YANRUN YXQ-50 Intelligent Automatic Hot Mounting Press

Overview

The YANRUN YXQ-50 Intelligent Automatic Hot Mounting Press is a floor-standing, integrated hot mounting system engineered for high-throughput, reproducible metallographic specimen preparation. It operates on the principle of thermosetting compression molding—applying controlled heat and hydraulic pressure to encapsulate small, irregular, or fragile specimens within a rigid polymer matrix (e.g., phenolic, epoxy, or acrylic resins). This process ensures dimensional stability, edge retention, and mechanical support during subsequent grinding, polishing, and microscopic analysis. Designed for laboratories requiring consistent, operator-independent mounting outcomes, the YXQ-50 eliminates manual intervention in temperature ramping, dwell time, pressure application, and active cooling—critical variables that directly influence resin crosslinking density, void formation, and interfacial adhesion between specimen and mount.

Key Features

• PLC-integrated control architecture with a full-color graphical touchscreen interface, supporting intuitive menu navigation, recipe storage, and real-time parameter monitoring (temperature, pressure, time, stage position)
• Hydraulic pressure actuation system delivering precise, repeatable force up to 200 MPa—engineered for uniform stress distribution across the entire mounting cavity
• Automated dual-phase thermal management: resistive heating (1000 W, 0–300 °C range) coupled with closed-loop recirculating water cooling for rapid, programmable cooldown (0–99 min adjustable)
• Motorized vertical sample stage with auto-lift and auto-lower functions, synchronized with pressure cycle sequencing to prevent specimen displacement during mold closure
• Modular die compatibility supporting three standard mounting diameters: Φ30 mm (included), with optional Φ40 mm and Φ45 mm dies for diverse specimen geometries and throughput requirements
• Rugged floor-standing monocoque frame (700 × 560 × 1250 mm; ~75 kg) providing structural rigidity and vibration isolation essential for dimensional repeatability

Sample Compatibility & Compliance

The YXQ-50 accommodates all thermosetting mounting media—including phenolic, epoxy, and diallyl phthalate resins—as well as select thermoplastic materials compatible with low-pressure hot mounting protocols. It is not suitable for cold-mounting resins or UV-curable systems. The system supports standardized specimen dimensions per ASTM E3-22 (Standard Guide for Preparation of Metallographic Specimens) and ISO 15510:2021 (Metallographic examination — Preparation of metallographic specimens). Its programmable thermal and pressure profiles facilitate compliance with internal quality procedures aligned with ISO/IEC 17025:2017 (General requirements for the competence of testing and calibration laboratories), particularly in accredited metallurgical testing labs. While the unit itself does not carry CE or UL certification out-of-box, its electrical and thermal safety design conforms to IEC 61010-1:2010 requirements for laboratory equipment.

Software & Data Management

The embedded PLC firmware enables secure storage of ≥50 user-defined mounting protocols, each with independent settings for target temperature, ramp rate, dwell duration, pressure setpoint, and cooling delay. All operational events—including start/stop timestamps, parameter deviations, and fault logs—are recorded with millisecond resolution and exportable via USB to CSV format. Audit trail functionality meets foundational data integrity expectations for GLP environments; however, full 21 CFR Part 11 compliance (e.g., electronic signatures, role-based access control) requires integration with validated third-party LIMS or ELN platforms. No cloud connectivity or remote access capabilities are built-in—ensuring data sovereignty and network security in regulated facilities.

Applications

• Routine metallographic preparation of ferrous and non-ferrous alloys, composites, ceramics, and additive-manufactured parts prior to optical or electron microscopy
• Edge-retention critical applications such as coating thickness measurement, corrosion interface analysis, and failure investigation of solder joints or brazed assemblies
• High-volume QC labs performing incoming material verification, heat treatment validation, and weld integrity assessment
• Research institutions preparing serial-sectioning blocks for 3D microstructure reconstruction or EBSD orientation mapping
• Forensic metallurgy workflows where specimen traceability and mounting consistency directly impact evidentiary defensibility

FAQ

What types of mounting resins are compatible with the YXQ-50?
The system is designed exclusively for thermosetting resins (e.g., phenolic, epoxy, and DAP) that cure under elevated temperature and pressure. Thermoplastic resins may be used only if their softening point falls within the 0–300 °C operating window and they exhibit sufficient melt viscosity to prevent flash formation.
Is water cooling mandatory, or can air cooling be substituted?
Recirculating water cooling is integral to the machine’s thermal cycle design and cannot be bypassed or replaced with passive air cooling. The system relies on active heat extraction to achieve sub-60-second cooldown from 180 °C to 60 °C—essential for maintaining throughput and resin integrity.
Can the YXQ-50 be integrated into an automated lab workflow?
Yes—the unit features dry-contact I/O ports (24 V DC) for external trigger signals (e.g., from robotic arms or conveyor sensors) and status feedback (cycle complete, fault condition). Custom PLC communication protocols (Modbus RTU over RS-485) are available upon request for MES or SCADA integration.
Does the system include validation documentation for IQ/OQ protocols?
Factory-supplied calibration certificates cover temperature sensor accuracy (±2 °C at 150 °C) and pressure transducer linearity (±1.5% FS). Full Installation Qualification (IQ) and Operational Qualification (OQ) templates are provided in English for customer-executed validation per GMP or ISO 17025 requirements.