Hengyi HY-0230BM Film Puncture Tester

Overview

The Hengyi HY-0230BM Film Puncture Tester is an electromechanical universal testing machine engineered for high-precision static mechanical characterization of thin, flexible, and low-stiffness materials—particularly polymeric films, foils, laminates, biomedical membranes, and photovoltaic interconnects. Unlike general-purpose tensile testers, the HY-0230BM is specifically configured and validated for puncture resistance testing per ASTM D3763, ISO 6474, and GB/T 10004 standards, where a hemispherical or flat-ended probe penetrates a clamped specimen at controlled displacement or force rates. Its modular architecture supports both force-controlled (e.g., peak puncture load, puncture energy) and displacement-controlled (e.g., puncture deformation, recovery behavior) test protocols, enabling quantification of critical performance parameters including puncture strength (MPa), puncture work (J), and post-yield ductility index for quality assurance in packaging, medical device barrier layers, and solar cell encapsulation.

Key Features

• Rigid single-column frame with preloaded high-precision ball screw ensures minimal deflection and long-term dimensional stability under repeated loading cycles.
• Imported bidirectional load cell (USA-sourced) with ±500,000-count resolution delivers traceable force measurement across the full 1 N to 2000 N range without manual range switching—critical for detecting subtle yield transitions in ultra-thin films (≤12 µm).
• Panasonic AC servo motor and digital drive system (Japan) enable smooth, low-noise operation from 0.001 mm/min (for creep or relaxation studies) up to 300 mm/min (for high-throughput QA screening), with speed accuracy maintained within ±0.5% of setpoint.
• Dual-mode controller supporting both open-loop jog operation and closed-loop PID control for stress, strain, or displacement regulation—compliant with ISO 527-3 and ASTM D882 Annex A3 requirements for film testing.
• Integrated electronic travel limits, overload cutoff (110% FS), and real-time diagnostic monitoring of motor current, encoder feedback, and sensor output—ensuring operational safety and data integrity during unattended runs.
• Compact footprint (430 × 315 × 855 mm) and lightweight design (40 kg) facilitate benchtop deployment in QC labs, cleanrooms, or production line environments without floor anchoring.

Sample Compatibility & Compliance

The HY-0230BM accommodates specimens up to 120 mm wide and 300 mm vertical stroke, supporting standardized puncture fixtures for films ≥10 mm × 10 mm (ASTM D3763) and custom-diameter probes (1.0 mm, 1.5 mm, 3.2 mm hemispherical tips). Validated applications include BOPP/BOPET packaging films, aluminum/copper foils (≥6 µm), PV ribbon weld joints, hydrogel wound dressings, pharmaceutical blister lidding, and biodegradable mulch films. All force and displacement measurements comply with ISO/IEC 17025 calibration traceability requirements when paired with an accredited Shanghai Metrology Institute certificate (optional add-on). The system meets mechanical safety requirements per EN ISO 12100 and electrical safety per IEC 61000-6-3 for laboratory equipment.

Software & Data Management

Bundled Hengyi TestMaster v4.x software provides ISO 17025-aligned test method templates—including puncture, peel, and tensile modes—with configurable pass/fail criteria, automatic report generation (PDF/Excel), and audit-trail logging compliant with FDA 21 CFR Part 11 for regulated industries. Raw data export includes time-stamped force-displacement curves with metadata (operator ID, sample ID, environmental conditions). Optional integration with LIMS via TCP/IP or OPC UA enables automated data ingestion into enterprise QA workflows. All firmware and controller logic are stored in non-volatile memory, preserving calibration constants and user-defined methods after power cycling.

Applications

• Quantifying puncture resistance of food packaging films to prevent seal failure during distribution.
• Evaluating mechanical integrity of lithium-ion battery separator membranes under electrode stack pressure.
• Validating burst strength of sterile medical pouches per ISO 11607-1.
• Measuring weld seam strength in photovoltaic interconnect ribbons (CuSn-plated tinned copper).
• Characterizing elastic recovery and permanent deformation in elastomeric transdermal patches.
• Assessing delamination onset in multilayer barrier films used in OLED encapsulation.

FAQ

What puncture standards does the HY-0230BM support out-of-the-box?
ASTM D3763 (high-speed puncture), ISO 6474 (slow-rate puncture of plastics), and GB/T 10004 (Chinese standard for composite plastic films) test methods are preloaded in TestMaster software with default parameters and reporting formats.
Can the system perform simultaneous force and displacement control?
Yes—the closed-loop controller supports dual-channel regulation, enabling stress-ramp tests with displacement hold phases or strain-controlled cyclic puncture to simulate real-world impact fatigue.
Is third-party calibration documentation included?
A factory calibration certificate is supplied with each unit; optional Shanghai Metrology Institute accreditation (CNAS-certified) is available upon request and adds traceability to SI units.
Are custom fixtures for non-standard specimens available?
Hengyi offers OEM fixture design services—including pneumatic clamping, heated platens (up to 80°C), and vacuum chucks—for specialized film geometries or temperature-dependent puncture studies.
Does the system meet GLP/GMP data integrity requirements?
When operated with TestMaster’s 21 CFR Part 11 module enabled (user authentication, electronic signatures, immutable audit logs), the system satisfies ALCOA+ principles for regulated pharmaceutical and medical device testing.