Semiconductor Instruments
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| Brand | SUSS MicroTec |
|---|---|
| Origin | Germany |
| Model | XBS300 |
| Application | Temporary bonding for 200 mm and 300 mm wafers |
| Substrate Compatibility | Silicon, glass carrier substrates (same or different diameters) |
| Alignment Method | Edge recognition + center alignment with GYRSET® technology |
| Coating Uniformity | Optimized via integrated non-contact multi-point thickness measurement |
| Process Steps Supported | Release layer deposition, adhesive spin-coating, low-force wafer bonding, UV or thermal curing, post-bond cooling |
| Platform Architecture | Modular, scalable throughput, minimized footprint |
| Adhesive Compatibility | Open platform supporting all commercially available temporary bonding adhesives |
| Compliance Context | Designed for semiconductor mask & reticle manufacturing environments compliant with ISO 14644-1 Class 5 cleanroom requirements and compatible with GLP/GMP-aligned process documentation workflows |
| Origin | Sichuan, China |
|---|---|
| Manufacturer Type | Authorized Distributor |
| Origin Category | Domestic (China) |
| Model | G-33D4 |
| Pricing | Available Upon Request |
| Exposure Mode | Contact Printing |
| Resolution | 1 µm (at 10× line depth ratio) |
| Light Source | High-Stability 365 nm UV LED |
| Illumination Uniformity | ±3% |
| Exposure Area | 110 mm × 110 mm |
| UV Intensity Range | 0–30 mW/cm² (adjustable) |
| Beam Divergence | ≤3° |
| UV Source Lifetime | ≥20,000 hours |
| Operating Surface Temperature | ≤30 °C |
| Alignment Accuracy | ≤1 µm |
| Optical Magnification | 91× to 570× (software-enhanced digital zoom) |
| Control System | 4-inch PLC with OMRON timing relay (0.1–999.9 s exposure) |
| Vacuum System | Direct-coupled vacuum pump with dual-stage anti-vibration isolation |
| Microscopy | Dual-field upright or horizontal stereo microscope with four 1/3″ CCD cameras and real-time imaging memory |
| Brand | XinSheng Technology |
|---|---|
| Origin | Shanghai, China |
| Manufacturer Type | Authorized Distributor |
| Regional Classification | Domestic (PRC) |
| Model | XSM-FA100 |
| Pricing | Available Upon Request |
| Brand | YCT |
|---|---|
| Origin | Taiwan |
| Model | WM5100 |
| Application | Semiconductor Wire Bonding Process Inspection |
| Sample Handling | Vacuum Chuck Platform |
| Software | QX3000 Metrology Suite |
| Compliance | Supports SECS/GEM Interface |
| User Interface | Bilingual (English & Chinese) |
| Measurement Automation | CAD-based Program Import, Auto-Focus, Pass/Fail Thresholding, Audit-Trail Enabled Reporting |
| Brand | YXLON International GmbH |
|---|---|
| Origin | Germany |
| Model | CC Series |
| Cooling Option | Optional Water-Cooled FXT 160.51 X-ray Tube |
| Detector Modes | Standard & Low-Dose Mode |
| Software Suite | micro3Dslice, FF CT, VoidInspect, eHDR Dynamic Enhancement Filters |
| Load Capacity (Optional) | < 20 kg |
| Voltage Range | Optimized for Low-Voltage High-Resolution Imaging (≤ 160 kV) |
| Compliance | Designed for ISO/IEC 17025-aligned QA workflows, supports GLP/GMP audit trails via software logging |
| Brand | YXLON International GmbH |
|---|---|
| Origin | Germany |
| Model | FF Series |
| Operating Voltage | Up to 600 kV |
| Detector | 3-Line Detector Array (LDA) with 254 µm pixel pitch |
| Dynamic Range | High |
| Signal-to-Noise Ratio | Exceptional |
| Scan Modes | 2D, 3D, Helical (HeliExtend), Field-of-View Extension (Horizontal/Vertical), Virtual Rotation Axis |
| Image Enhancement | ScatterFix 2.0, Beam Hardening Correction (BHC), Metal Artifact Reduction (MAR) |
| Applications | R&D material analysis, dimensional metrology, failure analysis, assembly verification, digital dissection |
