Zhengye PCB Trace Width Measurement System XK32
| Brand | Zhengye |
|---|---|
| Origin | Guangdong, China |
| Manufacturer Type | Direct Manufacturer |
| Regional Classification | Domestic (China) |
| Model | XK32 |
| Pricing | Available Upon Request |
Overview
The Zhengye PCB Trace Width Measurement System XK32 is a high-precision, automated optical metrology platform engineered for non-contact dimensional inspection of printed circuit board (PCB) features during mid- to late-stage fabrication—specifically after etching and prior to solder mask application. It operates on the principle of high-resolution digital image acquisition combined with sub-pixel edge detection algorithms, delivering traceable, repeatable measurements of critical geometric parameters including trace upper-width, lower-width, line-to-line spacing, pad-to-edge distance, via diameter (through-hole, blind via), and fine-pitch conductor patterns. Designed for integration into modern PCB production lines, the XK32 supports both rigid and flexible substrate types and is equally applicable to IC wafer-level interconnect structures and LCD panel conductor arrays, where feature sizes range from 10 µm to 500 µm.
Key Features
- Automated Positioning via CAM Data Integration: Native support for Gerber RS-274X format files enables direct import of design data; users define measurement points and regions-of-interest directly on the CAD layout, generating fully reproducible, script-based inspection routines.
- Auto-Focus Imaging System: Real-time focus calibration using contrast-based autofocus ensures optimal depth-of-field and edge sharpness across varying substrate topographies and surface finishes—including copper, solder mask, and bare FR-4.
- Motorized Zoom Lens with Seamless Magnification Switching: A precision continuous-zoom optical system allows dynamic, software-controlled magnification adjustment (e.g., 20×–100× equivalent) without mechanical lens swapping or stage repositioning.
- On-Screen Navigation Map: A synchronized low-magnification overview image provides real-time positional context, enabling rapid navigation to target coordinates—even across large-panel substrates (up to 610 mm × 610 mm).
- Sub-Pixel Edge Detection & Dual-Edge Measurement: Proprietary edge-finding algorithms identify both upper and lower trace edges simultaneously, computing true trapezoidal width profiles per IPC-6012 requirements.
- Statistical Process Control (SPC) Engine: Built-in SPC module calculates Cp/Cpk, control charts (X̄-R, X̄-S), histogram distributions, and trend analysis in accordance with ISO 22514 and AIAG SPC manual standards.
Sample Compatibility & Compliance
The XK32 accommodates standard PCB panel formats (including 18″ × 24″ and 21″ × 24″), as well as individual substrates, wafers (up to 8″), and display glass panels. Sample handling is compatible with vacuum chucks and adjustable mechanical clamps. All measurement workflows comply with IPC-TM-650 Test Methods 2.2.15 (Optical Microscopy) and 2.2.17 (Line Width Measurement), and support GLP/GMP documentation requirements through audit-trail-enabled operation logs. Optional validation packages include NIST-traceable calibration certificates for length measurement uncertainty (k=2, U = ±0.5 µm).
Software & Data Management
The proprietary Zhengye Line Width Analysis Software (v4.2+) provides full GUI-driven operation, multi-user role management, and secure database connectivity. It supports ODBC-compliant SQL Server and MySQL interfaces for bidirectional MES integration—enabling automatic job dispatch, result upload, and SPC data synchronization. Raw image archives, measurement reports (PDF/CSV), and statistical summaries are timestamped, user-logged, and exportable to Excel-compatible formats. The software meets FDA 21 CFR Part 11 compliance prerequisites when deployed with electronic signature modules and system access controls.
Applications
- Post-etch verification of inner/outer layer trace geometry in multilayer PCB manufacturing
- Process capability assessment for HDI microvia formation and fine-line etching
- Quality gate inspection prior to solder mask lamination or surface finish application
- Failure analysis of open-circuit defects, undercut, or over-etch conditions
- Dimensional validation of fan-out wafer-level packaging (FOWLP) redistribution layers
- Line/space metrology for TFT-LCD and OLED display driver circuits
FAQ
Does the XK32 support automated pass/fail judgment based on engineering tolerances?
Yes—users can configure bilateral tolerance limits per feature type; the system flags deviations in real time and generates summary yield reports.
Can measurement data be exported directly to a corporate ERP or quality management system?
Yes—via standardized SQL queries or RESTful API extensions (available under OEM integration agreement).
Is the system suitable for measuring traces on non-planar or warped PCBs?
The auto-focus and Z-height compensation algorithms maintain measurement fidelity across warpage up to ±0.3 mm within the field of view.
What calibration standards are recommended for routine verification?
Zhengye supplies certified step gauges and line-width reference wafers traceable to NPL or NIST; annual third-party calibration is advised per ISO/IEC 17025.
How is operator training and technical support delivered internationally?
Remote web-based training sessions, bilingual (English/Chinese) documentation, and on-site commissioning support are available globally through Zhengye’s authorized service partners.
