Zhengye XG5000 Series Non-Destructive X-ray Inspection System for Semiconductor Chips

Overview

The Zhengye XG5000 Series Non-Destructive X-ray Inspection System is an industrial-grade, high-resolution radiographic imaging platform engineered for precision internal defect analysis of semiconductor chips, packaged ICs, and miniaturized electronic assemblies. Based on the fundamental principle of differential X-ray attenuation—where variations in material density and thickness produce contrast in transmitted radiation—the system delivers real-time, high-fidelity 2D projection images suitable for failure analysis (FA), process validation, and quality assurance in high-reliability manufacturing environments. Unlike conventional optical or contact-based metrology tools, this system enables full volumetric assessment without disassembly, wire-bonding disruption, or sample destruction—critical for post-packaging inspection of BGA, QFN, WLCSP, and stacked-die configurations. Its modular architecture supports both manual operator-guided inspection and fully automated inline integration via external PLC handshaking.

Key Features

• 2.5D Metrology Engine: Supports calibrated geometric measurements including linear distance, circle diameter, concentricity of nested features, and point-to-center offset—enabling quantitative evaluation of solder joint voiding, die tilt, wire bond alignment, and lead coplanarity per IPC-A-610 and J-STD-001 guidelines.
• CNC Path Programming: Enables repeatable, script-driven inspection sequences; users record motion trajectories (X/Y/Z translation + detector tilt) for batch processing of small-lot or multi-variant PCBAs without re-teaching.
• Intuitive Navigation Interface: Large-scale real-time navigation window allows direct mouse-click targeting on live radiographs, triggering high-precision motorized stage repositioning to sub-100 µm accuracy—reducing operator fatigue and inter-observer variability.
• Multi-Modal Imaging Support: Compatible with both image intensifier and flat-panel detectors; configurable FOV and pixel matrix allow optimization between throughput (wide-field screening) and resolution (fine-feature interrogation).
• Robust Mechanical Architecture: X-ray source and detector move independently along three orthogonal axes via precision-ground ball screws and synchronous belt-driven stepper motors—ensuring smooth, backlash-free motion and long-term mechanical stability under continuous operation.

Sample Compatibility & Compliance

The XG5000 accommodates standard JEDEC trays, gel-paks, and bare dies up to 450 mm × 410 mm in footprint and 5 kg in mass. Its sealed lead-lined cabinet meets IEC 61331-1:2014 and GBZ 137-2017 requirements for occupational radiation safety, with leakage dose consistently ≤1 µSv/hr at 5 cm from all external surfaces during operation. All software operations—including measurement logging, pass/fail flagging, and image annotation—are timestamped and user-identified, supporting audit readiness for ISO 9001:2015, IATF 16949, and internal GLP workflows. Optional DICOM export enables integration into enterprise-level FA databases and LIMS platforms.

Software & Data Management

The proprietary Zhengye XG-Insight™ software provides a unified interface for acquisition, analysis, reporting, and data archival. It supports real-time histogram equalization, edge enhancement, noise suppression, and dynamic range expansion—critical for low-contrast features such as micro-voids in Cu pillars or thin-film delamination. Images are saved in lossless TIFF or compressed JPEG2000 formats with embedded EXIF metadata (kV, µA, exposure time, magnification, stage coordinates). Measurement results are exportable to CSV or Excel; reports include annotated screenshots, statistical summaries (mean, SD, Cp/Cpk), and configurable pass/fail thresholds. Audit trail functionality logs all user actions, parameter changes, and calibration events—fully compliant with FDA 21 CFR Part 11 when deployed with network authentication and electronic signature modules.

Applications

• Void detection and quantification in solder bumps and thermal interface materials (TIM)
• Wire bond integrity verification: loop height, tail length, necking, and breakage
• Die attach inspection: coverage uniformity, air gap mapping, and epoxy bleed-out
• BGA cavity analysis: bridging, tombstoning, and pad cratering
• Package warpage assessment via multi-angle tomographic reconstruction (with optional tilt stage)
• Post-reflow and post-thermal-cycle reliability screening for automotive and aerospace electronics

FAQ

What X-ray tube options are available for the XG5000 series?
Standard configuration includes a microfocus tungsten-target tube (90–130 kV, 89–455 µA); optional upgrades include dual-energy tubes and liquid-metal-jet sources for enhanced material discrimination.
Can the system be integrated into an automated SMT line?
Yes—via Ethernet/IP or Modbus TCP communication protocols; external trigger inputs support synchronization with conveyor indexing and robotic arm positioning.
Is training and technical support provided internationally?
Zhengye offers remote commissioning, on-site installation supervision, and certified operator training programs; service contracts include firmware updates, annual performance verification, and radiation safety recalibration.
Does the software support multi-user role-based access control?
Yes—administrator, engineer, and operator profiles can be defined with granular permissions for measurement editing, report generation, system configuration, and calibration access.
What is the typical lead time for delivery and qualification?
Standard units ship within 8–12 weeks after order confirmation; IQ/OQ documentation packages and GAMP-compliant validation templates are available upon request.