Semiconductor Instruments
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| Brand | VC Plasma |
|---|---|
| Origin | Guangdong, China |
| Manufacturer Type | Authorized Distributor |
| Country of Origin | China |
| Model | VC-011 |
| Pricing | Available Upon Request |
| Brand | VC Plasma |
|---|---|
| Model | VC-C500 |
| Origin | Guangdong, China |
| Equipment Type | Dry Cleaning System for Semiconductor Wafer & Precision Component Handling |
| Automation Level | Fully Automated (PLC + HMI Controlled) |
| Positioning Accuracy | ±0.1 mm |
| Repeatability | ±0.05 mm |
| Z-Axis Adjustment Range | 100 mm (Manual) |
| Conveyor Speed | Adjustable from 2–5 m/min |
| Electrostatic Neutralization | Integrated Pulsed DC Ionizer |
| Dust Collection Principle | High-Efficiency Negative-Pressure Vacuum Capture |
| Modular Expandability | Optional Plasma Activation Module |
| Compliance Framework | Designed for ISO Class 5–7 cleanroom integration |
| Control Interface | Industrial Touchscreen HMI with Real-Time Status Monitoring and Mode Switching (Manual/Automatic) |
| Brand | Vector Scientific |
|---|---|
| Origin | Guangdong, China |
| Model | SLKX-102-11 |
| Film Thickness Uniformity | ≤±2.5% over 4-inch wafer area, ≤±3.5% over 8-inch wafer area (measured on Ti film, 200–500 nm, edge exclusion of 5 mm, 5-point random sampling) |
| System Architecture | Interconnected multi-chamber PVD platform with load-lock and transfer robot |
| Base Pressure | ≤5×10⁻⁸ Torr (typical, after bake-out) |
| Chamber Interface Standard | CF flanges (DN100/DN160 compatible) |
| Target-to-Substrate Distance | Externally adjustable manually |
| Control Architecture | Modular PLC + real-time OS with role-based user permissions |
| Compliance | Designed to support GLP/GMP-aligned process documentation |
| Brand | Veeco |
|---|---|
| Origin | USA |
| Model | GEN10 |
| Configuration | Cluster-tool architecture with up to three material-specific growth chambers |
| Vacuum Integration | Ultra-high vacuum (UHV) integrated chamber system |
| Automation | Robotic wafer transfer for unattended operation |
| Application Scope | Research-grade III–V, II–VI, and elemental semiconductor epitaxy |
| Compliance Framework | Designed for GLP-compliant process documentation and ASTM F1529-22 compatible thin-film metrology workflows |
| Brand | Vistron |
|---|---|
| Manufacturer | Laser oFab GmbH |
| Origin | Germany |
| Model | Laser oFab EUV Tube |
| EUV Peak Wavelength | 13.5 nm |
| Spectral Bandwidth (FWHM) | ~1 nm |
| Power Output (2π, 2% BW @ 13.5 nm) | ≤20 µW |
| Long-Term Intensity Stability (72 h) | <1% RMS |
| Source Size (FWHM) | Adjustable from <10 µm to ≥100 µm |
| Vacuum Interface | DN 16 CF flange |
| Emission Cone | 30° full angle, centered on flange axis |
| Target Material | Solid-state (L2,3-transition optimized) |
| Operating Voltage/Current | Software-controlled |
| Compliance | Designed for UHV-compatible metrology environments |
| Brand | WEP |
|---|---|
| Origin | Germany |
| Model | CVP21 |
| Measurement Principle | Electrochemical Capacitance–Voltage (ECV) Profiling |
| Carrier Concentration Range | 1×10¹¹ to 1×10²¹ cm⁻³ |
| Depth Resolution | Down to ≤1 nm |
| Compatible Substrates | Conductive & insulating |
| Wafer Size Support | 4×2 mm² to 200 mm (8″) |
