Semiconductor Instruments
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| Brand | Annealsys |
|---|---|
| Origin | France |
| Model | Zenith-100 |
| Instrument Type | High-Vacuum Rapid Thermal Annealing Furnace |
| Maximum Sample Diameter | 6-inch (150 mm) |
| Temperature Range | 0–2000 °C |
| Maximum Heating Rate | 150 °C/s |
| Maximum Cooling Rate | 200 °C/s |
| Temperature Accuracy | ±1 °C |
| Temperature Uniformity | ±1% across wafer surface |
| Chamber Construction | Stainless steel, water-cooled cold-wall design |
| Standard Atmospheres | High vacuum, inert (N₂, Ar), reducing (H₂/N₂ mix) |
| Mandatory Pumping | Turbo-molecular pump required |
| Temperature Sensors | Dual-mode — calibrated pyrometer (for >600 °C) and type C thermocouple (for full range) |
| Control System | Digital PID with real-time feedback and ramp-soak profiling |
| Compliance | Designed for GLP-compliant R&D environments |
| Brand | Anric |
|---|---|
| Origin | USA |
| Manufacturer Type | Authorized Distributor |
| Origin Category | Imported |
| Model | AT |
| Substrate Size | 4–6 inch |
| Process Temperature Range | RT to 350 °C |
| Precursor Channels | 5 |
| Weight | 50–70 kg |
| Dimensions (W × H × D) | 50 cm × 75 cm × 75 cm |
| Thickness Uniformity | ±1% |
| Brand | Anric |
|---|---|
| Model | AT |
| Type | Desktop Atomic Layer Deposition (ALD) System |
| Origin | USA |
| Chamber Temperature Range | RT–350 °C |
| Precursor Source Temperature Range | RT–150 °C |
| Process Pressure Range | 0.1–1.5 Torr |
| Maximum Precursor Sources | 5 |
| Substrate Compatibility | Up to 4″ wafers (expandable to 6″) |
| Cycle Time | 6–10 cycles per minute |
| Control Interface | Touchscreen PLC |
| Chamber Architecture | Compact, R&D-Optimized |
| Brand | ANRIC |
|---|---|
| Origin | USA |
| Manufacturer Type | Authorized Distributor |
| Origin Category | Imported |
| Model | AT200M |
| Pricing | Upon Request |
| Footprint | 14 in × 15 in × 14.5 in (35.5 cm × 38.1 cm × 36.5 cm) |
| Chamber Volume | ~15 in³ (38.1 cm³) |
| Substrate Capacity | Up to four 2-inch wafers (square or circular) |
| Precursor Ports | Standard 2-port (1 precursor + 1 reactant) |
| Precursor Temp Range | RT to 180 °C ±2 °C (heated jacket) |
| Chamber Temp Range | RT to 300 °C ±1 °C (optional chuck heating to 450 °C+) |
| Plasma Source Option | 13.56 MHz, 80 W hollow cathode plasma (AT200M Plus) |
| Control Interface | 5-inch PLC-driven touchscreen HMI (Windows Ethernet remote access enabled) |
| Materials | Semiconductor-grade stainless steel chamber with metal-sealed fittings, heated manifolds, ultra-fast ALD valves with integrated inert gas purge (UHP N₂ >99.9995%) |
| Compliance | Cleanroom-compatible design |
| Brand | ANRIC |
|---|---|
| Origin | USA |
| Manufacturer Type | Authorized Distributor |
| Origin Category | Imported |
| Model | AT410 |
| Pricing | Upon Request |
| Brand | ANRIC |
|---|---|
| Origin | USA |
| Manufacturer Type | Authorized Distributor |
| Origin Category | Imported |
| Model | AT610 |
| Pricing | Upon Request |
| Brand | ANRIC |
|---|---|
| Origin | USA |
| Manufacturer Type | Authorized Distributor |
| Origin Category | Imported |
| Model | AT650/850P |
| Pricing | Upon Request |
| Brand | ANRIC |
|---|---|
| Origin | USA |
