Ta Wire (Tantalum Filament) – Hefei Kejing Brand
| Brand | Hefei Kejing |
|---|---|
| Origin | Anhui, China |
| Manufacturer Type | Authorized Distributor |
| Origin Category | Domestic (China) |
| Model | Ta Wire |
| Pricing | Upon Request |
| Diameter Range | 0.01–2.0 mm |
| Purity | 99.99% (4N) |
| Packaging | Class 1000 Cleanroom Environment, Sealed in Class 100 Clean Bags with Aluminum Foil Wrapping |
Overview
Ta Wire (Tantalum Filament) is a high-purity metallic wire product engineered for demanding applications in vacuum electronics, high-temperature furnace heating elements, sputtering targets, and thin-film deposition systems. Composed of elemental tantalum (Ta) with certified 99.99% (4N) purity, this wire exhibits exceptional corrosion resistance, high melting point (~3017 °C), excellent ductility at room temperature, and stable electrical resistivity under thermal cycling. Its low vapor pressure and minimal outgassing characteristics make it suitable for ultra-high vacuum (UHV) environments—common in semiconductor fabrication, surface science instrumentation (e.g., XPS, AES), and electron microscopy sample holders. Unlike stainless steel or nickel-chromium alloys, tantalum wire maintains structural integrity and dimensional stability above 1800 °C in inert or reducing atmospheres, enabling reliable performance in controlled thermal processing.
Key Features
- Ultra-high purity grade: 99.99% (4N) tantalum, verified by ICP-MS and GDMS trace element analysis per ASTM E1479 and ISO 11885 standards
- Precisely controlled diameter tolerance: ±0.002 mm for wires ≤0.1 mm; ±0.01 mm for diameters >0.1 mm, measured via laser micrometry (ISO 4967)
- Consistent tensile strength: 350–450 MPa (annealed condition), elongation ≥25% (ASTM B521)
- Surface finish: Electrolytically polished to Ra ≤0.4 µm, minimizing particle shedding and contamination risk
- Cleanroom-compatible packaging: Manufactured and double-packaged in ISO Class 6 (Class 1000) cleanroom; final seal in ISO Class 5 (Class 100) laminar flow bags with vacuum-sealed aluminum foil barrier
- Traceability: Each spool includes lot-specific certificate of conformance (CoC) with batch number, purity report, dimensional verification data, and handling instructions
Sample Compatibility & Compliance
Ta Wire is compatible with standard wire-drawing, coiling, welding (electron beam or TIG), and ultrasonic bonding processes. It demonstrates chemical inertness toward molten glass, most slags, and non-oxidizing acids—including hydrochloric, sulfuric, and nitric acid up to boiling concentrations. However, it is not resistant to hot alkaline solutions or fluorinated compounds. The material complies with ASTM B521 (Standard Specification for Tantalum and Tantalum Alloy Wire) and meets the raw material requirements referenced in SEMI F57 (Specification for Semiconductor Grade Tantalum Metal). All batches undergo residual gas analysis (RGA) to confirm total volatile hydrocarbon content <10 ppb and water vapor desorption <50 ppm after 24 h bakeout at 200 °C—ensuring suitability for UHV chamber integration per ISO 14644-1 Class 5 environmental specifications.
Software & Data Management
As a passive metallurgical component, Ta Wire does not incorporate embedded firmware or digital interfaces. However, full digital traceability is maintained through Hefei Kejing’s Quality Management System (QMS), compliant with ISO 9001:2015 and aligned with GLP documentation principles. Certificate of Conformance (CoC) files are delivered in PDF/A-1b format with embedded metadata (batch ID, test date, analyst signature, instrument calibration IDs). Customers may integrate CoC data into their internal LIMS or ERP platforms via standardized CSV exports upon request. Audit-ready records—including raw test spectra, dimensional logs, and cleanroom environmental monitoring logs—are retained for ≥10 years per company policy.
Applications
- Heating elements in high-temperature tube furnaces (up to 2400 °C in argon/hydrogen mixtures)
- Feedthroughs and support structures in ion implantation systems and plasma etch chambers
- Evaporation sources for physical vapor deposition (PVD) of Ta-based diffusion barriers in Cu interconnect fabrication
- Substrate heaters and crucible windings in molecular beam epitaxy (MBE) systems
- Reference electrodes and current collectors in molten salt electrochemistry cells
- Calibration standards for thermogravimetric analyzers (TGA) and differential scanning calorimeters (DSC) requiring inert, high-melting reference masses
FAQ
Is this tantalum wire suitable for use in oxygen-rich environments at elevated temperatures?
No. Tantalum oxidizes rapidly above 300 °C in air or oxygen, forming non-conductive Ta2O5. It must be used under inert (Ar, N2) or reducing (H2/Ar) atmospheres above 200 °C.
What is the maximum recommended draw ratio during cold working?
For optimal ductility retention, single-pass cold reduction should not exceed 25%. Total cumulative reduction before intermediate annealing must remain below 60% to prevent cracking.
Can custom diameters outside the 0.01–2.0 mm range be supplied?
Yes. Hefei Kejing supports bespoke orders from 0.005 mm (5 µm) to 5.0 mm diameter, subject to minimum order quantity and extended lead time.
Do you provide bend testing or springback characterization data?
Upon request, third-party bend test reports (per ASTM E290) and springback angle measurements (using ISO 7438 methodology) can be included in the CoC package.
Are spools available with specific winding tension or layer-count specifications?
Yes. Standard spools are wound at 15–25 N tension with uniform layering. Custom tension control (5–100 N) and precision layer counting (±1 turn) are available for OEM integration requirements.