| Material Compatibility | Si, Ge, SiC, GaAs, InP, GaN, AlGaN, InGaN, AlInN, ZnO, CdTe, HgCdTe, and multicomponent III–V/II–VI compounds |
| Automation Level | Fully automated with real-time corrosion monitoring, dry-in/dry-out handling, and camera-assisted process control |
| Brand | WEP |
|---|---|
| Origin | Germany |
| Model | CVP21 |
| Measurement Principle | Electrochemical Capacitance–Voltage (ECV) Profiling |
| Carrier Concentration Range | 1×10¹¹ cm⁻³ to 1×10²¹ cm⁻³ |
| Depth Resolution | Down to ≤1 nm |
| Compatible Substrates | Conductive & insulating |
| Wafer Size Support | 4×2 mm² to 200 mm (8″) |
| Material Compatibility | Si, Ge, SiC, GaAs, InP, GaN, AlGaN, InGaN, AlInN, ZnO, CdTe, HgCdTe, and multicomponent III–V/II–VI compounds |
| Automation Level | Fully automated with real-time corrosion monitoring, auto-load/unload, dry-in/dry-out capability |
| Software | Integrated ECV Control Suite with GLP-compliant audit trail, measurement recipe management, and camera-assisted process visualization |
| Brand | Westech |
|---|---|
| Origin | USA |
| Model | 7476D |
| Bonding Angle Options | 45° & 90° (deep cavity) |
| Wire Diameter Range | 18–100 µm |
| Ribbon Dimensions | 0.0005 × 0.010 in or 0.001 × 0.010 in |
| Ultrasonic Power Output | 4 W |
| Bonding Force Control | Dual-range, programmable |
| Heating | Resistive tool heating |
| Motion Control | Direct-drive motor with programmable tail control |
| Platform | Adjustable height (0.625 in), 12 × 12 in |
| Display | LCD interface |
| ESD Protection | Standard |
| Deep Cavity Capability | ≥13 mm (1 in optional) |
| Software | Multi-device recipe storage |
| Compliance | ESD-safe architecture, designed for Class 100/ISO 5 cleanroom integration |
| Brand | WUXI CAS PHOTONICS INC |
|---|---|
| Origin | Sichuan, China |
| Model | URE-2000S/25A |
| Exposure Area | 6-inch wafer |
| Exposure Wavelength | 365 nm (i-line) |
| Irradiance | >25 mW/cm² |
| Resolution | 1 µm |
| Alignment Accuracy | ±2 µm (double-side, 0.8 mm substrate thickness), ±0.8 µm (single-side) |
| Illumination Uniformity | ≤2.5% (Φ100 mm), ≤4% (Φ150 mm) |
| Mask-to-Wafer Motion Range | X: ±5 mm, Y: ±5 mm, Θ: ±6° |
| Mercury Lamp | 350 W DC, imported (OSRAM) |
| Collimation Angle | 3.5° |
| Maximum Photoresist Thickness | 350 µm (SU-8, under specified process conditions) |
| Dimensions (L×W×H) | 1300 × 900 × 1800 mm |
| Brand | SUSS MicroTec |
|---|---|
| Origin | Germany |
| Model | XBS200 |
| Maximum Wafer Size | 200 mm |
| Bonding Force | up to 100 kN |
| Temperature Range | up to 550 °C |
| Vacuum Chamber Pressure Range | 5×10⁻⁵ mbar to 3 bar |
| Heating/Cooling Rate | up to 40 K/min (heating), up to 30 K/min (cooling) |
| Bonding Force Repeatability | < 2% |
| Temperature Uniformity | < 1% |
| Process Control | Programmable ramp/soak profiles with independent pressure, temperature, and force regulation |
| Brand | SUSS MicroTec |
|---|---|
| Origin | Germany |
| Model | XBS300 |
| Application | Temporary bonding for 200 mm and 300 mm wafers |
| Substrate Compatibility | Silicon, glass carrier substrates (same or different diameters) |
| Alignment Method | Edge recognition + center alignment with GYRSET® technology |
| Coating Uniformity | Optimized via integrated non-contact multi-point thickness measurement |
