Gold Wire (Au Wire) – Hefei Kejing High-Purity Instrumentation-Grade Gold Filament
| Brand | Hefei Kejing |
|---|---|
| Origin | Anhui, China |
| Manufacturer Type | Authorized Distributor |
| Origin Category | Domestic (PRC) |
| Model | Au Wire |
| Pricing | Available Upon Request |
| Purity | 99.99% (4N) |
| Diameter Tolerance | ±0.5 µm (for ≤0.05 mm), ±1.0 µm (for ≥0.2 mm) |
| Length Options | 250–500 m (spooled) or custom cut lengths |
| Surface Roughness | Ra < 0.05 µm |
| Packaging | Class 100 cleanroom bag (ISO Class 5), sealed in aluminum foil laminate within Class 1000 cleanroom (ISO Class 6) |
Overview
Kejing Au Wire is a high-purity (99.99%, 4N) gold filament engineered for precision instrumentation, microelectronic interconnects, calibration standards, and metrology-critical applications in analytical laboratories and R&D facilities. Fabricated via controlled drawing and annealing in inert atmosphere, the wire exhibits exceptional electrical conductivity (σ ≈ 4.1 × 10⁷ S/m at 20 °C), low temperature coefficient of resistance (TCR ≈ 0.0034 K⁻¹), and outstanding thermal stability up to 300 °C in inert environments. Its mechanical consistency—tensile strength 180–220 MPa, elongation >15%—ensures reliable handling during wire bonding, probe tip fabrication, and sensor element winding. Unlike commodity-grade gold wire, Kejing’s product undergoes post-drawing electrochemical cleaning and helium leak-tested packaging to eliminate organic residues and particulate contamination, meeting baseline requirements for ISO/IEC 17025-accredited calibration labs.
Key Features
- Ultra-high purity (99.99% Au, trace Ag/Cu < 10 ppm each) verified by GDMS (Glow Discharge Mass Spectrometry)
- Tight dimensional control: diameter tolerance ±0.5 µm (for 0.02–0.05 mm), ±1.0 µm (for 0.2–0.35 mm), measured via laser micrometry per ISO 4967
- Surface integrity: Ra < 0.05 µm, free of scratches, pits, or oxide films—validated by SEM imaging and contact angle analysis
- Controlled residual stress: tensile stress < 15 MPa after final annealing, ensuring minimal springback during micro-manipulation
- Consistent mechanical behavior across spool length: yield strength variation < ±3%, verified by micro-tensile testing per ASTM E8/E8M
- Class 100 (ISO 5) cleanroom packaging with double-layer aluminum foil laminate barrier, certified for particle shedding < 10 particles/m³ (≥0.5 µm)
Sample Compatibility & Compliance
Kejing Au Wire is compatible with standard wire bonder systems (e.g., Kulicke & Soffa, West Bond), ultrasonic wedge bonding, thermosonic ball bonding, and manual micro-probe assembly. It meets material prerequisites for ISO/IEC 17025 reference material producers and satisfies traceability requirements under ISO Guide 34. While not certified to specific regulatory frameworks (e.g., USP , ICH Q5E), its documented impurity profile and manufacturing controls support qualification under GMP Annex 11 (computerized system validation) when integrated into instrument calibration workflows. The absence of halogenated contaminants (<1 ppm Cl/Br) ensures compatibility with high-sensitivity mass spectrometry ion sources and vacuum-based surface analysis tools.
Software & Data Management
As a passive physical component, Au Wire does not incorporate embedded electronics or firmware. However, full traceability documentation—including lot-specific GDMS reports, dimensional inspection certificates (per ISO 10012), and cleanroom packaging validation records—is provided digitally in PDF/A-1b format. These files are structured to integrate with laboratory information management systems (LIMS) supporting ASTM E1578 metadata schemas. Audit trails for certificate issuance, revision history, and raw measurement logs comply with ALCOA+ principles (Attributable, Legible, Contemporaneous, Original, Accurate, Complete, Consistent, Enduring, Available) for GLP/GMP environments.
Applications
- Reference electrodes and current-carrying leads in potentiostats and impedance analyzers
- Fabrication of micro-scale thermocouples (Au vs. Ni, Au vs. Pt) per ASTM E230/E230M
- Calibration filaments for optical pyrometers and infrared thermography systems
- Interconnect wiring in cryogenic quantum device packaging (dilution refrigerators, <100 mK)
- Target substrates for X-ray fluorescence (XRF) and electron probe microanalysis (EPMA) standardization
- Probe tip reinforcement and conductive coating cores in scanning probe microscopy (SPM)
FAQ
Is this gold wire suitable for ultrasonic wire bonding in semiconductor packaging?
Yes—its 4N purity, consistent grain structure, and surface cleanliness meet JEDEC J-STD-006B requirements for Class 1 noble metal bonding wires.
Can I request dimensional certification for a specific spool lot?
Yes—each shipment includes a Certificate of Conformance with laser micrometry data (mean diameter, SD, min/max) per ANSI/ASME B89.1.15.
What is the maximum continuous operating temperature in air?
250 °C for short-term exposure; sustained use above 200 °C in ambient air is not recommended due to surface oxidation and embrittlement.
Do you provide cut-to-length segments with cleanroom handling?
Yes—custom lengths down to 10 mm are available with Class 100 glove-box cutting, nitrogen-flushed vial packaging, and individual COC.
Is hydrogen annealing performed prior to packaging?
No—annealing is conducted in high-purity argon; hydrogen is avoided to prevent hydride formation and subsequent outgassing in UHV systems.
