Electron Microscope
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| Brand | BM |
|---|---|
| Origin | Shanghai, China |
| Model | TM3030 |
| Instrument Type | Desktop SEM |
| Electron Source | Pre-aligned Tungsten Filament |
| Accelerating Voltages | 5 kV, 15 kV |
| Magnification Range | 15× to 30,000× (with digital zoom: 2×, 4×) |
| Maximum Sample Diameter | 70 mm |
| Sample Stage Travel | X: ±17.5 mm, Y: ±17.5 mm |
| Detector System | High-sensitivity 4-segment semiconductor backscattered electron (BSE) detector |
| Vacuum System | Turbo-molecular pump (30 L/s), diaphragm pump (1 m³/h), ultimate vacuum ≤1.5×10⁻⁵ Pa, variable pressure mode (6–270 Pa, 22 steps) |
| Control Interface | Two USB 2.0 ports, Ethernet port |
| Operating System | Microsoft Windows® 7 or later |
| Display | 15.4-inch LCD (1280×800 resolution) |
| Auto-functions | Auto filament saturation, auto beam alignment, auto stigmation, auto focus, auto brightness/contrast, overcurrent protection, leakage circuit breaker |
| Brand | BM |
|---|---|
| Origin | Shanghai, China |
| Model | U1510 |
| Instrument Type | Floor-standing SEM |
| Electron Source | Tungsten Filament |
| Vacuum Modes | High Vacuum & Variable Pressure (6–270 Pa) |
| Secondary Electron Resolution | 3.0 nm @ 30 kV (High Vacuum) |
| Backscattered Electron Resolution | 4.0 nm @ 30 kV (6 Pa, Low Vacuum) |
| Magnification Range | 5× to 300,000× |
| Accelerating Voltage | 0.3–30 kV |
| Max Sample Diameter | 153 mm |
| Stage Travel | X 0–80 mm, Y 0–40 mm, Z 5–50 mm, T –20° to +90°, R 360° |
| Standard Detectors | Everhart-Thornley-type Secondary Electron Detector (SED), High-Sensitivity Semiconductor Backscattered Electron Detector (BSE) |
| Vacuum System | Single Turbo-Molecular Pump + Rotary Mechanical Pump |
| Safety Features | Power Failure Protection, Leakage Current Interlock, Automatic Shutdown |
| Brand | Bruker |
|---|---|
| Origin | Malaysia |
| Manufacturer Type | Authorized Distributor |
| Origin Category | Imported Instrument |
| Model | Dimension Edge |
| Price Range | USD 135,000 – 205,000 (FOB) |
| Instrument Type | Atomic Force Microscope (AFM) |
| Positional Noise (X-Y, Closed-Loop) | ≤0.15 nm RMS at standard imaging bandwidth (up to 625 Hz) |
| Z-Noise (Closed-Loop) | 35 pm RMS at standard imaging bandwidth (up to 625 Hz) |
| Sample Diameter Capacity | 210 mm |
| XY Stage Travel Range | 150 mm × 150 mm |
| Brand | Bruker |
|---|---|
| Origin | Malaysia |
| Manufacturer Type | Authorized Distributor |
| Origin Category | Imported |
| Model | Dimension Icon |
| Instrument Type | Atomic Force Microscope |
| X-Y Positioning Noise (Closed-Loop) | ≤0.15 nm RMS (Standard Imaging Bandwidth, up to 625 Hz) |
| Z Positioning Noise (Closed-Loop) | 35 pm RMS (Standard Imaging Bandwidth, up to 625 Hz) |
| Maximum Sample Diameter | 210 mm |
| Sample Stage Travel Range | 150 mm |
| Brand | Bruker |
|---|---|
| Origin | Germany |
| Manufacturer Type | Authorized Distributor |
| Import Status | Imported |
| Model | QUANTAX ED-XS |
| CCD Camera Resolution | 640 × 480 pixels |
| Maximum Stage Speed | 10 mm/s |
| Spatial Resolution | 50 nm |
| Angular Resolution | 0.2° |
| Brand | Bruker |
|---|---|
| Origin | Germany |
| Manufacturer Type | Authorized Distributor |
| Product Origin | Imported |
| Model | OPTIMUS 2 QUANTAX EBSD eflash FS |
| CCD Camera Resolution | 640 × 480 |
| Maximum Stage Speed | 10 mm/s |
| Spatial Resolution | 1.5 nm |
