- All
- Favorite
- Popular
- Most rated
| Brand | Chotest |
|---|---|
| Origin | Guangdong, China |
| Model | WD4000 |
| Thickness Range | 150 µm – 2000 µm |
| 3D Surface Topography Resolution (Z) | ≤ 0.1 nm |
| Roughness RMS Repeatability | ±0.005 nm |
| Supported Wafer Sizes | 4″, 6″, 8″, 12″ |
| Optical Principle | Spectral Confocal Dual-Side Scanning + White-Light Interferometry (WLI) |
| Max XY Travel | 400 mm × 400 mm |
| Z Travel | 75 mm |
| Scan Modes | Full-map, Cross (‘+’), Custom Multi-point |
| Interferometric Objective Options | 2.5×, 5×, 10×, 20×, 50× |
| Reflectivity Range | 0.05% – 100% |
| Film Thickness Range (IR Interferometry) | 37 µm – 1850 µm (n ≈ 1.5) |
| Minimum Detectable Film Thickness | 0.4 µm |
| Vacuum Chuck | ESD-Safe Perforated Ceramic Vacuum Stage |
| Brand | Chotest |
|---|---|
| Origin | Guangdong, China |
| Model | WD4000 |
| Measurement Principles | Spectral Confocal Reflectometry (thickness), White-Light Interferometry (3D topography) |
| Wafer Compatibility | 4″–12″ |
| Max. Scan Area | 400 mm × 400 mm |
| Z-Axis Resolution | ≤ 0.1 nm |
| Thickness Range | 150 µm – 2000 µm |
| Surface Reflectivity Range | 0.05% – 100% |
| Roughness RMS Repeatability | ±0.005 nm |
| Motion Stage | Granite-based龙门 with AC servo direct-drive & 0.1 µm encoder resolution |
| Environmental Isolation | Active vibration damping for sub-nm stability |
| Brand | Chotest |
|---|---|
| Origin | Guangdong, China |
| Manufacturer Type | Authorized Distributor |
| Country of Origin | China |
| Model | WD4000 |
| Price | USD 420,000 (FOB Shenzhen) |
| Thickness Range | 150 µm – 2000 µm |
| TTV/Bow/Warp Measurement Accuracy | ±0.1 µm (typical, calibrated per ISO 21287) |
| Z-Axis Resolution (Interferometry) | ≤ 0.1 nm |
| Lateral Scan Area | 400 mm × 400 mm |
| Vertical Travel | 75 mm |
| Maximum Wafer Size | 300 mm (12″) |
| Surface Reflectivity Range | 0.05% – 100% |
| Roughness RMS Repeatability | ≤ 0.005 nm (ISO 25178-6 compliant) |
| Interferometric Objective Options | 2.5×, 5×, 10×, 20×, 50× |
| Spectral Confocal Thickness Sensor | Dual-beam, high-stability SLED source, 90 µm measurement range (n = 1.5), minimum detectable thickness: 0.4 µm |
| Infrared Interferometry Module | SLED source, 37–1850 µm range |
| Scan Modes | Full-map, cross (‘X’), star (‘+’), user-defined multi-point |
| Compliance | ISO 5725 (accuracy & precision), ISO 25178-2 (areal texture), ISO 10110-7 (optical surface form), SEMI D39 (wafer geometry), ASTM F39 (silicon wafer bow/warp) |
Show next