| Sample Compatibility | Aluminum, steel, superalloys, AM parts, Li-ion battery cells/modules/systems, CFRP, injection-molded plastics, cultural heritage objects, geological/paleontological/biological specimens, mechatronic assemblies |
| Brand | ZOCHI |
|---|---|
| Origin | Zhejiang, China |
| Model | ZC-K740 |
| Instrument Type | Non-Vacuum Rapid Thermal Annealing Furnace |
| Sample Dimensions | 1.2 m × 1.5 m (max. loading footprint) |
| Temperature Range | 300–1000 °C |
| Max. Heating Rate | 30 °C/min |
| Cooling Rate | 20 °C/s |
| Temperature Uniformity | ±1 °C across heated zone |
| Heating Configuration | 6 independently controlled zones |
| Heated Zone Diameter | 740 mm |
| Chamber Inlet/Outlet Diameter | 630 mm |
| Heated Zone Length | 450 mm |
| Internal Cavity Dimensions | Ø630 mm × 550 mm |
| Heating Element | Insulated quartz tube heaters |
| Display Resolution | 1 °C |
| Safety Certification | Explosion-proof control cabinet (IEC 60079-compliant enclosure design) |
| Brand | ZEISS |
|---|---|
| Origin | Germany |
| Model | Sigma 360 |
| Wafer Handling | Full 200 mm (8-inch) diameter |
| Imaging Mode | Field Emission Scanning Electron Microscopy (FE-SEM) |
| Primary Application | Semiconductor Process Defect Inspection & CD Metrology |
| Vacuum System | Differential pumping with cold trap |
| Stage Type | Motorized polar-coordinate stage with collision-avoidance logic |
| Detector Configuration | In-lens EsB, SE2, and STEM-in-SEM options |
| Operating Voltage Range | 0.1–30 kV |
| Resolution | ≤1.0 nm @ 1 kV (in-lens SE mode) |
| Software Platform | SmartSEM Engineering Edition with wafer map navigation and recipe-driven automation |
| Brand | ZENO |
|---|---|
| Model | QUASAR-S Series |
| Application | In-line optical metrology for semiconductor wafer fabrication |
| Wafer Sizes | 150 mm (6″), 200 mm (8″), 300 mm (12″) |
| Measurement Principle | Spectroscopic Ellipsometry (SE) and Spectral Reflectometry (SR) |
| Spectral Range | UV–Vis–NIR (e.g., 190–1700 nm) |
| Thickness Resolution | ≤ 0.005 nm (3σ) |
| Throughput | Up to 120 wafers/hour |
| Sample Interfaces | Open cassette, SMIF pod, FOUP |
| Measurement Capabilities | Single-layer & multi-layer film thickness, refractive index (n), extinction coefficient (k), patterned & unpatterned wafer alignment, waferless recipe setup |
| Compliance | Designed for integration into ISO Class 1–5 cleanroom environments |
| Software | ZENO MetroSuite™ with audit trail, user access control, and 21 CFR Part 11–compliant electronic records |
| Brand | ZENO |
|---|---|
| Model | R100 |
| Origin | Shanghai, China |
| Type | Benchtop Spectral Reflectometer |
| Measurement Principle | Broadband Spectral Reflectance Analysis (350–1000 nm) |
| Sample Compatibility | 4–8 inch wafers, square substrates, irregular shapes |
| Measurable Parameters | Film Thickness, Refractive Index (n), Extinction Coefficient (k), Reflectance (R) |
| Repeatability | ≤±0.15 nm (for 500 nm SiO₂ on Si, n=30) |
| Optical Spot Size | Standard 2 mm Ø |
| Software | ZENO-Metro v4.x with GLP-compliant audit trail, data export (CSV, XML), and ASTM E2372-22 compliant reporting |
| Compliance | ISO/IEC 17025-ready workflow architecture, supports FDA 21 CFR Part 11 electronic signature configuration |
| Brand | ZEPTOOLS |
|---|---|
| Origin | Guangdong, China |
| Manufacturer Type | OEM Manufacturer |
| Product Category | Domestic |
| Model | SEM Nano-Probe Station |
| Pricing | Upon Request |
| XYZ Travel Range | ±10 mm |
| Fine-Adjustment Resolution | 0.5 nm |
| Sample Stage Flatness | 10 µm |
| Total Probe Station Mass | 225 g |
| Max. Translation Speed | 3 mm/s |
| Motion Guidance | Zero-Gap Flexure Hinge System |
| Actuation | Piezoelectric Ceramic Positioning Stages |
| Optional Modules | Cryogenic Stage, High-Temperature Stage, Fiber Optic Feedthrough & Clamp, EBIC Kit |
| Brand | ZEPTOOLS |
|---|---|
| Origin | Guangdong, China |