| Manufacturer Type | Authorized Distributor |
| Origin Category | Imported |
| Model | AT650/850T |
| Pricing | Upon Request |
| Brand | ANRIC |
|---|---|
| Origin | USA |
| Manufacturer Type | Authorized Distributor |
| Origin Category | Imported |
| Model | AT810 |
| Pricing | Upon Request |
| Origin | Beijing, China |
|---|---|
| Manufacturer Type | Distributor |
| Origin Category | Domestic |
| Model | EZH-S |
| Price Range | USD 2,800 – 7,000 |
| Max. Rotation Speed | 5000 rpm |
| Speed Resolution | 1 rpm |
| Max. Acceleration | 50000 rpm/s |
| Substrate Diameter | 50 mm (2") |
| Chamber Diameter | 180 mm |
| Heating Plate Diameter | Φ30 mm (customizable) |
| Temperature Range | Ambient to 150 °C |
| Temp. Resolution | 0.1 °C |
| Temp. Stability | ±0.5 °C (steady-state), ±2 °C (during spin-up/down) |
| Programmable Steps | 100 steps × 100 programs |
| Dispense Port | 1-channel auto-dosing |
| Power Input | AC 220 V, 5 A |
| Heating Power | 200 W |
| Motor Power | 200 W |
| Weight | 15 kg |
| Origin | Beijing, China |
|---|---|
| Manufacturer Type | Distributor |
| Origin Category | Domestic |
| Model | SC200-SE |
| Price Range | USD 7,000 – 14,000 (FOB) |
| Max Rotation Speed | 0–5000 rpm |
| Speed Resolution | 1 rpm/s |
| Max Acceleration | 10,000 rpm/s |
| Substrate Diameter | 304.8 mm (12″) |
| Chamber Diameter | 440 mm |
| Speed Stability | < ±1 rpm |
| Time Resolution | 0.1 s/step |
| Programs | 100 × 100 steps |
| Uniformity | < ±3% (6″ measurement area, edge exclusion of 3 mm) |
| Motor | 400 W industrial servo motor |
| Enclosure Material | Electropolished stainless steel (316L-grade compatible) |
| Chamber Lining | PTFE-coated or polyethylene bowl |
| Control Interface | 7″ capacitive touchscreen HMI |
| Exhaust Location | Bottom-mounted, integrated with chuck base |
| Dimensions (W×D×H) | 463 × 613 × 306 mm |
| Brand | Ansys |
|---|---|
| Origin | USA |
| Manufacturer Type | Original Equipment Manufacturer (OEM) |
| Product Category | Imported Instrument |
| Model | Apogee 450 |
| Rotation Speed | 0–30,000 rpm/s (no-load) |
| Speed Accuracy | ±0.2 rpm |
| Speed Resolution | <0.2 rpm |
| Max Acceleration | 0–3000 rpm/s (with 350 mm × 6 mm embedded chuck) |
| Substrate Compatibility | Ø10 mm to Ø450 mm wafers |
| Step Time Resolution | 0.1 s (max step duration: 9999.9 s) |
| GUI | Full-color 7″ capacitive touchscreen with alphanumeric graphical interface |
| Data Interface | USB 2.0, Ethernet (10/100 Mbps), StreamSync™ communication protocol |
| Vacuum & Lid Interlock | Yes |
| Chamber Material | HDPE (High-Density Polyethylene) spin bowl |
| Optional Features | N₂ purging for inert ambient, X-PRO standalone workstation integration, overhead exhaust hood with chemical fume containment |
| Brand | Apogee |
|---|---|
| Origin | USA |
| Manufacturer | Apogee Instruments, Inc. |
| Model | Apogee200 |
| Rotation Speed Range | 0–30,000 rpm (no-load) |
| Speed Accuracy | ±0.2 rpm |
| Acceleration | 0–30,000 rpm/s (no-load) |
| Step Time Resolution | 0.1 s (max step duration: 9999.9 s) |
| Substrate Compatibility | Ø1 mm to Ø200 mm circular |
| Chamber Material | HDPE (High-Density Polyethylene) |
| Power Input | 100–125 VAC / 208–240 VAC, 50/60 Hz |
| Max Power Consumption | 655 W |
| Vacuum Range | 20–25 inHg |