| Process Steps Supported | Release layer deposition, adhesive spin-coating, low-force wafer bonding, UV or thermal curing, post-bond cooling |
| Platform Architecture | Modular, scalable throughput, minimized footprint |
| Adhesive Compatibility | Open platform supporting all commercially available temporary bonding adhesives |
| Compliance Context | Designed for semiconductor mask & reticle manufacturing environments compliant with ISO 14644-1 Class 5 cleanroom requirements and compatible with GLP/GMP-aligned process documentation workflows |
| Origin | Sichuan, China |
|---|---|
| Manufacturer Type | Authorized Distributor |
| Origin Category | Domestic (China) |
| Model | G-33D4 |
| Pricing | Available Upon Request |
| Exposure Mode | Contact Printing |
| Resolution | 1 µm (at 10× line depth ratio) |
| Light Source | High-Stability 365 nm UV LED |
| Illumination Uniformity | ±3% |
| Exposure Area | 110 mm × 110 mm |
| UV Intensity Range | 0–30 mW/cm² (adjustable) |
| Beam Divergence | ≤3° |
| UV Source Lifetime | ≥20,000 hours |
| Operating Surface Temperature | ≤30 °C |
| Alignment Accuracy | ≤1 µm |
| Optical Magnification | 91× to 570× (software-enhanced digital zoom) |
| Control System | 4-inch PLC with OMRON timing relay (0.1–999.9 s exposure) |
| Vacuum System | Direct-coupled vacuum pump with dual-stage anti-vibration isolation |
| Microscopy | Dual-field upright or horizontal stereo microscope with four 1/3″ CCD cameras and real-time imaging memory |
| Brand | XinSheng Technology |
|---|---|
| Origin | Shanghai, China |
| Manufacturer Type | Authorized Distributor |
| Regional Classification | Domestic (PRC) |
| Model | XSM-FA100 |
| Pricing | Available Upon Request |
| Brand | YXLON International GmbH |
|---|---|
| Origin | Germany |
| Model | CC Series |
| Cooling Option | Optional Water-Cooled FXT 160.51 X-ray Tube |
| Detector Modes | Standard & Low-Dose Mode |
| Software Suite | micro3Dslice, FF CT, VoidInspect, eHDR Dynamic Enhancement Filters |
| Load Capacity (Optional) | < 20 kg |
| Voltage Range | Optimized for Low-Voltage High-Resolution Imaging (≤ 160 kV) |
| Compliance | Designed for ISO/IEC 17025-aligned QA workflows, supports GLP/GMP audit trails via software logging |
| Brand | YXLON International GmbH |
|---|---|
| Origin | Germany |
| Model | FF Series |
| Operating Voltage | Up to 600 kV |
| Detector | 3-Line Detector Array (LDA) with 254 µm pixel pitch |
| Dynamic Range | High |
| Signal-to-Noise Ratio | Exceptional |
| Scan Modes | 2D, 3D, Helical (HeliExtend), Field-of-View Extension (Horizontal/Vertical), Virtual Rotation Axis |
| Image Enhancement | ScatterFix 2.0, Beam Hardening Correction (BHC), Metal Artifact Reduction (MAR) |
| Applications | R&D material analysis, dimensional metrology, failure analysis, assembly verification, digital dissection |
| Sample Compatibility | Aluminum, steel, superalloys, AM parts, Li-ion battery cells/modules/systems, CFRP, injection-molded plastics, cultural heritage objects, geological/paleontological/biological specimens, mechatronic assemblies |
| Brand | ZEISS |
|---|---|
| Origin | Germany |
| Model | Sigma 360 |
| Wafer Handling | Full 200 mm (8-inch) diameter |