| Angular Resolution | 0.2° |
| Brand | Bruker |
|---|---|
| Origin | Germany |
| Product Type | Imported Software for Electron Microscopy |
| Model | ESPRIT 2 |
| Price Range | USD 25,000 – 65,000 |
| Brand | Bruker |
|---|---|
| Origin | Germany |
| Model | ESPRIT QUBE |
| Compatibility | Integrated with Bruker e-Flash EBSD detectors and QUANTAX EDS systems |
| Data Format Support | HDF5, .ctf, .ang, .h5ebsd, .edax, .oxford, .bmp, .tiff |
| Licensing | Concurrent or node-locked perpetual license |
| System Requirements | Windows 10/11 (64-bit), ≥32 GB RAM, ≥2 TB SSD storage recommended, NVIDIA GPU with ≥8 GB VRAM (CUDA 11.2+) |
| Brand | Bruker |
|---|---|
| Origin | Germany |
| Manufacturer Type | Authorized Distributor |
| Origin Category | Imported |
| Model | eWARP |
| Quotation | Upon Request |
| Maximum Pattern Acquisition Rate | 14,400 patterns/second |
| Spatial Resolution | 20 nm |
| Angular Resolution | 0.1° |
| Brand | Bruker |
|---|---|
| Origin | USA |
| Model | Hysitron PI 89 |
| Application | In-situ nanomechanical testing inside SEM and FIB/SEM chambers |
| Sensing Principle | Capacitive displacement sensing with sub-nanometer resolution |
| Actuation | Electromechanical force actuation |
| Force Range | Up to 100 mN (standard configuration) |
| Displacement Resolution | < 0.2 nm |
| Positioning Accuracy | ≤ 50 nm (with integrated linear encoder and motorized tilt/rotate stages) |
| Compatibility | Fully compatible with FEI/Thermo Fisher, Zeiss, JEOL, and Hitachi SEM/FIB platforms |
| Analytical Integration | Synchronized acquisition with EBSD, EDS, BSE, and TKD detectors |
| Brand | Bruker |
|---|---|
| Origin | USA |
| Model | PI 89 AUTO |
| Application Domain | In situ SEM-integrated nanomechanical characterization |
| Automation Level | Fully motorized stage + patented dual-axis rotation/tilt (R/T) mechanism |
| Software Platform | TriboScan Auto v5.0+ |
| Compliance Framework | Designed for GLP-compliant workflows |
| Sample Environment | Compatible with standard high-vacuum and low-vacuum SEM chambers (FEI, Thermo Fisher, Zeiss, JEOL) |
| Maximum Load Resolution | Sub-100 nN |
| Displacement Resolution | < 0.05 nm |
| Stage Precision | ±50 nm positional repeatability over 10 mm × 10 mm travel range |
| Brand | Bruker |
|---|---|
| Origin | Germany |
| Manufacturer Type | Authorized Distributor |
| Origin Category | Imported |
| Model | QUANTAX EBSD |
| Pricing | Upon Request |
| CCD Camera Resolution | 640 × 480 pixels |
| Maximum Stage Speed | 10 mm/s |
| Spatial Resolution | 1.5 nm |
| Angular Resolution | 0.1° |
| Brand | Bruker |
|---|---|
| Origin | Germany |
| Manufacturer Type | Authorized Distributor |
| Origin Category | Imported |
| Model Series | QUANTAX Transmission Electron Microscopy (TEM/STEM) EDS |
| Energy Resolution | <129 eV |
| Peak-to-Background Ratio | 20,000:1 |
| Maximum Count Rate | 1500 kcps |
| Elemental Detection Range | Be to Cf |
| Detector Active Area | 10–300 mm² |
| Window Options | Polymer Ultrathin Window or Windowless |
| Brand | Bruker |
|---|---|
| Origin | Germany |
| Model | QUANTAX FlatQUAD |
| Energy Resolution | <129 eV |
| Peak-to-Background Ratio | 20,000:1 |
| Maximum Count Rate | 4,000 kcps |
| Elemental Detection Range | Boron (B) to Californium (Cf) |
| Detector Active Area | 10–300 mm² |
| Window Type | Windowless |
| Brand | Bruker |
|---|---|
| Origin | Germany |
| Model | Quantax XFlash Series |
