Aolong YX-2H8A Embedded X-ray Crystal Orientation Analyzer
| Brand | Aolong |
|---|---|
| Origin | Liaoning, China |
| Manufacturer Type | Direct Manufacturer |
| Country of Origin | China |
| Model | YX-2H8A |
| Price Range | USD 2,800 – 14,000 |
| Input Power | 220 V AC, 50 Hz, 0.5 kW |
| X-ray Tube | Cu anode, air-cooled, 30 kV, 0–5 mA |
| Detector | Geiger-Müller counter |
| Time Constants | 0.1 s, 0.4 s, 3 s |
| Angular Range | θ = −5° to +55°, 2θ = −10° to +110° |
| Angular Resolution | 1 arcsecond (1″) |
| Minimum Scale Reading | 1° on mechanical scale (2θ and θ) |
| Digital Display | Degrees, minutes, seconds |
| Adjustable Angle Setting | Programmable digital angle positioning |
| Collimator Slits | 4′, 5′, 6′ |
| Beam Shutter | Manual |
| Display Type | Digital angular readout |
| Overall Angular Accuracy | ±30″ |
| Dimensions (L×W×H) | 1160 × 700 × 1380 mm |
| Weight | 170 kg |
Overview
The Aolong YX-2H8A Embedded X-ray Crystal Orientation Analyzer is a precision Bragg-angle diffractometer engineered for high-reproducibility crystallographic orientation measurement in semiconductor and optoelectronic manufacturing environments. It operates on the principle of monochromatic X-ray diffraction (Cu Kα radiation, λ = 1.5418 Å), utilizing the Bragg condition (nλ = 2d sinθ) to determine lattice plane orientations relative to physical crystal surfaces. Designed specifically for post-growth quality control of silicon, sapphire, silicon carbide (SiC), and gallium arsenide (GaAs) ingots and wafers, the system supports both end-face and off-axis (OF) face angular characterization—critical for epitaxial layer alignment, wafer slicing planning, and crystallographic defect mapping. Its dual-stage mechanical architecture enables concurrent setup for rod-type and wafer-type specimens without reconfiguration, minimizing operator intervention and thermal drift during sequential measurements.
Key Features
- Dual independent sample stages: One V-groove stage accommodates cylindrical crystal rods (2–8 inch diameter, up to 300 mm length); the second stage supports flat wafers (2–8 inch diameter) for OF-face or end-face orientation analysis.
- Air-cooled Cu-target X-ray tube (30 kV, 0–5 mA) ensures stable output with minimal thermal load—ideal for extended duty cycles in production labs.
- High-resolution angular encoder system with digital display calibrated to 1 arcsecond (1″), traceable to NIST-traceable angular standards.
- Three selectable time constants (0.1 s, 0.4 s, 3 s) allow optimization of signal-to-noise ratio for weak diffracted intensities from low-Z or mosaic crystals.
- Manually actuated beam shutter and fixed collimation slits (4′, 5′, 6′) provide consistent beam geometry and reproducible irradiation conditions per ASTM F1470 and ISO 14833.
- Robust steel frame construction (170 kg total mass) minimizes vibration sensitivity; footprint (1160 × 700 mm) fits standard cleanroom bay configurations.
Sample Compatibility & Compliance
The YX-2H8A accepts samples ranging from 1 kg to 50 kg—enabling direct measurement of full-length monocrystalline ingots without sectioning. It complies with IEC 61000-6-3 (EMC emissions) and IEC 61000-6-2 (immunity). Radiation safety conforms to national regulations for cabinet X-ray systems (GBZ 138–2002 equivalent to ANSI N43.3), with lead-lined housing and interlocked shutter mechanism. While not certified to FDA 21 CFR Part 11, its manual operation mode and non-networked architecture support GLP-compliant recordkeeping when paired with controlled lab notebooks and audit-trail-enabled LIMS integration.
Software & Data Management
The analyzer operates in standalone mode with no embedded microprocessor or proprietary software—deliberately designed for environments requiring deterministic, interference-free operation. All angular data are displayed numerically in DMS (degrees-minutes-seconds) format on a dedicated LED panel; users manually log readings into validated spreadsheets or MES platforms. This architecture eliminates firmware vulnerabilities, reduces validation burden under ISO/IEC 17025 Clause 5.9, and ensures long-term operational continuity without OS dependency or license expiration.
Applications
- Verification of crystallographic cut angles (e.g., Si (100), (111), (110); Sapphire C-plane, R-plane, A-plane) prior to wafer slicing.
- Off-axis angle measurement for epitaxial growth substrates (e.g., 4°–6° miscut for GaN-on-sapphire heteroepitaxy).
- Post-pull alignment verification of boules used in photovoltaic ingot production.
- Quality gate check for incoming raw materials in compound semiconductor foundries.
- Teaching and research applications in solid-state physics laboratories where hands-on Bragg law demonstration is required.
FAQ
Does the YX-2H8A support automated scanning or motorized goniometry?
No. It is a manually operated diffractometer with digital angle readout only—designed for discrete point measurements rather than continuous θ–2θ scans.
Is radiation shielding sufficient for unattended operation?
The unit meets Class I cabinet X-ray requirements and must be operated in a designated X-ray controlled area with appropriate signage and access restriction per local regulatory authority guidelines.
Can it measure crystals other than silicon and sapphire?
Yes—any crystalline material producing measurable Bragg diffraction under Cu Kα excitation (e.g., quartz, LiNbO₃, ZnO, GaP) can be oriented, provided lattice parameters and reflection intensities are known.
What calibration documentation is provided?
Each unit ships with a factory calibration certificate referencing angular accuracy (±30″) and mechanical zero verification, performed using optical autocollimator traceable to national metrology institutes.
Is service support available outside mainland China?
Aolong provides remote technical guidance and spare parts logistics through authorized regional distributors; on-site service requires advance coordination and may incur travel surcharges.

