Semiconductor Instruments
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| Brand | Zhipure |
|---|---|
| Model | Customized-2 |
| Equipment Type | Batch Wet Processing System |
| Wafer Diameter | 100 mm – 300 mm |
| Cleaning Method | Liquid-phase Chemical Processing |
| Core Process Controls | Temperature Control, Chemical Concentration Control, Flow Rate Control, Pressure Control |
| Supported Processes | RCA Standard Clean, Photoresist Strip (Wet), Dielectric Layer Wet Etch (e.g., SiO₂, Si₃N₄), Metal Layer Wet Etch (e.g., Al, Ti, Cu), Pre-furnace Cleaning |
| Etch Uniformity | ≤4% intra-wafer, ≤4% inter-wafer, ≤4% batch-to-batch |
| Particle Additivity | <30 particles @ 0.09 µm (tested on thermally grown SiO₂ film |
| Metallic Contamination | <5 × 10⁹ atoms/cm² |
| Safety & Automation | Over-temperature protection per tank, leak detection sensors per process module, chemical recovery capability, Marangoni drying or spin-dry integration, automated acid replacement, auto-replenishment and formulation, SECS/GEM compliance |
| Brand | Zhonghuan Furnace |
|---|---|
| Origin | Tianjin, China |
| Model | 1200°C Sliding-Stage CVD System |
| Heating Zone | Single or Multi-Zone Optional |
| Max Operating Temperature | 1200°C |
| Sliding Mechanism | Manual or Motorized with Position Limit Switches |
| Cooling Method | Integrated Forced-Air Quenching System |
| Gas Control | Multi-Channel Mass Flow Controller (MFC) System |
| Vacuum Capability | Medium-Vacuum (10⁻¹–10⁻³ Pa) or High-Vacuum (≤5×10⁻⁵ Pa) Configurable |
| Temperature Control Algorithm | Fuzzy PID Programmable Logic Controller |
| Vacuum Interface | Custom Quick-Connect Flange Assembly |
| Compliance | Designed for ISO/IEC 17025-aligned lab environments |
| Brand | Zhonghuan Furnace |
|---|---|
| Origin | Tianjin, China |
| Model | CVD-12II-3Z/G |
| Max Temperature | 1200°C |
| Heating Zone | Dual-zone |
| Tube Diameter | Φ50/Φ60/Φ80 mm or Φ80/Φ100 mm |
| Heating Length | 420 mm / 600 mm |
| Uniform Zone Length | 280 mm / 390 mm |
| Rated Power | 3.2 kW / 4.8 kW |
| Voltage | 220 V AC |
| Temp Control | 50-segment programmable PID controller, ±1°C accuracy |
| Gas Channels | 3 (expandable) |
| Mass Flow Range | 0–500 sccm (N₂-calibrated, ±1% F.S.) |
| Response Time | ≤4 s |
| Inlet Pressure | 0.05–0.3 MPa (gauge) |
| Vacuum System | High-vacuum option with turbomolecular pump (1200 L/s or 1600 L/s, base pressure ≤5×10⁻⁶ Pa) |
| Connection | KF-flanged stainless steel bellows, manual high-vacuum gate valve, digital vacuum gauge |
| Overall Dimensions (w/o HV) | 530 × 1440 × 750 mm |
| Weight | 330 kg |
| Brand | Zhonghuan Furnace |
|---|---|
| Origin | Tianjin, China |
| Model | CVD-12II6SH-3Z (Dual-Zone) / CVD-12III9SH-3Z (Triple-Zone) |
| Max Temperature | 1200 °C |
| Heating Zone Length | 610 mm / 940 mm |
| Uniform Temperature Zone | 400 mm / 700 mm |
| Quartz Tube ID/OD | Φ80 mm / Φ100 mm |
| Rated Power | 4.8 kW / 7.2 kW |
| Voltage | 220 V / 380 V (3-phase) |
| Sliding Stroke | 485 mm / 650 mm |