| Manufacturer Type | Original Equipment Manufacturer (OEM) |
| Country of Origin | China |
| Model | ZEL304G |
| Pricing | Available upon request |
| Electron Source | Schottky field-emission gun |
| Acceleration Voltage | 20 V–30 kV |
| Image Resolution | ≤1 nm @ 15 kV, ≤1.5 nm @ 1 kV |
| Minimum Beam Spot Size | ≤2 nm |
| Beam Current | ≥100 nA |
| Beam Current Density | >7000 A/cm² |
| Beam Blanking Rise Time | <100 ns |
| Writing Field | ≥500 × 500 µm |
| Minimum Single-Exposure Line Width | <15 nm |
| Stage Travel | ≥105 mm |
| Stitching Accuracy | <50 nm (mean + 1σ) |
| Overlay Accuracy | <50 nm (mean + 1σ) |
| Scan Rate | ≥20 MHz (standard), up to 50 MHz (max) |
| D/A Resolution | 20-bit |
| Dwell Time Increment | 10 ns |
| Supported File Formats | GDSII, DXF, BMP |
| Scan Modes | Raster (Z-scan), serpentine (S-scan), spiral vector scanning |
| Exposure Modes | Field calibration, field stitching, multi-layer overlay, auto-exposure sequencing |
| Optional Features | Proximity effect correction (PEC), laser interferometric stage, Faraday cup beam current monitor, TTL-compatible beam blanking (5 V), external I/O for synchronized stage motion, beam blanking, SE detection, and scan control |
| Brand | ZEPTOOLS |
|---|---|
| Origin | Guangdong, China |
| Manufacturer Type | Original Equipment Manufacturer (OEM) |
| Country of Origin | China |
| Model | ZML10A |
| Light Source | High-Intensity LED @ 405 nm |
| Uniformity | 96% |
| Minimum Achievable Feature Size | 0.5 µm |
| Exposure Field Size | 1.2 × 0.9 mm² (at 10× objective) |
| Brand | Zhengye |
|---|---|
| Origin | Guangdong, China |
| Manufacturer Type | OEM/ODM Manufacturer |
| Regional Classification | Domestic (China) |
| Model | DUHANJI |
| Pricing | Upon Request |
| Brand | Zhengye |
|---|---|
| Origin | Guangdong, China |
| Manufacturer Type | Direct Manufacturer |
| Country of Origin | China |
| Model | Gunhan PW-SW35K–PW-SW150K |
| Rated Capacity | 35–150 kVA |
| Primary Voltage | 380 V AC |
| Welding Capability | 0.5+0.5 mm to 1.5+1.5 mm (steel/stainless steel) |
| Electrode Arm Length | 500 mm |
| Weld Wheel Stroke | 20–80 mm |
| Welding Speed | 1–3 m/min |
| Max Welding Pressure | 3,014–12,057 N |
| Cooling Water Flow | 500 L/h |
| Hydraulic Motor Power | 1.5 kW |
| Control System | Imported Microprocessor-Based Controller (US-sourced) |
| Thyristor | SEMIKRON (Germany) |
| Conductive Shaft Material | Imported Alloy with Automatic Wear Compensation |
| Conductive Interface | Sealed Oil-Immersed Silver Bushing Assembly |
| Surface Contact Ratio | ≥99% |
| Cooling Method | Internal Circulating Oil + Forced Water Cooling |
| Brand | Zhengye |
|---|---|
| Origin | Guangdong, China |
| Manufacturer Type | Direct Manufacturer |
| Country of Origin | China |
| Model | PY300D |
| Pricing | Upon Request |
| Positioning Accuracy | ±38 µm |
| Repeatability | ±5 µm |
| Print Resolution | 720 × 360 dpi to 1440 × 1440 dpi |
| Minimum Line Width | 75–100 µm |
| Minimum Character Height | 0.5 mm |
| Max Board Size | 730 mm × 621 mm (28″ × 24″) |
| Board Thickness Range | 0.1–6 mm (4–236 mil) |
| Footprint (L×W×H) | 2050 mm × 1650 mm × 1650 mm |
| Weight | 1450 kg |
| Nozzle Configuration | 1024i × 4 |
| Throughput (Mass Production Mode, 2-pass) | 150 panels/hour |
| Throughput (High-Accuracy Mode, 3-pass) | 120 panels/hour |
| UV Pre-Curing System | Integrated |
| Automation Options | Robotic Arm Loading/Unloading (with flip capability) or Vacuum Suction-Based Handling (no flip) |
| Brand | Zhengye |
|---|---|
| Origin | Guangdong, China |
| Manufacturer Type | OEM Manufacturer |
| Country of Origin | China |
| Model | DV-SCX1300 |
| Price Range | USD 70,000 – 112,000 |
| Tray Compatibility | 7", 11", 13" standard JEDEC trays |
| Throughput | ≤3 min per 7" tray (up to 3,000 pcs) |
| Radiation Safety | Compliant with IEC 61000-6-4, GBZ 126-2011, and ISO 15801 Class I interlocked enclosure design |
