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| Brand | CYKY |
|---|---|
| Origin | Henan, China |
| Manufacturer Type | Direct Manufacturer |
| Model | CY-CVD1200-50 |
| Heating Method | Resistive Tube Furnace (Dual Independent Zones) |
| Maximum Operating Temperature | 1100 °C |
| Vacuum Level | ≤1.0 × 10⁻³ Pa (with Molecular Pumping System) |
| Tube Dimensions | Ø50 mm × 1000 mm (quartz), optional diameters up to Ø100 mm |
| Heating Zone Configuration | 2 × 200 mm independent zones |
| Temperature Uniformity | ±5 °C over 100 mm zone length |
| Temperature Control | 50-segment programmable PID |
| Gas Channels | 3 (N₂, H₂, Ar configurable) |
| Mass Flow Accuracy | ±2.0% FS |
| Gas Inlet/Outlet Interface | 1/4″ VCR + KF16/KF25/KF40 vacuum flanges |
| Pressure Measurement Range | 10⁵ Pa to 1 × 10⁻⁵ Pa (composite gauge) |
| Power Supply | AC 220 V, 50/60 Hz |
| Brand | CYKY |
|---|---|
| Origin | Henan, China |
| Manufacturer Type | Direct Manufacturer |
| Model | CY-MSV325-II |
| Instrument Category | DC Magnetron Sputtering System |
| Application Field | Microelectronics |
| Substrate Diameter | 100 mm |
| Maximum Substrate Temperature | 500 °C |
| Base Pressure | ≤1.0 × 10⁻⁵ Pa |
| Power Supply | Dual 500 W DC |
| Target Configuration | Two Independent 1" or 2" Magnetron Sources |
| Vacuum Chamber | Ø325 mm × 500 mm, SUS304 Stainless Steel |
| Sample Stage | Ø150 mm, Heated (up to 600 °C, ±1 °C stability), Rotatable (0–20 rpm) |
| Gas Control | Standard 1-channel MFC (Ar, 200 SCCM), Optional up to 4-channel MFC |
| Vacuum Pumping | Turbo-molecular pump system (600 L/s nominal speed), Integrated solenoid-valve gas ballast for venting without pump shutdown |
| Optional In-situ Monitoring | Quartz Crystal Thickness Monitor (0.10 Å resolution) |
| Dimensions (W×D×H) | 540 × 540 × 1000 mm |
| Weight | 145 kg |
| Brand | CYKY |
|---|---|
| Origin | Henan, China |
| Manufacturer Type | Direct Manufacturer |
| Equipment Type | DC Magnetron Sputtering Coater |
| Application Field | Microelectronics |
| Substrate Diameter | 100 mm |
| Maximum Substrate Temperature | 500 °C |
| Base Vacuum | 1.0 × 10⁻⁴ Pa |
| Chamber Material | High-Purity Fused Quartz |
| Chamber Dimensions | Ø180 mm × 200 mm |
| Observation Window | Full-360° Transparent Quartz Viewport |
| Target Size | Ø50 mm (2-inch), Thickness ≤ 3 mm |
| DC Power Supply | 300 W, Adjustable |
| Pumping Speed | Turbo Molecular Pump — 600 L/s |
| Vacuum Gauge | Composite Gauge (10⁻⁵–10⁵ Pa) |
| Sample Stage | Rotating & Heated |
| Interface | Intuitive Modular Control Panel |
| Overall Dimensions | 550 mm × 350 mm × 1200 mm |
| Total Power Consumption | 2 kW |
| Brand | CYKY |
|---|---|
| Origin | Henan, China |
| Manufacturer Type | Direct Manufacturer |
| Model | CY-PECVD100-1200 |
| RF Power Supply | 13.56 MHz ±0.005%, 0–300 W output, max reflected power 100 W, reflected power <3 W at full power, stability ±0.1% |
| Tube Material | High-purity quartz |
| Tube OD | 100 mm |
| Furnace Length | 440 mm |
| Heating Zone | Dual-zone (2 × 200 mm) |
| Max Continuous Operating Temperature | 1100 °C |
| Temperature Control Accuracy | ±1 °C |
| Temperature Program | 30-segment programmable PID via LCD touchscreen |
| Vacuum Seal | 304 stainless steel flange |
| Base Pressure | 0.1 Pa (via dual-stage rotary vane pump, 1.1 L/s) |
| Working Pressure Range | –0.15 MPa to +0.15 MPa |
| Gas Channels | 6 independent MFC-controlled lines (H₂, CH₄, C₂H₄, N₂, NH₃, Ar) |
| MFC Ranges | A–C: 0–200 SCCM |
| D–F | 0–500 SCCM |
| MFC Accuracy | ±1.5% F.S. |
| Gas Mixing Tank Volume | 1 L |
| Vacuum Interface | KF16 |
| Gas Fitting | 1/4" VCR-style compression fittings |
| Cooling | Motorized sliding furnace rail for rapid thermal quenching |
| Power Input | AC 220 V, 50 Hz |
| Brand | CYKY |
|---|---|
| Origin | Henan, China |
| Manufacturer Type | Direct Manufacturer |
