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Shimadzu DUH-211/211S Dynamic Ultra-Micro Hardness Tester

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Brand Shimadzu
Origin Japan
Manufacturer Shimadzu Corporation
Product Type Imported Instrument
Model DUH-211/211S
Instrument Category Microhardness Tester
Force Range 0.1–1961 mN
Maximum Test Load 1961 mN
Force Resolution 0.196 mN
Force Accuracy ±1% of displayed value
Displacement Measurement Range 0–10 µm
Displacement Resolution 0.0001 µm
Indenter 115° triangular pyramid (Berkovich-type)
Optical Magnification ×500 (with ×50 objective lens)
Compliance Standard ISO 14577-1 Annex A (Martens hardness & material parameter evaluation)

Overview

The Shimadzu DUH-211/211S Dynamic Ultra-Micro Hardness Tester is a high-precision instrument engineered for depth-sensing indentation testing at micro- and sub-micron force levels. Based on the quasi-static and dynamic nanoindentation principle—where controlled electromagnetic actuation applies precisely regulated load while simultaneously measuring real-time displacement—the system enables quantitative evaluation of Martens hardness, elastic modulus, creep behavior, and plastic deformation parameters in accordance with ISO 14577-1 Annex A. Unlike conventional Vickers or Knoop testers relying solely on optical impression measurement, the DUH-211/211S integrates high-resolution capacitive displacement sensing (0.0001 µm resolution) and closed-loop electromagnetic force control to deliver reproducible mechanical property data from ultra-thin films, surface-modified layers, and brittle substrates where traditional indentation methods fail.

Key Features

  • Electromagnetic loading mechanism ensuring fast response, minimal thermal drift, and high force stability across the full 0.1–1961 mN range
  • Ultra-fine force resolution of 0.196 mN—enabling reliable characterization of nanoscale coatings such as ALD-grown oxides, PVD metallic interlayers, and atomic-layer-deposited barrier films
  • Berkovich-type 115° triangular pyramid indenter optimized for depth-controlled indentation and compliant with ISO 14577 geometry requirements
  • Real-time load–displacement curve acquisition with up to 10 kHz sampling rate for dynamic modulus and viscoelastic parameter extraction
  • Multi-segment loading/unloading protocols—including constant strain-rate, hold-at-maximum-load, and cyclic indentation—for comprehensive mechanical profiling
  • Integrated ×500 optical magnification system (×50 objective lens) with motorized stage and auto-focus support for rapid, repeatable positioning over heterogeneous sample surfaces

Sample Compatibility & Compliance

The DUH-211/211S is validated for use with a broad spectrum of advanced materials requiring non-destructive, localized mechanical assessment. These include vacuum-deposited thin films (e.g., TiN, SiO₂, DLC), semiconductor passivation layers (Si₃N₄, Al₂O₃), ion-implanted diffusion zones, thermally grown oxide scales, polymer thin films (<1 µm), elastomeric coatings, optical fibers, carbon fiber composites, and low-fracture-toughness ceramics and glasses. All test procedures adhere to ISO 14577-1 Annex A for Martens hardness calculation and material parameter derivation. The system supports traceable calibration via NIST-traceable reference standards and meets requirements for GLP-compliant laboratories through audit-ready test log generation and user-access-level permission controls.

Software & Data Management

Operation is managed via Shimadzu’s proprietary DUH Analysis Software, which provides intuitive workflow-driven test setup, real-time curve visualization, and automated post-processing for hardness, reduced modulus, contact stiffness, and time-dependent recovery metrics. Raw load–displacement datasets are stored in vendor-neutral ASCII format for third-party analysis (e.g., MATLAB, Python-based indentation modeling). The software supports 21 CFR Part 11 compliance features including electronic signatures, audit trails, and role-based access control—essential for regulated environments in semiconductor manufacturing QA, medical device coating validation, and pharmaceutical packaging R&D. Export functions include PDF reports with embedded metadata (operator ID, timestamp, environmental conditions, calibration status).

Applications

  • Quantitative hardness mapping of wafer-scale ALD dielectric stacks in advanced logic node development
  • Evaluation of interfacial adhesion strength and delamination thresholds in multilayer optical coatings
  • Mechanical degradation monitoring of polymer electrolyte membranes under humidity cycling
  • Creep resistance assessment of high-temperature ceramic matrix composites (CMCs)
  • Correlation of indentation-derived elastic modulus with AFM-based nanomechanical mapping results
  • Validation of surface hardening treatments (e.g., nitriding, carburizing) in aerospace-grade titanium alloys

FAQ

What distinguishes the DUH-211/211S from conventional Vickers microhardness testers?
Unlike optical impression-based systems, the DUH-211/211S employs continuous depth-sensing indentation with electromagnetic force control—providing direct access to elastic recovery, plastic work ratio, and time-dependent deformation behavior.
Can the system perform compression testing on micro-pillars or MEMS structures?
Yes—by equipping optional flat-punch compression fixtures and dedicated compression analysis modules, the DUH-211/211S supports uniaxial micro-compression down to ~1 µN load resolution.
Is ISO 14577-1 Annex A compliance verified by independent certification?
Shimadzu provides factory verification documentation aligned with ISO/IEC 17025-accredited calibration practices; end-user validation is supported via certified reference materials (e.g., fused silica, sapphire, and tungsten carbide standards).
How is thermal drift mitigated during long-duration hold tests?
The instrument incorporates active temperature stabilization of the load frame and dual-stage vibration isolation, achieving <0.02 nm/s thermal displacement drift under 60-second hold conditions.
Does the system support automated grid-based mapping?
Yes—integrated XYZ motorized stage with programmable pattern definition enables fully automated hardness and modulus mapping across areas up to 100 × 100 mm with positional repeatability of ±0.5 µm.

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