| Energy Resolution | <129 eV |
| Peak-to-Background Ratio | 20,000:1 |
| Maximum Count Rate | 1,500 kcps |
| Elemental Detection Range | Be to Cf |
| Detector Active Area | 10–300 mm² |
| Window Options | Ultrathin Polymer Window or Windowless Configuration |
| Brand | Bruker |
|---|---|
| Origin | Germany |
| Manufacturer Type | Authorized Distributor |
| Origin Category | Imported |
| Model | QUANTAX xsense |
| Pricing | Upon Request |
| Brand | Bruker |
|---|---|
| Origin | Germany |
| Manufacturer Type | Authorized Distributor |
| Origin Category | Imported |
| Model | QUANTAX XTrace |
| Pricing | Available Upon Request |
| Brand | CHIPNOVA |
|---|---|
| Origin | Fujian, China |
| Manufacturer Type | Direct Manufacturer |
| Regional Classification | Domestic (China) |
| Model | CNS-VH-LR |
| Price | USD 1.00 (Reference Only – Contact for Quotation) |
| Brand | CHIPNOVA |
|---|---|
| Origin | Fujian, China |
| Manufacturer Type | OEM Manufacturer |
| Country of Origin | Domestic (China) |
| Model | CNT-GNIH |
| Pricing | Upon Request |
| Instrument Category | In Situ Tensile/Compression Holder |
| Application Domain | Materials Science |
| Brand | CHIPNOVA |
|---|---|
| Origin | Fujian, China |
| Manufacturer Type | Direct Manufacturer |
| Country of Origin | China |
| Model | CNT-SHE |
| Application Category | In Situ Liquid TEM |
| Primary Application Field | Catalysis |
| Instrument Class | In Situ TEM Sample Holder |
| Brand | CIQTEK |
|---|---|
| Origin | Anhui, China |
| Manufacturer Type | Direct Manufacturer |
| Origin Category | Domestic (China) |
| Model | SEM3300 |
| Instrument Type | Floor-Standing Conventional SEM |
| Electron Source | Tungsten Filament |
| SEM Class | Entry-Level Tungsten-Filament SEM |
| Secondary Electron Resolution | 2.5 nm @ 20 kV |
| Magnification Range | 1× to 300,000× |
| Accelerating Voltage | 0.1 kV to 30 kV |
| Stage Travel | X: 120 mm |
| Y | 115 mm |
| Z | 50 mm |
| Brand | CHIPNOVA |
|---|---|
| Model | CNT-OTAR-S |
| Holder Type | In Situ Tomographic Sample Holder |
| Compatible TEM Platforms | Thermo Fisher/FEI, JEOL, Hitachi (HR)TEM/STEM |
| Sample Mounting Options | Single-Axis Tip & C-Type Tip |
| Tip Exchangeable | Yes |
| Tip Configurations | 3 mm Half-Grid (C-Type), Rod/Conical (Single-Axis) |
| Maximum Tilt Range | ±54° (Tomographic Series) |
| Tilt Increment | 6° |
| Drift Rate | <0.5 nm/min (Stabilized State) |
| Holder Body Material | High-Strength Titanium Alloy |
| EDS/EELS/SAED Compatibility | Fully Supported |
| Application Domain | Materials Science, Nanogeology, In Situ Structural Analysis |
| Compliance | Designed for GLP-aligned electron tomography workflows |
| Brand | EDAX |
|---|---|
| Origin | USA |
| Manufacturer Type | Authorized Distributor |
| Product Origin | Imported |
| Model | DigiView |
| Pricing | Upon Request |
| CCD Resolution | 1392 × 1040 pixels |
| Readout Speeds | 20 MHz / 40 MHz |
| Angular Resolution | < 0.1° |
| Quantum Efficiency | > 62% @ 500 nm |
| Bit Depth | 12-bit digital output |
| Read Noise | < 8 e⁻ @ 20 MHz |
| Exposure Time Range | Up to 15 minutes |
| Cooling | Single-stage Peltier (fanless) |
| Interface | Gigabit Ethernet |
| Gain Control Range | 0–35 dB (fully adjustable) |
| Vacuum Compatibility | Bellows-mounted for in-chamber operation |
| Optional Feature | Integrated Fore-Scatter Detector (FSD) |
| Software Integration | Fully compatible with EDAX TEAM™ EBSD analysis suite |