| Exhaust Flow | 20–50 CFM at 0.2″ H₂O |
| N₂/CDA Supply | 70 psi |
| Dimensions (W×D×H) | 13.25″×19″×12″ (33.65×48.26×30.48 cm) |
| Net Weight | 40 lb (18.14 kg) |
| Shipping Weight | 100 lb (45.36 kg) |
| Brand | Appo |
|---|---|
| Origin | Shanghai, China |
| Model | NIL-100 |
| Imprint Area | 4-inch (100 mm) wafers/substrates |
| Max. Pressure | 8 bar (integrated air compressor), 20 bar (external cleanroom supply) |
| Temperature Range | Ambient to 250 °C |
| UV Source | 400 W high-pressure Hg lamp, dominant wavelength 365 nm |
| Vacuum Level | ≤10 Pa |
| Heating Method | Electromagnetic single-side heating |
| Automation | Motorized auto-demolding |
| Compatible imprint modes | Thermal embossing & UV-curable step-and-flash imprint lithography (S-FIL) |
| Optional consumables | Full suite of nanoimprint resists (thermal, UV-curable, lift-off, deep-etch), anti-sticking agents, adhesion promoters, and custom mold fabrication support (Ni, SFP®, Hybrid Mold®) |
| Resolution capability | ≤20 nm (with appropriate mold and process optimization) |
| Compliance | Designed for R&D and pilot-line use under GLP-aligned lab practices |
| Brand | Appsilon |
|---|---|
| Origin | Netherlands |
| Manufacturer Type | Authorized Distributor |
| Product Category | Imported Equipment |
| Model | MPCVD |
| Heating Method | Microwave Plasma Excitation |
| Application Domain | Semiconductor & Advanced Materials Research |
| Deposition Rate | Configurable per process recipe (typical range: 0.1–10 µm/h for diamond) |
| Process Gases | H₂, CH₄, N₂, O₂, Ar (gas mixing and mass flow control standard) |
| Deposited Films | Single-crystal & polycrystalline diamond, doped diamond (B/N/Si), diamond-like carbon (DLC), SiC, AlN |
| Base Vacuum | ≤5 × 10⁻⁷ mbar (with turbomolecular pumping system) |
| Operating Pressure Range | 10–200 mbar (microwave-coupled plasma stable across full range) |
| Chamber Internal Dimensions | Ø200 mm × 300 mm (standard configuration |
| Brand | Appsilon |
|---|---|
| Origin | Germany |
| Model | Appsilon MP |
| Deposition Principle | Microwave Plasma Chemical Vapor Deposition (MPCVD) |
| Substrate Compatibility | Ir / YSZ / Si (100 mm diameter) |
| Output Material | Free-standing single-crystal diamond wafers (Ø92 mm, 155 ct) |
| Crystal Orientations Available | 4p Geo A, 4p Geo B, 2p Type I, 2p Type II, seed crystals, custom geometries |
| Optical Tolerance | ±0.25 / –0.00 mm (standard), ±0.05 / –0.00 mm (optional) |
| Application Domain | Fourth-generation semiconductor development, optical components (ATR prisms), precision cutting tools, biomedical instruments |
| Brand | ARMS SYSTEM |
|---|---|
| Origin | Japan |
| Manufacturer Status | Authorized Distributor |
| Product Origin | Imported |
| Model | UTA-IA |
| Exposure Mode | Projection-Based |
| Resolution | 1–2 µm |
| Light Source | High-Power LED |
| Wavelength Range | Visible Spectrum (400–700 nm) |
| Maximum Exposure Field | 2.5 mm × 1.5 mm |
| Minimum Patterned Area | 100 µm × 100 µm |
| Optical Architecture | Integrated Metallurgical Microscope + DLP Digital Micromirror Device (DMD) Projection Engine |
| Software-Controlled Pattern Generation | Yes |
| Compatibility | Standalone or Coupled to User-Provided Microscope (Optional Adapter Kit) |