| Imaging Mode | Field Emission Scanning Electron Microscopy (FE-SEM) |
| Primary Application | Semiconductor Process Defect Inspection & CD Metrology |
| Vacuum System | Differential pumping with cold trap |
| Stage Type | Motorized polar-coordinate stage with collision-avoidance logic |
| Detector Configuration | In-lens EsB, SE2, and STEM-in-SEM options |
| Operating Voltage Range | 0.1–30 kV |
| Resolution | ≤1.0 nm @ 1 kV (in-lens SE mode) |
| Software Platform | SmartSEM Engineering Edition with wafer map navigation and recipe-driven automation |
| Brand | ZENO |
|---|---|
| Model | QUASAR-S Series |
| Application | In-line optical metrology for semiconductor wafer fabrication |
| Wafer Sizes | 150 mm (6″), 200 mm (8″), 300 mm (12″) |
| Measurement Principle | Spectroscopic Ellipsometry (SE) and Spectral Reflectometry (SR) |
| Spectral Range | UV–Vis–NIR (e.g., 190–1700 nm) |
| Thickness Resolution | ≤ 0.005 nm (3σ) |
| Throughput | Up to 120 wafers/hour |
| Sample Interfaces | Open cassette, SMIF pod, FOUP |
| Measurement Capabilities | Single-layer & multi-layer film thickness, refractive index (n), extinction coefficient (k), patterned & unpatterned wafer alignment, waferless recipe setup |
| Compliance | Designed for integration into ISO Class 1–5 cleanroom environments |
| Software | ZENO MetroSuite™ with audit trail, user access control, and 21 CFR Part 11–compliant electronic records |
| Brand | ZENO |
|---|---|
| Model | R100 |
| Origin | Shanghai, China |
| Type | Benchtop Spectral Reflectometer |
| Measurement Principle | Broadband Spectral Reflectance Analysis (350–1000 nm) |
| Sample Compatibility | 4–8 inch wafers, square substrates, irregular shapes |
| Measurable Parameters | Film Thickness, Refractive Index (n), Extinction Coefficient (k), Reflectance (R) |
| Repeatability | ≤±0.15 nm (for 500 nm SiO₂ on Si, n=30) |
| Optical Spot Size | Standard 2 mm Ø |
| Software | ZENO-Metro v4.x with GLP-compliant audit trail, data export (CSV, XML), and ASTM E2372-22 compliant reporting |
| Compliance | ISO/IEC 17025-ready workflow architecture, supports FDA 21 CFR Part 11 electronic signature configuration |
| Brand | ZEPTOOLS |
|---|---|
| Origin | Guangdong, China |
| Manufacturer Type | OEM Manufacturer |
| Product Category | Domestic |
| Model | SEM Nano-Probe Station |
| Pricing | Upon Request |
| XYZ Travel Range | ±10 mm |
| Fine-Adjustment Resolution | 0.5 nm |
| Sample Stage Flatness | 10 µm |
| Total Probe Station Mass | 225 g |
| Max. Translation Speed | 3 mm/s |
| Motion Guidance | Zero-Gap Flexure Hinge System |
| Actuation | Piezoelectric Ceramic Positioning Stages |
| Optional Modules | Cryogenic Stage, High-Temperature Stage, Fiber Optic Feedthrough & Clamp, EBIC Kit |
| Brand | ZEPTOOLS |
|---|---|
| Origin | Guangdong, China |
| Manufacturer Type | Original Equipment Manufacturer (OEM) |
| Country of Origin | China |
| Model | ZEL304G |
| Pricing | Available upon request |
| Electron Source | Schottky field-emission gun |
| Acceleration Voltage | 20 V–30 kV |
| Image Resolution | ≤1 nm @ 15 kV, ≤1.5 nm @ 1 kV |
| Minimum Beam Spot Size | ≤2 nm |
| Beam Current | ≥100 nA |
| Beam Current Density | >7000 A/cm² |
| Beam Blanking Rise Time | <100 ns |
| Writing Field | ≥500 × 500 µm |
| Minimum Single-Exposure Line Width | <15 nm |