| Equipment Type | Standard High-Vacuum RTP Furnace |
| Sample Chamber Dimensions | 650 × 1200 × 650 mm (D×W×H) |
| Operating Temperature Range | ≤1000 °C continuous, up to 1050 °C peak |
| Max Recommended Ramp Rate | ≤80 °C/s |
| Maximum Ramp Rate | 200 °C/s |
| Cooling Time from >200 °C | ≤25 min |
| Heating Zone Length | 400 mm |
| Chamber Atmosphere | Vacuum-compatible (optional low/high vacuum systems) |
| Power Supply | AC 220 V, 50/60 Hz, 45 kW |
| Net Weight | 185 kg |
| Heating Element | Imported IR Lamps |
| Temperature Sensor | N-type thermocouple (optional embedded thermocouple for sample-surface monitoring) |
| Control System | Touchscreen PID with auto-tuning, 8-segment programmable ramp/soak profiles |
| Accuracy | ±1 °C |
| Vacuum & Gas Interfaces | Standardized quick-connect ports for vacuum lines and multi-channel gas manifolds |
| Communication | RS-485 interface for PC integration via proprietary software |
| Brand | DAIN HITECH |
|---|---|
| Origin | South Korea |
| Model | DH-OBCP5000 |
| Wafer Compatibility | 6", 8", 12" (flat & notch) |
| OCR Recognition Rate | ≥99.8% |
| Throughput | 90 wafers/hour (12" standard orientation) |
| Printing Method | Thermal Transfer |
| Print Resolution | 305 dpi |
| Max Print Speed | 150 mm/s |
| Label Dimensions | 22–131 mm (W) × 6–356 mm (L) |
| ESD Protection | <100 V (10 s) |
| Acoustic Noise | ≤70 dB(A) |
| UPS Backup Duration | 3 min |
| Safety | Dual emergency stop buttons, magnetic safety sensors on all access doors |
| Software Features | MES integration (T-card scanning), dual-label printing mode, post-print barcode verification, server-based auto-backup, wafer mapping synchronization |
| Brand | DENTON |
|---|---|
| Origin | USA |
| Manufacturer Type | Authorized Distributor |
| Origin Category | Imported |
| Model | Voyager |
| Price Range | USD $38,000 – $64,000 |
| Key | Brand: DJ MicroLaminates |
|---|---|
| Origin | USA |
| Product Type | Dry Film Photoresist (DFR) |
| Chemistry | Cationic UV-Curable Modified Epoxy |
| Tone | Negative |
| Exposure Range | 350–400 nm UV |
| Thickness Options | 5 µm to >1 mm (standard: 100, 150, 200, 250, 350, 500, 650, 750 µm, 1 mm) |
| Substrate Compatibility | Si, SiNₓ, Cu, Au, glass, polymers, oxides |
| Storage Condition | Acclimate 15–18 h at 21–25 °C prior to lamination |
| Processing Time | <5 min total |
| Brand | Durham Magneto Optics |
|---|---|
| Origin | United Kingdom |
| Model | MicroWriter ML3 |
| Exposure Mode | Projection-Based |
| Resolution Options | 0.6 µm, 1 µm, 2 µm, 5 µm |
| Light Source | LED |
| Wavelengths | 385 nm and 405 nm |
| Maximum Exposure Area | 195 mm × 195 mm |
| Dimensions | 700 mm × 700 mm × 700 mm |
| Software Platform | Windows 10-native MicroWriter Control Suite with Clewin GDS/DXF Import |
| Alignment Microscope | Motorized Zoom (×3/×5/×10/×20), Auto-Switching |
| Overlay Accuracy | ±0.5 µm (Flagship Configuration) |
| Z-Axis Positioning Resolution | 50 nm |
| Optical Profilometry Vertical Resolution | 100 nm |
| Grayscale Lithography Support | 255-level intensity modulation |
| Stage Minimum Step Size | 50 nm |
| Auto-Focus | Real-time FocusLock™ Surface Height Mapping and Z-Compensation |
| Brand | E+H Metrology |
|---|---|
| Origin | Germany |
| Manufacturer Type | Authorized Distributor |
| Origin Category | Imported |
| Model | MX 1012 |
| Pricing | Upon Request |
| Wafer Diameter | 200 mm, 300 mm |
| Accuracy | ±0.1 µm |
| Resolution | 10 nm |
| Spatial Resolution | 1 mm |
| Max Scan Passes | 8 |
| Software | MX-NT |
| Brand | E+H Metrology |
|---|---|
| Origin | Germany |
| Manufacturer Type | Authorized Distributor |
| Origin Category | Imported |
| Model | MX 1018 |
| Pricing | Upon Request |
| Wafer Diameters | 200 mm, 300 mm, 450 mm |
| Measurement Accuracy | ±0.3 µm |
| Vertical Resolution | 10 nm |
| Lateral Spatial Resolution | 1 mm |