| Brand | Arradiance |
|---|---|
| Origin | USA |
| Model | GEMStar-8 XT |
| Substrate Size | 8-inch (200 mm) |
| Process Temperature | Up to 500 °C |
| Precursor Channels | 8 |
| System Weight | 150 kg |
| Thickness Uniformity | ≤1.5% (across 8-inch wafer) |
| Dimensions | 78 × 56 × 28 cm |
| Thermal Wall | 300 °C aluminum heated chamber |
| Precursor Bottle Temp | up to 175 °C |
| Transport Line Temp | up to 200 °C |
| Plasma Option | ICP-based, 13.56 MHz, 300 W, air-cooled |
| MFC-Controlled Gas Lines | 4 (3 process gases + 1 carrier) |
| Vacuum Interface | Standard CF-40 flanges |
| Compatible With | In-situ metrology modules, powder deposition kits, load-lock, QCM thickness monitoring, ozone generator |
| Brand | Arradiance |
|---|---|
| Origin | USA |
| Model | GEMStar-8 XT |
| Substrate Size | 8-inch (200 mm) |
| Process Temperature | Up to 500 °C |
| Precursor Channels | 8 |
| System Weight | 150 kg |
| Thickness Uniformity | ≤1.5% (across 8-inch wafer) |
| Dimensions | 78 × 56 × 28 cm |
| Thermal Wall | 300 °C aluminum heated chamber |
| Precursor Bottle Temp | up to 175 °C |
| Transport Line Temp | up to 200 °C |
| Plasma Option | ICP-based, 13.56 MHz, 300 W, air-cooled |
| MFC-Controlled Gas Lines | 4 (3 process gases + 1 carrier) |
| Vacuum Interface | Standard CF-40 flanges |
| Compatible Add-ons | In-situ ellipsometry, powder deposition module, load lock, QCM thickness monitor, ozone generator, heated sample stage (500 °C) |
| Brand | Arradiance |
|---|---|
| Origin | USA |
| Model | GEMStar-8 XT |
| Substrate Size | Up to 200 mm (8-inch) wafers |
| Process Temperature | 300°C aluminum alloy hot-wall chamber with convective temperature control |
| Precursor Channels | 8 independent precursor lines with CF-40 vacuum flanges |
| Chamber Dimensions (W × H × D) | 78 × 56 × 28 cm |
| Thickness Uniformity | <1% across 200 mm substrate |
| Thermal Uniformity | 99.9% |
| Maximum Sample Thickness | 32 mm |
| Plasma Option | Integrated 13.56 MHz ICP plasma source (300 W, air-cooled) |
| Mass Flow Controllers | 4 MFCs (3 for plasma gases, 1 for carrier gas) |
| Compliance | CF-40 standard vacuum interface, glovebox-compatible side-mount configuration |
| Brand | ARS |
|---|---|
| Origin | USA |
| Model | PS-L |
| Product Category | Temperature-Controlled Probe Station |
| Operation Type | Semi-Automatic |
| Cooling Method | Open-Cycle Cryostat (Liquid He / Liquid N₂) |
| Base Temperature | ~4 K (with LHe) or ~77 K (with LN₂) |
| Temperature Range | 4–400 K (extendable to 500 K or 800 K) |
| Temperature Stability | < ±50 mK |
| Vacuum Chamber | 10-inch welded stainless steel |
| Radiation Shield | 8-inch nickel-plated oxygen-free copper (OFHC) |
| Sample Stage | 2.25-inch gold-plated OFHC, grounded (optional insulated or biased) |
| Microscope | 7:1 zoom, ≤3 µm resolution, coaxial/ring illumination, 24″ HD monitor |
| Vibration Isolation | Triple-stage, sample stage vibration < 100 nm |
| Probe Arms | Up to 8 manually driven 3D micropositioners (X: 2″, Y: 1–2″, Z: 0.5″, 5 µm sensitivity) |
| Temperature Monitoring | Four calibrated DT-670 sensors (including DT-670-CU-4M at sample proximity) and two heaters (50 W on stage, 100 W on shield) |
| Controller | Lake Shore LS336 4-channel temperature controller with cryostat interface cables |