| Stage Travel | ≥105 mm |
| Stitching Accuracy | <50 nm (mean + 1σ) |
| Overlay Accuracy | <50 nm (mean + 1σ) |
| Scan Rate | ≥20 MHz (standard), up to 50 MHz (max) |
| D/A Resolution | 20-bit |
| Dwell Time Increment | 10 ns |
| Supported File Formats | GDSII, DXF, BMP |
| Scan Modes | Raster (Z-scan), serpentine (S-scan), spiral vector scanning |
| Exposure Modes | Field calibration, field stitching, multi-layer overlay, auto-exposure sequencing |
| Optional Features | Proximity effect correction (PEC), laser interferometric stage, Faraday cup beam current monitor, TTL-compatible beam blanking (5 V), external I/O for synchronized stage motion, beam blanking, SE detection, and scan control |
| Brand | ZEPTOOLS |
|---|---|
| Origin | Guangdong, China |
| Manufacturer Type | Original Equipment Manufacturer (OEM) |
| Country of Origin | China |
| Model | ZML10A |
| Light Source | High-Intensity LED @ 405 nm |
| Uniformity | 96% |
| Minimum Achievable Feature Size | 0.5 µm |
| Exposure Field Size | 1.2 × 0.9 mm² (at 10× objective) |
| Brand | Zhengye |
|---|---|
| Origin | Guangdong, China |
| Manufacturer Type | OEM/ODM Manufacturer |
| Country of Origin | China |
| Model | XG Series |
| Price Range | USD 70,000 – 112,000 |
| Brand | ZhiCheng |
|---|---|
| Origin | Imported |
| Manufacturer Type | Authorized Distributor |
| Model | Customized-3 |
| Wafer Size | 150 mm – 300 mm |
| Uniformity Performance | Within-Wafer (WiW) ≤ 5%, Within-Lot (WtW) ≤ 5%, Run-to-Run (RtR) ≤ 5% |
| Configuration | Up to 3 Loadports, Up to 24 Plating Chambers (Cu, Ni, Sn/Ag, Au), Up to 4 Pre-wet Chambers, Up to 4 Rinse Chambers |
| Chamber Architecture | Horizontal, Cross-Contamination-Free |
| Maintenance Design | Modular |
| Sealing Technology | Elastomeric Gasket Sealing |
| Electrode Isolation | Anode-Cathode Separation for Electrolyte Stability |
| Brand | Zhipure |
|---|---|
| Model | Customized-2 |
| Equipment Type | Batch Wet Processing System |
| Wafer Diameter | 100 mm – 300 mm |
| Cleaning Method | Liquid-phase Chemical Processing |
| Core Process Controls | Temperature Control, Chemical Concentration Control, Flow Rate Control, Pressure Control |
| Supported Processes | RCA Standard Clean, Photoresist Strip (Wet), Dielectric Layer Wet Etch (e.g., SiO₂, Si₃N₄), Metal Layer Wet Etch (e.g., Al, Ti, Cu), Pre-furnace Cleaning |
| Etch Uniformity | ≤4% intra-wafer, ≤4% inter-wafer, ≤4% batch-to-batch |
| Particle Additivity | <30 particles @ 0.09 µm (tested on thermally grown SiO₂ film |
| Metallic Contamination | <5 × 10⁹ atoms/cm² |
| Safety & Automation | Over-temperature protection per tank, leak detection sensors per process module, chemical recovery capability, Marangoni drying or spin-dry integration, automated acid replacement, auto-replenishment and formulation, SECS/GEM compliance |
| Brand | Zhuochi |
|---|---|
| Origin | Zhejiang, China |
| Manufacturer Type | Authorized Distributor |
| Regional Category | Domestic (PRC) |
| Model | KSX3-5-1200 |
| Instrument Type | High-Vacuum Rapid Annealing Furnace |
| Chamber Dimensions | 300 × 300 × 300 mm (L×W×H) |
| External Dimensions | 620 × 660 × 920 mm |
| Temperature Range | Ambient to 1200 °C |
| Max. Heating Rate | ≤50 °C/min |
| Cooling Rate | ≤20 °C/min |
