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| Brand | Senbe |
|---|---|
| Model | T300S |
| Origin | Jiangsu, China |
| Manufacturer Type | Direct Manufacturer |
| Detector | Si-Pin Semiconductor |
| Measurable Elements | S (16) to U (92) |
| X-ray Tube Voltage | 0–50 kV (intelligent programmable HV system) |
| Collimator | Standard Φ0.5 mm |
| Optical Magnification | 30× (industrial CCD camera) |
| Energy Resolution | ≤129 eV ±5 eV |
| Analysis Layers | Up to 5 simultaneous layers |
| Analyzable Elements per Measurement | Up to 24 |
| Algorithm | Fundamental Parameters (FP) method |
| Signal Processing | Digital Multi-Channel Analyzer (MCA) technology |
| Chamber Dimensions | 268 × 307 × 97 mm |
| Overall Dimensions | 414 × 416 × 362 mm |
| Safety Systems | Multi-dimensional thermal dissipation + dual interlock radiation shielding + real-time hardware status monitoring |
| Brand | Senbe |
|---|---|
| Model | A650 |
| Type | Benchtop Energy-Dispersive X-ray Fluorescence (EDXRF) Spectrometer |
| Detector | Silicon Drift Detector (SDD), Resolution: 129 ± 5 eV |
| X-ray Tube | 50 W, 5–50 kV / 0–1000 µA |
| Measurable Elements | Na (11) to U (92) |
| Detection Limit | ppm-level |
| Quantification Range | 0.0001% – 99.99% (matrix-dependent) |
| Sample Form | Solid, Powder, Liquid |
| Vacuum Capability | Integrated Vacuum System for Light Element Enhancement (Mg, Al, Si, P, S) |
| Cooling | Peltier-based Electric Refrigeration |
| Safety | Triple-layer Radiation Shielding, Interlocked Sample Chamber, Real-time Beam Monitoring |
| Software | Proprietary EDXRF Analysis Suite with Fundamental Parameters (FP), Empirical Coefficient, and Matrix Correction Algorithms |
| Compliance | Designed to meet IEC 61000-6-3 (EMC), IEC 61000-6-4, and GB/T 18806–2002 (Chinese EDXRF Standard) |
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