 be integrated into an existing factory automation network?
Yes. Standard Ethernet port supports Modbus TCP and HTTP API; optional PROFINET or EtherCAT gateways are available for PLC-level integration.
Is third-party calibration certification included with delivery?
A factory-issued calibration certificate (traceable to CNAS-accredited lab) is provided. Full ISO/IEC 17025 calibration with uncertainty budget is available as an add-on service.
Does the chamber support nitrogen purge or inert atmosphere operation?
An optional gas purge kit (with mass flow controller and O₂ sensor) enables controlled N₂ or dry air purging to mitigate oxidation during high-temperature holds.
What maintenance intervals are recommended for long-term reliability?
Refrigeration oil and filter replacement every 24 months; PRT sensor verification annually; full system performance validation every 12 months per ASTM E744 guidelines.