| Temperature Uniformity | ±1 °C |
| Display Resolution | 1 °C |
| Heating Element | High-Temperature Resistance Wire |
| Insulation | Lightweight Refractory Fiber Board + Insulating Bricks & Ceramic Fiber Blanket |
| Thermocouple Type | K-Type |
| Power Supply | 220 V, 50 Hz |
| Total Power | 5 kW |
| Vacuum Capability | Integrated High-Vacuum System (User-Provided Pump Required) |
| Atmosphere Options | Inert Gas (N₂, Ar) or Reducing/Neutral Mixtures via Dual-Valve Gas Inlet/Outlet |
| Cooling Interface | Water-Cooled Flange with External Chiller Connection (Low-Temp Circulator Recommended) |
| Brand | ZKWN |
|---|---|
| Origin | Beijing, China |
| Model | GEST-20042 |
| Compliance Standards | GB/T 20042.7–2014, GB/T 20042.6–2011 |
| Measurement Modes | Through-plane (2-probe) and In-plane (4-probe) resistivity |
| Electrode Configuration | 50 mm gold-plated electrodes |
| Control Interface | 10-inch industrial touchscreen HMI |
| Test Automation | Fully automated pressure application, data acquisition, and post-test reset |
| Data Output | Real-time display and export of pressure, compressive strain, voltage, current, resistance, resistivity (mΩ·cm, Ω·cm, μΩ·m), conductivity (S/m, % IACS), and derived metrics (e.g., ΔR%, gradient-wise differential analysis) |
| Brand | ZKWN |
|---|---|
| Model | ZKGEST-125 |
| Measurement Principle | Four-Terminal DC Voltage-Current Method (Constant Current Source + High-Impedance Voltmeter) |
| Resistivity Range | 10⁻⁴ – 10⁵ Ω·cm |
| Resolution | 10⁻⁶ Ω·cm |
| Resistance Range (two-terminal mode) | 10⁻⁴ – 2×10⁵ Ω |
| Resistance Resolution | 1 µΩ |
| Voltage Ranges | 2 mV / 20 mV / 200 mV / 2 V |
| Voltage Accuracy | ±(0.5% rdg + 8 digits) at 2 mA range |
| Constant Current Outputs | 10 µA, 100 µA, 1 mA, 10 mA, 100 mA |
| Current Accuracy | ±(0.5% rdg + 2 digits) |
| Electrode Contact Width | 5 mm |
| Electrode Contact Force | 0.6 N |
| Sample Dimensions | (10 ± 0.2) mm width × (70–150) mm length × (3–4) mm thickness (thickness variation ≤ 5% of mean) |
| Power Supply | 220 V ±10%, 50/60 Hz, <50 W |
| Brand | ZOLIX |
|---|---|
| Origin | Beijing, China |
| Manufacturer Type | OEM Manufacturer |
| Country of Origin | China |
| Model | DSR300-DUV |
| Pricing | Upon Request |
| Brand | ZOLIX |
|---|---|
| Origin | Beijing, China |
| Manufacturer Type | Original Equipment Manufacturer (OEM) |
| Country of Origin | China |
| Model | OminFluo990-DUV |
| Pricing | Upon Request |
| Brand | ZOLIX |
|---|---|
| Origin | Beijing, China |
| Manufacturer Type | Original Equipment Manufacturer (OEM) |
| Product Category | Optical Defect Inspection System for Semiconductor Wafers |
| Model | SPM300 |
| Excitation Wavelength | 532 nm (standard), 275 nm UV optional |
| Laser Power | 50 mW |
| Autofocus Precision | < 0.2 µm |
| Spatial Resolution | < 2 µm |
| Raman Shift Range | 80–9000 cm⁻¹ |
| Spectral Resolution | < 2.0 cm⁻¹ |
| Mapping Scan Area | > 300 × 300 mm² |
| Minimum Step Size | 1 µm |
| Compatible Wafer Sizes | 2", 4", 6", 8" (12" customizable) |
| Objective | 100× semi-apochromatic |
| Detection Mode | Confocal Raman + PL + Fluorescence Lifetime (TCSPC) |
| Software Compliance | Supports ASTM E2912, ISO/IEC 17025 workflows, GLP/GMP audit trail logging per FDA 21 CFR Part 11 requirements |