VISION Series Electronic-Grade Ultra-Pure Water System

Overview

The VISION Series Electronic-Grade Ultra-Pure Water System is a fully integrated, factory-engineered purification platform designed specifically for semiconductor fabrication, advanced packaging, and high-reliability microelectronics manufacturing environments. It employs a multi-stage, redundant purification architecture—comprising dual reverse osmosis (RO), electrodeionization (EDI), and final polishing deionization (DI)—to consistently deliver ultrapure water (UPW) meeting the stringent requirements of EW-I grade per GB/T 11446.1–2013 and Type E1.2 per ASTM D5127–2013(2018). The system operates on a closed-loop, continuously recirculating distribution principle with temperature-controlled loop circulation, minimizing microbial proliferation and particle generation. Its core design prioritizes long-term stability, reproducible resistivity ≥18.0 MΩ·cm at 25 °C, total organic carbon (TOC) <1 ppb, silica <0.5 ppb, and sub-ppt metal ion removal—critical for sub-28 nm node photolithography, wet etch, and chemical mechanical planarization (CMP) processes.

Key Features

• Redundant dual-RO pretreatment stage ensures consistent feedwater quality and extends downstream EDI and polishing resin life under variable municipal or well-water input conditions.
• High-efficiency EDI module with low-energy regeneration and zero chemical consumption, compliant with ISO 14001 environmental management principles.
• Final polishing DI bed configured with nuclear-grade mixed-bed resins and ultra-low leaching housings to achieve sustained >18.2 MΩ·cm resistivity and meet semiconductor-grade particle specifications (<1 particle/mL @ ≥0.2 µm).
• Full automation via embedded PLC with 10″ HMI touchscreen interface supporting multilingual configuration (default Chinese); supports remote start/stop, real-time parameter visualization (resistivity, TOC, flow, pressure, temperature), and alarm history export.
• IoT-integrated architecture enables secure cloud-based monitoring, predictive maintenance alerts, consumable lifetime analytics, and audit-ready event logging aligned with GLP/GMP data integrity expectations.
• Modular 3D-engineered skid design allows flexible footprint adaptation—from cleanroom utility corridors to dedicated UPW mechanical rooms—with vibration-damped mounting and stainless-steel 316L wetted components throughout.

Sample Compatibility & Compliance

The VISION system is validated for continuous 24/7 operation in Class 100–Class 1000 cleanroom environments and meets all critical physical, chemical, and microbiological parameters defined in GB/T 11446.1–2013 (Electronic Grade Water – Part 1: Technical Requirements) for EW-I grade. It also satisfies ASTM D5127–2013(2018) Type E1.2 specifications for electronic and microelectronic applications, including maximum allowable limits for sodium (<0.05 ppb), copper (<0.02 ppb), nickel (<0.01 ppb), and chloride (<0.1 ppb). All wetted materials comply with USP , FDA 21 CFR Part 11 (when paired with optional audit-trail software module), and semiconductor industry standards for extractables and leachables (SEMI F57). System validation documentation includes IQ/OQ protocols and traceable calibration certificates for all online sensors.

Software & Data Management

The embedded control system provides native support for time-stamped, tamper-evident data logging—including resistivity, TOC, differential pressure across filters/EDI, UV intensity, and flow rate—with local SD card backup and optional encrypted cloud synchronization. All operational events, alarms (with severity classification), and manual interventions are recorded with user ID, timestamp, and contextual metadata. Optional software add-ons enable full 21 CFR Part 11 compliance, including electronic signatures, role-based access control, and automated report generation for internal audits or external certification bodies (e.g., ISO 9001, IATF 16949). Data exports conform to CSV and PDF formats compatible with LIMS integration.

Applications

• Semiconductor front-end process water for photomask cleaning, wafer rinsing, and diffusion furnace humidification.
• Advanced packaging applications including flip-chip underfill, wafer-level packaging (WLP), and fan-out RDL processing.
• Flat panel display (FPD) manufacturing—particularly for TFT-LCD and OLED array substrate cleaning.
• MEMS and power device fabrication requiring low-metal, low-particle rinse water in etch and deposition tool clusters.
• Research and development labs validating new lithographic chemistries or developing next-generation EUV photoresists.

FAQ

What is the minimum required feedwater quality for stable VISION system operation?

Feedwater must meet municipal potable water standards per GB 5749–2022 or equivalent; TDS <500 ppm and chlorine <0.5 ppm are recommended for optimal RO membrane longevity.
Can the system be integrated into an existing UPW distribution network?

Yes—VISION supports both direct point-of-use delivery and integration into recirculating loops via sanitary tri-clamp or orbital weld connections, with optional loop return pump and UV sterilizer modules.
Is third-party validation support available for qualification?

RSJ provides IQ/OQ documentation templates and on-site commissioning support; full PQ services are delivered through certified partners accredited to ISO/IEC 17025.
How frequently must consumables be replaced under typical 24/7 operation?

Dual RO membranes: 2–3 years; EDI stack: 5–7 years; polishing DI cartridges: 6–12 months—actual intervals depend on feedwater quality and usage profile, tracked automatically by the onboard system.
Does the system comply with FDA 21 CFR Part 11 for electronic records?

Out-of-the-box functionality meets ALCOA+ data integrity principles; full Part 11 compliance requires activation of the optional Audit Trail & e-Signature software package and implementation of site-specific procedural controls.