Zhengye XK32A Online Fully Automated Line Width Inspection System
| Brand | Zhengye |
|---|---|
| Origin | Guangdong, China |
| Manufacturer Type | OEM/ODM Manufacturer |
| Country of Origin | China |
| Model | XK32A |
| Pricing | Available Upon Request |
Overview
The Zhengye XK32A Online Fully Automated Line Width Inspection System is an industrial-grade optical metrology platform engineered for non-contact, real-time dimensional analysis of printed circuit board (PCB) features during mid-process fabrication. It operates on the principle of high-resolution digital imaging metrology—utilizing a calibrated coaxial illumination system and a precision-aligned monochrome CMOS camera to capture orthographic top-down images of PCB substrates immediately after development and etching, but prior to solder mask application. The system delivers traceable, repeatable measurements of critical geometric parameters—including upper and lower line width (line taper), center-to-center pitch, circular via diameter, and gold finger width—against user-defined GD&T tolerances. Designed for integration into inline PCB production lines, the XK32A supports continuous 24/7 operation with minimal operator intervention, delivering measurement data at cycle times compatible with high-throughput manufacturing environments (≤3–5 seconds per field-of-view). Its architecture complies with fundamental requirements for in-process quality control under IPC-6012, IPC-A-600, and ISO 9001:2015 quality management frameworks.
Key Features
- Fully automated image acquisition and analysis—no manual calibration or frame repositioning required between successive boards
- Coaxial LED illumination system optimized for uniform contrast enhancement across copper traces, minimizing shadow artifacts and edge diffusion
- Sub-pixel edge detection algorithm with sub-micron resolution (typical repeatability ±0.5 µm at 20× magnification)
- Real-time pass/fail classification based on configurable tolerance bands per feature type (e.g., ±5 µm for fine-pitch lines, ±8 µm for gold fingers)
- Modular hardware design supporting integration with conveyor-based transport systems and SECS/GEM-compatible factory automation interfaces
- Robust mechanical housing rated IP54 for resistance to dust and incidental splashes in typical PCB cleanroom-adjacent environments
Sample Compatibility & Compliance
The XK32A accommodates standard rigid and flex-rigid PCB substrates ranging from 100 mm × 100 mm up to 600 mm × 600 mm (custom larger formats available upon request), with thicknesses from 0.05 mm to 3.2 mm. It supports both single- and double-sided inspection modes, and is validated for use on bare copper, tin-lead, immersion silver, and ENIG surface finishes. Measurement traceability aligns with ISO/IEC 17025 principles through documented calibration procedures using NIST-traceable step gauges and certified photomask standards. All measurement logic and reporting workflows are structured to support internal audit readiness for IPC Class 2 and Class 3 product certification, as well as customer-specific PPAP documentation requirements.
Software & Data Management
The proprietary VisionMetro Pro software suite (v4.2+) provides a Windows-based interface with role-based access control, full audit trail logging (including user ID, timestamp, parameter edits, and result overrides), and export capabilities compliant with FDA 21 CFR Part 11 for electronic records and signatures. Measurement reports are generated in PDF and CSV formats, with optional integration into MES platforms via OPC UA or RESTful API endpoints. Statistical process control (SPC) modules include X-bar/R charts, capability indices (Cp/Cpk), and trend analysis over time—enabling proactive identification of tool wear, etch drift, or photolithography variability. Software updates are delivered through secure, authenticated firmware channels with version-controlled release notes and backward compatibility guarantees.
Applications
- In-line verification of trace geometry post-etch on HDI, RF/microwave, and 5G mmWave PCBs
- Process validation for advanced packaging substrates (ABF, Ajinomoto Build-up Film)
- First-article inspection and periodic process capability studies per IPC-TM-650 Section 2.2.15
- Root cause analysis of open-circuit defects linked to insufficient line width or excessive undercut
- Supporting APQP Stage 3 (Production Trial Run) and PPAP Level 3 submissions for Tier-1 automotive suppliers
FAQ
What is the minimum measurable line width supported by the XK32A?
The system achieves reliable detection down to 25 µm line width at standard working distance, contingent upon substrate surface finish and optical contrast.
Does the XK32A support automatic defect classification beyond dimensional checks?
Yes—optional AI-assisted anomaly detection module (add-on license) identifies bridging, notching, and micro-tearing based on trained convolutional neural networks.
Can the system be retrofitted onto existing conveyor lines?
Yes—the base unit includes adjustable mounting brackets and standardized pneumatic/electrical I/O interfaces compatible with most Class A PCB handling systems.
Is remote diagnostics and software support available internationally?
Zhengye provides 24/5 remote technical assistance via encrypted TeamViewer sessions, with SLA-backed response times for critical issues (≤2 business hours for P1 escalations).
