Kapton HN Polyimide Film (Imported from DuPont, USA)
| Brand | Hefei Kejing |
|---|---|
| Origin | USA |
| Manufacturer Type | Authorized Distributor |
| Origin Category | Imported |
| Model | Kapton® HN |
| Price | Upon Request |
| Dimensions | 12″ × 12″, 12″ × 25″, or 12″ × 50″ |
| Thickness Options | 0.0003″ (7.6 µm), 0.001″ (25.4 µm), 0.002″ (50.8 µm), 0.003″ (76.2 µm), 0.005″ (127 µm) |
| Density | 1.39–1.45 g/cm³ |
| Continuous Use Temperature | 250–280 °C in air |
| Tensile Strength | ≥200 MPa at 20 °C |
| Packaging | Class 100 cleanroom bag (ISO Class 5), double-bagged in Class 1000 cleanroom bag (ISO Class 6) |
Overview
Kapton® HN polyimide film is a high-performance, commercially established aromatic polyimide film originally developed and manufactured by DuPont (USA). Engineered for extreme thermal stability and electrical insulation integrity, it operates continuously at temperatures up to 280 °C in ambient air and retains mechanical robustness under thermal cycling, ionizing radiation, and aggressive chemical environments. Its molecular architecture—based on pyromellitic dianhydride (PMDA) and oxydianiline (ODA)—confers exceptional chain rigidity, low dielectric constant (~3.4 at 1 MHz), and near-zero moisture absorption (<2.5% at 23 °C/50% RH). This makes Kapton HN the de facto standard substrate for flexible printed circuit boards (FPCBs), high-reliability aerospace wiring harnesses, thermal management films, and precision motor insulation systems requiring long-term dimensional stability and arc resistance.
Key Features
- Thermal endurance: Certified for continuous operation at 250–280 °C per ASTM D2105 and UL 746B; short-term peak tolerance exceeds 400 °C
- Outstanding dielectric properties: Volume resistivity >1016 Ω·cm; dielectric strength ≥250 kV/mm (at 25 µm thickness)
- Dimensional stability: Linear coefficient of thermal expansion (CTE) ≈ 20–30 ppm/°C (in-plane); minimal shrinkage (<0.1%) after 2-hour bake at 200 °C
- Radiation resistance: Maintains >85% tensile retention after 1 × 108 rad gamma exposure (per ASTM E262)
- Chemical inertness: Resistant to hydrocarbons, halogenated solvents, weak acids/bases; compatible with standard PCB lamination processes (e.g., acrylic, epoxy, and polyimide adhesives)
- Cleanroom-ready packaging: Supplied in double-bagged configuration—inner Class 100 (ISO 5) static-dissipative polyethylene bag, outer Class 1000 (ISO 6) laminated barrier bag—ensuring particulate control for semiconductor and MEMS fabrication environments
Sample Compatibility & Compliance
This Kapton HN film complies with RoHS Directive 2011/65/EU and REACH SVHC candidate list requirements. It meets IPC-4101D specification for base materials used in flexible circuits (Type 41, Grade HN) and conforms to NASA-STD-6016 for outgassing performance (TML <1.0%, CVCM <0.1%). The material is widely accepted in FDA-regulated medical device manufacturing (Class II/III) when processed under ISO 13485-certified cleanroom conditions. For aerospace applications, it satisfies MIL-PRF-23592E (Type HN) and is referenced in Boeing D6-17487 and Airbus AITM 1-0001 for high-temperature insulation qualification.
Software & Data Management
As a passive, non-electronic material component, Kapton HN film does not incorporate embedded firmware, sensors, or digital interfaces. However, full traceability is maintained via batch-specific Certificates of Conformance (CoC) and Certificates of Analysis (CoA), including lot number, manufacturing date, thickness uniformity data (±5% tolerance per ASTM D374), and thermal aging test reports. These documents are provided in PDF format compliant with ISO/IEC 17025 documentation standards and support integration into enterprise quality management systems (QMS) such as Veeva Vault QMS or MasterControl for audit readiness under FDA 21 CFR Part 11 and EU Annex 11.
Applications
- Flexible printed circuit board (FPCB) substrates requiring dynamic flex life >1 million cycles (e.g., foldable displays, wearable sensors)
- Insulating tapes and sleeves for magnet wire in high-speed motors, EV traction inverters, and aerospace actuators
- Thermal interface layers in power electronics modules (IGBTs, SiC MOSFETs) where CTE matching and low interfacial thermal resistance are critical
- Masking films for precision plasma etching and thin-film deposition in semiconductor front-end-of-line (FEOL) processes
- Substrates for microelectromechanical systems (MEMS) packaging and wafer-level encapsulation
- Radiation-hardened insulation in satellite power distribution units and nuclear instrumentation cabling
FAQ
Is this Kapton HN film manufactured by DuPont or a third-party licensee?
This product is sourced directly from DuPont’s U.S.-based production facility and supplied through Hefei Kejing as an authorized distributor. Each roll carries original DuPont lot coding and holographic authentication markers.
Can custom slit widths or edge treatments be provided?
Yes—Hefei Kejing supports precision slitting (±0.05 mm tolerance), laser scoring, and edge chamfering per customer-specified drawings, subject to minimum order quantities (MOQ = 50 m per configuration).
What is the shelf life and recommended storage condition?
Unopened, properly stored in original packaging at 23 °C ±5 °C and ≤50% RH, the shelf life is 24 months. Avoid UV exposure and prolonged contact with PVC or plasticizers.
Do you provide thickness verification reports per ANSI/ASQ Z1.4 Level II sampling?
Yes—thickness measurement reports (using calibrated eddy-current and optical interferometry methods) are included with every shipment, aligned with ANSI/ASQ Z1.4 General Inspection Level II, AQL 0.65.