| Integration | AGV interface, SECS/GEM optional, MES/ERP data upload via OPC UA or RESTful API |
| Imaging System | Microfocus X-ray source (≤5 µm focal spot), flat-panel digital detector (≥12-bit dynamic range, 100 µm pixel pitch) |
| Motion Control | 4-axis robotic handler with ±0.02 mm repeatability |
| Software | Proprietary real-time image reconstruction and defect classification engine with audit trail, user-level access control, and 21 CFR Part 11–compliant electronic signature support |
| Brand | Zhengye |
|---|---|
| Origin | Guangdong, China |
| Manufacturer Type | OEM/ODM Manufacturer |
| Country of Origin | China |
| Model | DV-7/11/13 |
| Price Range | USD 112,000 – 140,000 |
| Brand | Zhengye |
|---|---|
| Model | XG5200D |
| X-Ray Tube Voltage | Up to 130 kV |
| X-Ray Tube Current | Up to 309 µA |
| Focal Spot Size | 5–7 µm |
| Imaging Mode | Time-Delay Integration (TDI) Line-Scan Detector |
| Repeatability Accuracy | ±60 µm |
| Throughput | ≥14 ppm |
| False Positive Rate | ≤2% |
| Miss Detection Rate | 0.0% |
| Radiation Leakage | ≤1 µSv/hr |
| Power Supply | AC 380 V / 50 Hz |
| Operating Temperature | 23 °C ±5 °C |
| Relative Humidity | ≤60% RH |
| Brand | Zhengye |
|---|---|
| Origin | Guangdong, China |
| Manufacturer Type | OEM/ODM Manufacturer |
| Country of Origin | China |
| Model | ZY-BI-2000 Series |
| Price Range | USD 112,000 – 140,000 |
| Brand | Zhengye |
|---|---|
| Origin | Guangdong, China |
| Manufacturer Type | Original Equipment Manufacturer (OEM) |
| Product Origin | Domestic (China) |
| Model | Zhengye X-Ray Inspection System |
| Pricing | Available Upon Request |
| Brand | Zhengye |
|---|---|
| Origin | Guangdong, China |
| Manufacturer Type | OEM/ODM Producer |
| Product Category | Domestic |
| Model | XIS-SEM Series |
| Pricing | Available Upon Request |
| Key | Brand: Zhengye |
|---|---|
| Origin | Guangdong, China |
| Manufacturer Type | OEM/ODM Manufacturer |
| Product Category | Domestic |
| Model | X-Ray Inspection System |
| Pricing | Upon Request |
| Brand | Zhengye |
|---|---|
| Origin | Guangdong, China |
| Manufacturer Type | OEM/ODM Manufacturer |
| Country of Origin | China |
| Model | XG Series |
| Price Range | USD 70,000 – 112,000 |
| Brand | Zhengye |
|---|---|
| Origin | Guangdong, China |
| Manufacturer Type | Direct Manufacturer |
| Country of Origin | China |
| Model | XG5010 X-ray |
| Pricing | Available Upon Request |
| Brand | Zhengye |
|---|---|
| Origin | Guangdong, China |
| Manufacturer Type | OEM/ODM Manufacturer |
| Country of Origin | China |
| Model | XG6000 |
| Pricing | Upon Request |
| Brand | Zhengye |
|---|---|
| Origin | Guangdong, China |
| Manufacturer Type | Original Equipment Manufacturer (OEM) |
| Regional Classification | Domestic (PRC) |
| Model | XK32 |
| Pricing | Available upon Request |
| Brand | Zhengye |
|---|---|
| Origin | Guangdong, China |
| Manufacturer Type | Manufacturer |
| Country of Origin | China |
| Model | ZX-LW |
| Pricing | Available Upon Request |
| Brand | Zhengye |
|---|---|
| Origin | Guangdong, China |
| Manufacturer Type | OEM/ODM Manufacturer |
| Country of Origin | China |
| Model | ZY-XRay |
| Pricing | Available Upon Request |
| Brand | ZhiCheng |
|---|---|
| Origin | Imported |
| Manufacturer Type | Authorized Distributor |
| Model | Customized-3 |
| Wafer Size | 150 mm – 300 mm |
| Uniformity Performance | Within-Wafer (WiW) ≤ 5%, Within-Lot (WtW) ≤ 5%, Run-to-Run (RtR) ≤ 5% |
| Configuration | Up to 3 Loadports, Up to 24 Plating Chambers (Cu, Ni, Sn/Ag, Au), Up to 4 Pre-wet Chambers, Up to 4 Rinse Chambers |
| Chamber Architecture | Horizontal, Cross-Contamination-Free |
| Maintenance Design | Modular |
| Sealing Technology | Elastomeric Gasket Sealing |
| Electrode Isolation | Anode-Cathode Separation for Electrolyte Stability |