| Sliding Mode | Manual or Motorized (Temperature-Programmed Auto-Translation) |
| Temperature Control | 50-Stage Programmable PID Controller, ±1 °C Accuracy |
| Gas Channels | Up to 3 Mass Flow Controlled Lines (0–500 sccm, N₂-calibrated, ±1% F.S.) |
| Vacuum System Options | Medium Vacuum (1×10⁻¹–1×10⁻³ Pa) or High Vacuum (1×10⁻³–1×10⁻¹ Pa |
| Sealing | Dual-Knurled KF Flanges with Multi-Ring Dynamic Seal Architecture |
| Cooling | Integrated Forced-Air Quenching System for Rapid Post-Process Thermal Extraction |
| Brand | Zhuochi |
|---|---|
| Origin | Zhejiang, China |
| Model | KSX3-5-12 |
| Instrument Type | Standard Vacuum Rapid Thermal Annealing Furnace |
| Sample Chamber Dimensions | 300 × 300 × 300 mm (L×W×H) |
| External Dimensions | 620 × 660 × 920 mm |
| Temperature Range | Ambient to 1200 °C |
| Max. Heating Rate | ≤50 °C/min |
| Cooling Rate | ≤20 °C/min |
| Temperature Uniformity | ±1 °C |
| Display Resolution | 1 °C |
| Heating Element | High-Temperature Resistance Wire |
| Insulation | Lightweight Refractory Fiber Board + Insulating Bricks & Ceramic Fiber Blanket |
| Thermocouple Type | K-Type |
| Power Supply | 220 V, 50 Hz |
| Total Power | 5 kW |
| Cooling Method | Water-Cooled Flange with External Chiller Interface |
| Atmosphere Options | Vacuum (≤10⁻² Pa) or Inert Gas (N₂, Ar, forming gas) via Dual-Valve Inlet/Outlet Ports |
| Safety | Dual-Stage Over-Temperature Protection, LTDE Programmable Controller (50-Step Ramp-Soak Profile) |
| Brand | Zhuochi |
|---|---|
| Origin | Zhejiang, China |
| Manufacturer Type | Authorized Distributor |
| Regional Category | Domestic (PRC) |
| Model | KSX3-5-1200 |
| Instrument Type | High-Vacuum Rapid Annealing Furnace |
| Chamber Dimensions | 300 × 300 × 300 mm (L×W×H) |
| External Dimensions | 620 × 660 × 920 mm |
| Temperature Range | Ambient to 1200 °C |
| Max. Heating Rate | ≤50 °C/min |
| Cooling Rate | ≤20 °C/min |
| Temperature Uniformity | ±1 °C |
| Display Resolution | 1 °C |
| Heating Element | High-Temperature Resistance Wire |
| Insulation | Lightweight Refractory Fiber Board + Insulating Bricks & Ceramic Fiber Blanket |
| Thermocouple Type | K-Type |
| Power Supply | 220 V, 50 Hz |
| Total Power | 5 kW |
| Vacuum Capability | Integrated High-Vacuum System (User-Provided Pump Required) |
| Atmosphere Options | Inert Gas (N₂, Ar) or Reducing/Neutral Mixtures via Dual-Valve Gas Inlet/Outlet |
| Cooling Interface | Water-Cooled Flange with External Chiller Connection (Low-Temp Circulator Recommended) |
| Brand | ZKWN |
|---|---|
| Origin | Beijing, China |
| Model | GEST-20042 |
| Compliance Standards | GB/T 20042.7–2014, GB/T 20042.6–2011 |
| Measurement Modes | Through-plane (2-probe) and In-plane (4-probe) resistivity |
| Electrode Configuration | 50 mm gold-plated electrodes |
| Control Interface | 10-inch industrial touchscreen HMI |
| Test Automation | Fully automated pressure application, data acquisition, and post-test reset |
