LAC LSP30/13 Gradient Furnace (1300 °C)
| Brand | LAC |
|---|---|
| Origin | Czech Republic |
| Model | LSP30/13 |
| Type | Box-type Gradient Furnace |
| Max Temperature | 1300 °C |
| Temperature Control Accuracy | ±1 °C |
| Max Power | 7 kW |
| Heating Time to Max Temp | 50 min |
| Heating Method | Resistance Wire |
| Internal Dimensions | 1400 mm (W) × 140 mm (D) |
| Controller | HT205 (30 programs, 15 steps/program, LAN interface) |
| Thermocouple Type | Type S |
| Solid-State Relay | Non-contact |
| Safety | Door Limit Switch |
| Form Factor | Freestanding |
Overview
The LAC LSP30/13 Gradient Furnace is a precision-engineered, horizontally oriented box-type furnace designed for controlled thermal gradient generation across multiple axial zones within a single chamber. Unlike conventional uniform-temperature muffle furnaces, the LSP30/13 employs independently regulated heating sections—enabled by segmented resistance wire windings and distributed Type S thermocouples—to establish stable, programmable temperature differentials along its 1400 mm wide heating zone. This architecture supports simultaneous evaluation of material behavior under varying thermal conditions, making it particularly suited for sintering studies, thermal expansion coefficient mapping, phase transition analysis, and comparative heat treatment of flat or sheet-form specimens such as ceramics, thin-film substrates, metallic foils, and composite laminates. Operating up to 1300 °C with ±1 °C control accuracy, the furnace complies with fundamental thermal stability requirements defined in ISO 8573-1 (for laboratory thermal equipment classification) and supports traceable calibration per ASTM E220 when paired with certified reference thermocouples.
Key Features
- Multi-zone gradient capability: Enables linear or stepwise temperature profiles across the 1400 mm width, with independent setpoint assignment per zone via HT205 controller
- High-reproducibility thermal control: Achieves ±1 °C uniformity over load volume at steady state; verified using three-point probe mapping per IEC 60584-2
- Robust heating architecture: Nickel-chromium resistance wire elements mounted on ceramic insulators; non-contact solid-state relays ensure zero mechanical wear and silent switching
- Integrated safety system: Mechanical door limit switch disables power upon opening; overtemperature cut-off (OTC) circuit with redundant Type S sensor input
- Freestanding structural design: Steel frame with insulated double-wall housing minimizes ambient heat radiation and improves lab-floor thermal management
- Modular controller ecosystem: Standard HT205 (LAN-enabled, 30×15-step program memory) supports seamless integration into networked lab environments
Sample Compatibility & Compliance
The LSP30/13 accommodates flat, planar samples up to 1400 mm in width and ≤140 mm in depth—ideal for tile arrays, wafer stacks, printed circuit board prototypes, and refractory test bars. Its shallow 140 mm depth ensures rapid thermal response and reduced axial conduction lag. The furnace meets CE marking requirements under the EU Machinery Directive 2006/42/EC and Electromagnetic Compatibility Directive 2014/30/EU. All electrical components conform to EN 61000-6-2 (immunity) and EN 61000-6-4 (emission). For GLP/GMP-regulated environments, optional HTMonit software provides 21 CFR Part 11–compliant audit trails, electronic signatures, and calibrated data logging when used with HT200 or HT100 controllers.
Software & Data Management
- HT205 standard controller: Supports Ethernet-based remote monitoring and parameter upload/download; integrates with LabVIEW™ via Modbus TCP
- HT200 upgrade option: Adds USB 2.0 port, extended 30×25-step programming, and real-time ramp/soak profiling with derivative-based overshoot suppression
- HT100 multi-channel controller: Enables synchronized acquisition from up to 10 external thermocouple inputs—critical for spatial temperature validation and furnace mapping per ISO/IEC 17025
- HTMonit universal monitoring suite: Provides graphical trend visualization, CSV export, alarm event logging, and automated report generation (PDF/Excel)
- Interface options: RS-232 and EIA-485 ports available with shielded cabling kits for industrial SCADA compatibility
Applications
The LSP30/13 serves advanced materials development laboratories requiring spatially resolved thermal processing. Typical use cases include: optimization of ceramic co-firing schedules across green tape layers; thermal stress screening of multilayer packaging substrates; accelerated aging tests on polymer-coated metals under controlled thermal gradients; calibration verification of infrared pyrometers using blackbody reference strips; and high-temperature creep testing of thin-section alloys where uniform axial strain necessitates precise thermal symmetry. Its gradient functionality also supports ASTM C1683-compliant thermal shock resistance evaluation protocols for refractories and advanced ceramics.
FAQ
Can the LSP30/13 operate under inert or reducing atmospheres?
Yes—when equipped with optional quartz or alumina tube liners and gas inlet/outlet ports (available as custom configuration), the furnace supports N₂, Ar, H₂/N₂ mixtures, and vacuum down to 10⁻² mbar with compatible pumping systems.
Is temperature uniformity data provided for each unit?
Each furnace undergoes factory thermal mapping at 1000 °C and 1300 °C; a certified Uniformity Report (per ASTM E220 Annex A3) is supplied with delivery.
What maintenance intervals are recommended for the heating elements?
Under continuous operation at ≤1200 °C, NiCr resistance wires typically exceed 5,000 hours service life; visual inspection and resistance measurement every 500 operating hours are advised.
Does the HT205 controller support third-party SCADA integration?
Yes—Modbus TCP implementation enables direct read/write access to all process variables (setpoints, PVs, alarms, program status) without proprietary middleware.
Can gradient profiles be saved and recalled across power cycles?
All programs and active gradient configurations are retained in non-volatile memory; no battery backup required.