| Optional Upgrades | 16:1 microscope, 4″ sample stage, RF/microwave probes (up to 67 GHz), fiber-optic probe arms, motorized positioning |
| Brand | ARS |
|---|---|
| Origin | USA |
| Manufacturer Type | Authorized Distributor |
| Origin Category | Imported |
| Model | PSF-10-4 |
| Price Range | USD $65,000 – $130,000 |
| Product Category | Temperature-Controlled Probe Station |
| Operation Mode | Semi-Automatic |
| Temperature Range | 7 K – 400 K (configurable down to <4 K with DE215 cold head) |
| Vacuum Chamber | 10-inch welded stainless steel |
| Radiation Shield | 8-inch nickel-plated OFHC copper |
| Sample Stage | 2.25-inch gold-plated OFHC copper, thermally anchored to cold head |
| Optical Viewports | High-purity quartz window + sapphire cold shield window |
| Microscope | Standard 7:1 zoom optics (3 µm resolution, 89 mm working distance) |
| Probe Arms | Up to six 3-axis micromanipulators (manual drive, 2″ X / 1″ Y / 0.5″ Z travel, 5 µm sensitivity) |
| Cooling Method | Closed-cycle helium refrigeration (no liquid cryogens) |
| Vibration Performance | <1 µm total stage motion |
| Temperature Control | Four-channel precision controller with calibrated DT-670 series sensors (±12 mK accuracy), dual heating zones (50 W stage heater + 100 W radiation shield heater) |
| Compliance | Designed for ASTM F1788, ISO/IEC 17025-compliant lab environments |
| Brand | ARS |
|---|---|
| Origin | USA |
| Model | PSG-SM |
| Product Category | Cryogenic Temperature-Controlled Probe Station |
| Operation Mode | Semi-Automatic |
| Cooling Method | Dual-Cryocooler Closed-Cycle Refrigeration (DE210/DE215) |
| Base Temperature | <4 K |
| Temperature Range | 5 K–350 K (optional high-temp stage up to 800 K) |
| Magnetic Field | ±3 T vertical (optional ±6 T or vector magnet) |
| Vacuum Chamber | 11″ stainless steel |
| Sample Stage Diameter | 1.75″ (supports 2″ wafers) |
| Vibration Level | <1 µm RMS |
| Microscopy | Standard 7:1 zoom lens (3 µm resolution), optional 16:1 (2 µm resolution) |
| Probe Arm Configurations | DC/LF, RF (up to 67 GHz), optical fiber (UV–Vis–IR) |
| Temperature Stability | <50 mK |
| Pump-Down Time | ~120 min |
| Cool-Down Time to 10 K | ~5 h (DE210S) |
| Brand | ART Photonics |
|---|---|
| Origin | Germany |
| Model | ATR-P-D-6-30-150/50 |
| Tip Material | Diamond (D) |
| Prism Diameter | 6 mm |
| Path Length | 30 µm |
| Fiber Core Diameter | 150 µm |
| Cladding Diameter | 50 µm |
| Probe Shaft Length | 300 ± 5 mm |
| Total Length | 1.5 ± 0.05 m |
| Fiber Length | 1.2 m |
| Connector Type | SMA905 |
| Sheath Material | Stainless Steel with Polymer Coating |
| Shaft Material | Hastelloy C22 |
| Brand | Artifex |
|---|---|
| Origin | Germany |
| Model | LIV100 (F/L/XL versions), LIV120, LDD100 |
| Current Range | 250 mA – 1200 A |
| Pulse Width Range | 150 ns – 3 s |
| Rise Time | 25 ns (LDD100) to 1 µs (LIV100-XL) |
| Wavelength Coverage | 250–1100 nm & 400–1650 nm |
| Interface | USB 2.0 |
| Measurement Mode | Pulsed (LIV100), Pulsed/QCW/CW (LIV120), Programmable Analog Current Source (LDD100) |
| Compliance | Designed for ISO/IEC 17025-aligned lab environments |
| Software | PC-based GUI with automated PDF report generation, audit-trail-ready configuration logging |
