YXLON FF35 CT + ZoomScan Industrial X-ray Computed Tomography System
| Brand | YXLON International GmbH |
|---|---|
| Origin | Germany |
| Model | FF35 CT + ZoomScan |
| Max. Sample Rotation Radius | 260 mm |
| Max. Sample Height | 800 mm |
| Max. CT Scan Volume | 510 mm × 600 mm |
| Max. Payload | 27 kg |
| Motion Axes | 7 (standard), 8 (optional) |
| X-ray Source | 190 kV water-cooled microfocus tube, 225 kV refraction tube (dual-source optional) |
| Detector | CsI scintillator-based, multiple configurations available |
| Minimum Detectable Feature Size | 150 nm |
| ZoomScan Resolution Enhancement | 5×–10× vs. conventional CT |
| Scanning Modes | Full-volume CT, ROI-CT, FlexCenter + ZoomScan hybrid |
| Calibration Features | Focus drift auto-correction, ring artifact correction, noise calibration, beam hardening correction (material-specific), metal scatter correction, ScatterFix 2.0, automatic voxel segmentation |
Overview
The YXLON FF35 CT + ZoomScan is a high-precision industrial X-ray computed tomography (CT) system engineered for non-destructive 3D inspection of large-format electronic assemblies—particularly ultra-large printed circuit boards (PCBs) with fine-pitch ball grid arrays (BGAs), stacked packages, and embedded interconnects. Operating on the physical principles of X-ray absorption contrast and helical/step-and-shoot CT reconstruction, the system integrates dual-energy microfocus X-ray sources, a thermally stable granite metrology platform, and a 7-axis (optionally 8-axis) precision motion architecture to deliver sub-micron spatial resolution in volumetric datasets. Its core innovation—ZoomScan—is not a magnification lens but a hardware-synchronized acquisition strategy that dynamically repositions the sample relative to the focal spot and detector during scan, effectively increasing sampling density within user-defined regions of interest (ROI) without compromising field-of-view integrity. This enables true isotropic voxel resolution down to 150 nm in localized BGA solder joint analysis while maintaining full-part geometric context—a capability critical for failure analysis (FA), process validation, and first-article inspection in aerospace, automotive electronics, and advanced packaging R&D.
Key Features
- Thermally invariant granite base structure with active vibration isolation and Heidenhain linear/angular encoders for nanometer-level positional repeatability
- Dual-source configuration option: 225 kV refraction-focused tube for high-contrast metal imaging and 190 kV water-cooled microfocus tube optimized for low-noise, long-duration scans
- ZoomScan technology (released Q4 2023): delivers 5×–10× effective resolution gain in selected ROIs via synchronized sample repositioning and focal spot modulation—no optical interpolation or post-processing upscaling
- FlexCenter + ZoomScan hybrid mode: enables off-center scanning of oversized PCBs (e.g., 330 mm × 200 mm) while preserving full geometric fidelity and eliminating truncation artifacts
- Comprehensive in-scan calibration suite: real-time focus drift compensation, ring artifact suppression, material-specific beam hardening correction (for stainless steel, bone-equivalent composites, etc.), metal scatter modeling (ScatterFix 2.0), and automated voxel segmentation
- Modular detector architecture supporting CsI-based flat-panel detectors with selectable pixel pitch and dynamic range, ensuring optimal signal-to-noise ratio across diverse material densities
Sample Compatibility & Compliance
The FF35 CT accommodates samples up to 800 mm in height and 260 mm in maximum rotation radius, with a total CT volume envelope of 510 mm × 600 mm. Its 27 kg payload capacity supports heavy-duty fixtures, multi-layer PCB carriers, and encapsulated modules. The system complies with IEC 61000-6-3 (EMC emissions), IEC 61000-6-2 (immunity), and DIN EN 62471 (photobiological safety). All CT reconstruction pipelines adhere to ASTM E1441 (Standard Guide for Computed Tomography), ISO 15739 (imaging noise measurement), and ISO/IEC 17025 requirements for accredited testing laboratories. Audit-ready data provenance—including raw projection metadata, calibration logs, and reconstruction parameters—is maintained per FDA 21 CFR Part 11 and GLP/GMP traceability standards.
Software & Data Management
Powered by YXLON’s proprietary CT software suite (v5.2+), the system provides integrated acquisition control, GPU-accelerated FDK and iterative reconstruction (SART, OS-SART), and quantitative analysis tools including porosity mapping, wall thickness analysis, GD&T deviation reporting, and BGA void fraction calculation. All datasets are stored in DICOM-RT compliant format with embedded EXIF-like metadata (source kV/mA, filtration, exposure time, detector binning, motion axis positions). The software supports automated report generation (PDF/HTML) with configurable templates aligned to IPC-A-610, J-STD-001, and JEDEC JESD22-B111 standards. Data export interfaces include Python API (via RESTful endpoints), MATLAB-compatible .mat files, and STL/OBJ mesh exports for CAE integration.
Applications
- Failure analysis of solder joint voiding, microcracks, and intermetallic formation in >1000-pin BGAs on PCBs exceeding 300 mm in length
- Dimensional verification of embedded copper traces, via fill ratios, and underfill distribution in fan-out wafer-level packages (FOWLP)
- Non-destructive validation of conformal coating uniformity and delamination in harsh-environment electronics
- Material defect detection in additively manufactured RF shielding housings and heat sinks
- Reverse engineering support for legacy aerospace avionics where disassembly is prohibited
- Quantitative porosity and inclusion analysis in metal-matrix composites used in power electronics substrates
FAQ
What distinguishes ZoomScan from conventional digital zoom or ROI reconstruction?
ZoomScan modifies the physical acquisition geometry—not just image processing—by precisely repositioning the sample between projections to increase local sampling frequency. It yields true enhanced resolution, not interpolated pixels.
Can the FF35 CT perform both full-volume and ROI-CT scans in a single workflow?
Yes. The system supports hierarchical scanning: a low-resolution scout scan identifies target zones, followed by automated transition to ZoomScan mode at user-specified coordinates without manual intervention.
Is ScatterFix 2.0 compatible with dual-source operation?
Yes. ScatterFix 2.0 operates independently per source channel and includes cross-talk compensation models for simultaneous 190/225 kV acquisitions.
Does the system support automated pass/fail reporting against IPC-A-610 Class 3 criteria?
Yes. Customizable rule sets can be scripted in the software to classify void area, bridging, and head-in-pillow defects per IPC-A-610 revision G Annex A.
What level of operator training is required for routine QA use?
YXLON provides certified Level II NDT training (per ISO 9712) as part of installation commissioning, covering radiation safety, scan protocol optimization, and report sign-off workflows compliant with internal QA procedures.
