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| Brand | ASTRO PLASMA |
|---|---|
| Origin | Singapore |
| Model | ASTRO PACTO-100 |
| Etching Principle | 2.45 GHz Microwave Plasma |
| Maximum Substrate Size | 300 × 400 mm |
| Application Scope | Pre-bonding cleaning, surface activation, organic/oxide removal, wafer-level packaging (WLP), PDMS bonding, leadframe and PCB cleaning |
| Brand | Enovate3D (West Lake Future Manufacturing) |
|---|---|
| Origin | Zhejiang, China |
| Manufacturer Type | Authorized Distributor |
| Product Origin | Domestic (China) |
| Model | EP400-FP |
| Pricing | Available Upon Request |
| Minimum Feature Size | 1–10 µm |
| Printing Technology | Direct Ink Writing (DIW) |
| Supported Dimensions | 2D, 2.5D, and True 3D Structures |
| Print Head Interface | Quick-Swap Modular Design |
| Multi-Material Capability | Yes |
| Optional Integrated Modules | Mechanical Micro-Drilling, Laser Ablation, In-Situ Laser Sintering |
| Compatible Material Classes | Conductive Metal Nanoparticle Inks, Functional Polymers, Dielectric Composites |
| Brand | SPS-POLOS |
|---|---|
| Origin | Germany |
| Manufacturer Type | Authorized Distributor |
| Category | Imported Instrument |
| Model | BEAM |
| Resolution | 0.8 µm (CD) |
| Light Source | Laser Galvanometer + 405 nm Laser Diode |
| Exposure Field | 150 mm × 150 mm |
| Substrate Compatibility | 4″–6″ wafers |
| Focus Actuation | Piezoelectric auto-focus with closed-loop optics (<1 s settling time) |
| Alignment | Semi-automatic multi-layer collimation (completed in minutes) |
| Compatible Resist | AZ5214E |
| Software Interface | GDSII-native GUI with wafer-level navigation, layer overlay, and CNC-style motion control |
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