| Brand | ASIDA |
|---|---|
| Model | LJ101A |
| Origin | Guangdong, China |
| Type | PCB/FPC Character Marking System |
| Print Resolution | 720×720 dpi / 720×1440 dpi |
| Max. PCB Size | 660×610 mm |
| Min. PCB Size | 170×220 mm |
| PCB Thickness Range | 0.1–6 mm |
| Minimum Line Width | 70 µm |
| Minimum Character Height | 0.5 mm |
| Printhead | KM1024 (14 pL) |
| Positioning Accuracy | ≤35 µm (CCD-based 3-point registration) |
| Print Speed | ≤70 s per side (for 24″×18″ panel) |
| Curing | UV LED system with active cooling |
| Power Supply | AC 380 V, 10 A, 50 Hz |
| Air Supply | Dry compressed air, 0.5–0.8 MPa |
| Dimensions (W×D×H) | 1350×1790×1500 mm |
| Weight | 1500 kg |
| Brand | ASIDA |
|---|---|
| Model | LJ101A |
| Origin | Guangdong, China |
| Manufacturer Type | Authorized Distributor |
| Country of Origin | PRC |
| Print Resolution | 720 × 720 dpi / 720 × 1440 dpi |
| PCB Size Range | 170 × 220 mm to 660 × 610 mm |
| PCB Thickness Capacity | 0.1–6 mm |
| Minimum Line Width | 70 µm |
| Minimum Character Height | 0.5 mm |
| Printhead | KM1024 (14 pL drop volume) |
| Print Speed | ≤70 s per side (for 24″ × 18″ panel) |
| Registration Method & Accuracy | CCD-based three-point auto-alignment |
| Curing System | UV LED lamp with active cooling |
| Power Supply | AC 380 V, 10 A, 50 Hz |
| Air Supply | Dry compressed air, 0.5–0.8 MPa |
| Dimensions (W×D×H) | 1350 × 1790 × 1500 mm |
| Weight | 1500 kg |
| Brand | Asida |
|---|---|
| Model | LJ101A |
| Application | Permanent inkjet marking of legends, serial numbers, barcodes, and identifiers on rigid and flexible printed circuit boards (PCBs) |
| Print Resolution | 720 × 720 dpi / 720 × 1440 dpi |
| Max. PCB Size | 660 × 610 mm |
| Min. PCB Size | 170 × 220 mm |
| PCB Thickness Range | 0.1–6 mm |
| Minimum Line Width | 70 µm |
| Minimum Character Height | 0.5 mm |
| Printhead | KM1024 (14 pL drop volume) |
| Positioning Accuracy | ≤35 µm (CCD-based three-point auto-alignment) |
| UV Curing System | Integrated air-cooled UV lamp with instant curing |
| Cycle Time | ≤70 s per side (for 24″ × 18″ panel) |
| Power Supply | AC 380 V, 10 A, 50 Hz |
| Pneumatic Supply | Dry compressed air, 0.5–0.8 MPa |
| Dimensions (W×D×H) | 1350 × 1790 × 1500 mm |
| Weight | 1500 kg |
| Brand | ASML |
|---|---|
| Origin | Netherlands |
| Model | 1460K |
| Type | Contact/Proximity Mask Aligner |
| Application | R&D and low-volume semiconductor prototyping, MEMS, microfluidics, academic cleanroom fabrication |
| Brand | ASML |
|---|---|
| Origin | Netherlands |
| Product Category | Mask Aligner / Stepper-Based Lithography System for Semiconductor Fabrication |
| Models | TWINSCAN XT:1900Gi, XT:2000i, NXT:1980Di, NXT:2050i, NXE:3400B/C, NXE:3600D, EXE:5000 Series |
| Light Source Wavelengths | 248 nm (KrF), 193 nm (ArF dry & immersion), 13.5 nm (EUV) |
| Single-Exposure Resolution | 38 nm (ArF immersion), 13 nm (EUV, NA=0.33), 8 nm (High-NA EUV, NA=0.55) |
| Throughput | Up to 275 wafers/hour (NXT:2050i), ~170 wafers/day (NXE:3400C), target 220 wafers/day (EXE:5000) |
| Supported Process Nodes | 28 nm to sub-2 nm |
| Compliance | ISO 14644-1 Class 1 cleanroom integration, SEMI S2/S8 safety standards, compatible with 300 mm wafer handling automation (SECS/GEM) |