| Brand | EDAX |
|---|---|
| Origin | USA |
| Model | Hikari XP |
| Angular Resolution | < 0.1° |
| Maximum Pattern Indexing Rate | up to 1400 points/sec |
| Beam Current Compatibility | down to 100 pA |
| Accelerating Voltage Compatibility | down to 5 kV |
| Brand | EDAX |
|---|---|
| Origin | USA |
| Model | Octane Elect |
| Energy Resolution | 127 eV |
| Maximum Count Rate | 400,000 cps |
| Detector Active Area | 30 mm² or 70 mm² |
| Window Material | Silicon Nitride (Si₃N₄) |
| Brand | EDAX |
|---|---|
| Origin | USA |
| Model | Octane Elite |
| Energy Resolution | 125 eV (Mn Kα) / 123 eV (optimized configuration) |
| Peak-to-Background Ratio | Not specified |
| Maximum Output Count Rate | 400,000 cps |
| Detector Active Area | 30 mm² (Octane Elite Plus) or 70 mm² (Octane Elite Super) |
| Window Material | Silicon Nitride (Si₃N₄) |
| Vacuum Compatibility | Fully sealed ultra-high vacuum detector housing |
| Integration | Compatible with SEM, FIB-SEM, and TEM platforms |
| Brand | EDAX |
|---|---|
| Origin | USA |
| Model | Velocity Super |
| Maximum Acquisition Speed | 4500 points/sec |
| Orientation Resolution | < 0.1° |
| Image Resolution (during high-speed acquisition) | 120 × 120 pixels |
| Detector Type | High-sensitivity, low-noise CMOS |
| Calibration Algorithm | Triplet-band confidence-based indexing |
| EDS-EBSD Synchronization | Yes, with compatible EDAX EDS detectors |
| Compliance | Designed for ASTM E112, ISO 11937, and ASTM E2627-compliant microstructural quantification workflows |
| Software Integration | OIM Analysis™ v9+ with GLP-compliant audit trail and 21 CFR Part 11-ready data handling |
| Brand | EDAX |
|---|---|
| Origin | USA |
| Manufacturer Type | Authorized Distributor |
| Origin Category | Imported |
| Model | XLNCE SMX-BEN |
| Quotation | Upon Request |
| Energy Resolution | See Technical Datasheet |
| Peak-to-Background Ratio | See Technical Datasheet |
| Maximum Count Rate | See Technical Datasheet |
| Detector Active Area | See Technical Datasheet |
| Brand | Advacam |
|---|---|
| Origin | Czech Republic |
| Model | ePix® |
| Sensor Technology | Timepix3-based hybrid pixel detector |
| Pixel Size | 55 × 55 µm |
| Pixel Matrix | 256 × 256 |
| Sensitive Area | 14 × 14 mm |
| Sensor Material | Silicon (Si), thickness options: 100, 300, 500 µm |
| Time-of-Arrival (TOA) Resolution | 1.56 ns |
| Maximum Hit Rate (Data-Driven Mode) | 64 Mhit/s |
| Energy Range | 2.5–300 keV |
| Readout Interface | USB-C |
| Power Consumption | 3.5 W |
| Operating Modes | Data-driven zero-suppressed, frame-based zero-suppressed |
| Pixel Operation Modes | Simultaneous Time-Over-Threshold (TOT) and Time-Of-Arrival (TOA), or integral TOT + event counting |
| Front-End Dimensions | 69 × 28 × 16 mm |
| Readout Unit Dimensions | 104 × 67 × 30 mm |
| Detector Mounting | Customizable mechanical interface |
| External Synchronization | LVDS I/O (Trigger In/Out, Clock In/Out, Ready In/Out) |
| Front-End to Readout Distance | Up to 45 cm |
| Thermal Management | Peltier-cooled, temperature-stabilized |
| Brand | Fischione |
|---|---|
| Origin | USA |
| Model | 1040 |
| Ion Beam Energy Range | 50–8,000 eV |
| Minimum Beam Energy | 50 eV |
| Focused Beam Spot Size | ≤1 µm |
| Imaging Mode | Argon Ion-Induced Secondary Electron Imaging |
| Cooling Stage | Liquid Nitrogen Cooled (−196 °C) |
| Beam Steering Accuracy | <100 nm positional repeatability |
| Vacuum Requirement | ≤5×10⁻⁶ Torr |