| Data Output | Real-time display and export of pressure, compressive strain, voltage, current, resistance, resistivity (mΩ·cm, Ω·cm, μΩ·m), conductivity (S/m, % IACS), and derived metrics (e.g., ΔR%, gradient-wise differential analysis) |
| Brand | ZKWN |
|---|---|
| Model | ZKGEST-125 |
| Measurement Principle | Four-Terminal DC Voltage-Current Method (Constant Current Source + High-Impedance Voltmeter) |
| Resistivity Range | 10⁻⁴ – 10⁵ Ω·cm |
| Resolution | 10⁻⁶ Ω·cm |
| Resistance Range (two-terminal mode) | 10⁻⁴ – 2×10⁵ Ω |
| Resistance Resolution | 1 µΩ |
| Voltage Ranges | 2 mV / 20 mV / 200 mV / 2 V |
| Voltage Accuracy | ±(0.5% rdg + 8 digits) at 2 mA range |
| Constant Current Outputs | 10 µA, 100 µA, 1 mA, 10 mA, 100 mA |
| Current Accuracy | ±(0.5% rdg + 2 digits) |
| Electrode Contact Width | 5 mm |
| Electrode Contact Force | 0.6 N |
| Sample Dimensions | (10 ± 0.2) mm width × (70–150) mm length × (3–4) mm thickness (thickness variation ≤ 5% of mean) |
| Power Supply | 220 V ±10%, 50/60 Hz, <50 W |
| Brand | ZOLIX |
|---|---|
| Origin | Beijing, China |
| Manufacturer Type | OEM Manufacturer |
| Country of Origin | China |
| Model | DSR300-DUV |
| Pricing | Upon Request |
| Brand | ZOLIX |
|---|---|
| Origin | Beijing, China |
| Manufacturer Type | Original Equipment Manufacturer (OEM) |
| Country of Origin | China |
| Model | OminFluo990-DUV |
| Pricing | Upon Request |
| Brand | ZOLIX |
|---|---|
| Origin | Beijing, China |
| Manufacturer Type | Original Equipment Manufacturer (OEM) |
| Product Category | Optical Defect Inspection System for Semiconductor Wafers |
| Model | SPM300 |
| Excitation Wavelength | 532 nm (standard), 275 nm UV optional |
| Laser Power | 50 mW |
| Autofocus Precision | < 0.2 µm |
| Spatial Resolution | < 2 µm |
| Raman Shift Range | 80–9000 cm⁻¹ |
| Spectral Resolution | < 2.0 cm⁻¹ |
| Mapping Scan Area | > 300 × 300 mm² |
| Minimum Step Size | 1 µm |
| Compatible Wafer Sizes | 2", 4", 6", 8" (12" customizable) |
| Objective | 100× semi-apochromatic |
| Detection Mode | Confocal Raman + PL + Fluorescence Lifetime (TCSPC) |
| Software Compliance | Supports ASTM E2912, ISO/IEC 17025 workflows, GLP/GMP audit trail logging per FDA 21 CFR Part 11 requirements |
| Brand | ZOLIX |
|---|---|
| Origin | Beijing, China |
| Manufacturer Type | Original Equipment Manufacturer (OEM) |
| Product Category | Optical Defect Inspection System for Semiconductor Wafers |
| Model | SPM900 |
| Instrument Type | Steady-State and Time-Resolved Photoluminescence (PL) Mapping System |
| Excitation Wavelengths | 213 nm, 266 nm, 375 nm, 405 nm |
| Autofocus Accuracy | < 0.2 µm |
| Scan Range | > 300 × 300 mm² |
| Minimum Spatial Resolution | 1 µm |
| Compatible Wafer Sizes | 2", 4", 6", 8" (12" optional) |
| Objective Lenses | UV (5×), NUV (20×/100×), Visible (20×/50×/100×) |
| Spectrometer | 320 mm focal length, 1200 g/mm grating, spectral resolution ≤ 0.2 nm |
| PL Lifetime Range | 50 ps – 1 ms |
| Lifetime Precision | 8 ps |
| Detection Modes | Confocal steady-state PL, time-resolved PL (TRPL), fluorescence lifetime imaging (FLIM), Raman mapping, photocurrent mapping |