| Scan Profiles | Up to 8 radial scans (standard: 4 at 45° intervals) |
| Software Platform | MX-NT |
| Measurement Types | Single-point thickness, full-surface TTV, bow, warp, site flatness |
| Brand | E+H Metrology |
|---|---|
| Origin | Germany |
| Model | MX 102-6 / MX 102-8 |
| Wafer Diameter Support | 100 mm, 125 mm, 150 mm, 200 mm |
| Measurement Accuracy | ±0.1 µm |
| Resolution | 10 nm |
| Spatial Resolution | 1 mm |
| Scan Profiles | 4 radial profiles at 45° intervals |
| Software | MX-NT |
| Application | Thickness & TTV metrology post-grinding and post-lapping |
| Brand | E+H Metrology |
|---|---|
| Origin | Germany |
| Manufacturer Type | Authorized Distributor |
| Origin Category | Imported |
| Model | MX 2012 |
| Pricing | Available Upon Request |
| Wafer Diameter | 300 mm (configurable for 200 mm) |
| Measurement Accuracy | ±0.5 µm |
| Resolution | 50 nm |
| Thickness Range | 500–1000 µm |
| Measurement Points | 69 |
| TTV (Total Thickness Variation) | Supported |
| Bow & Warp | Supported |
| Stress Evaluation | Optional |
| Measurement Orientation | Vertical (gravity-compensated) |
| Automation Level | Semi-automated (manual load/unload, automated measurement cycle) |
| Software | MX-NT |
| Sensor Principle | Capacitive displacement sensing |
| Probe Architecture | Dual orthogonal aluminum plates (1″ thick), each embedded with 69 capacitive sensors |
| Positioning Repeatability | ≤0.1 µm |
| Vacuum Fixture | Triple-circuit independent vacuum suction with dielectric-compensated polymer membrane |
| Brand | E+H Metrology |
|---|---|
| Origin | Germany |
| Manufacturer Type | Authorized Distributor |
| Origin Category | Imported |
| Model | MX 204 |
| Pricing | Available Upon Request |
| Wafer Diameter | 100 mm, 125 mm, 150 mm, 200 mm, 300 mm |
| Thickness Accuracy | ±0.5 µm to ±1.0 µm |
| Thickness Resolution | 75 nm to 1.0 µm |
| Thickness Range | 100–1000 µm |
| Measurement Principle | Dual-Sided Capacitive Sensing |
| Measured Parameters | Thickness, Total Thickness Variation (TTV), Bow, Warp, Surface Flatness, Stress-Induced Deformation |
| Brand | E+H Metrology |
|---|---|
| Origin | Germany |
| Model | MX 301 |
| Wafer Diameters Supported | 50 mm, 75 mm, 100 mm, 150 mm, 200 mm, 300 mm |
| Thickness Accuracy | ±0.5 µm |
| Resolution | 10 nm |
| Dynamic Range | 800 µm |
| Standard Thickness Range | 0–1600 µm |
| Measurement Principle | Dual-Sided Capacitive Distance Sensing |
| Calibration Method | Certified Gauge Blocks |
| Output Interface | RS-232 Serial Interface |
| Display | 5-Digit LED |
| Brand | E+H Metrology |
|---|---|
| Origin | Germany |
| Manufacturer Type | Authorized Distributor |
| Origin Category | Imported |
| Model | MX 7012 |
| Pricing | Upon Request |
| Brand | E+H Metrology |
|---|---|
| Origin | Germany |
| Model | MX 604-ST |
| Wafer Diameter | 50–200 mm |
| Thickness Range | 60–300 µm or 250–750 µm |
| Thickness Accuracy | ±1 µm |
| Sensor Active Diameter | 8 mm |
| Sensor Housing Diameter | 20 mm |
| Edge Exclusion Distance | 10 mm |
| Measurement Time per Point | 0.3 s |
| Sheet Resistance Range | 10–2000 Ω/sq |
| Resistivity Range | 0.25–50 Ω·cm (at 250 µm) / 0.75–150 Ω·cm (at 750 µm) |
| Software | EHMaster |
| Brand | E+H Metrology |
|---|---|
| Origin | Germany |
| Model | MX 608 |
| Wafer Sizes Supported | 4", 5", 6", 8" |
| Thickness Range | 300–800 µm (standard 500–800 µm) |
| Max. Warp | 100 µm |
| Resistivity Range | 0.001–200 Ω·cm |
| Thickness Accuracy | ±0.3 µm |
| TTV Accuracy | ±0.1 µm |
| Thickness Resolution | ±0.05 µm |
| Resistivity Accuracy | ±1% (0.001–30 Ω·cm), ±2% (30–100 Ω·cm), ±5% (100–200 Ω·cm) |
| Measurement Time | 7 s (single-point center), 10 s (full radial scan, 180 points on 8″ wafer), ~3 min (18 angular scans × 180 points = 3240-point full mapping) |
| Brand | ECI / ECI TECHNOLOGY |
|---|---|
| Origin | USA |
| Manufacturer Type | Authorized Distributor |
| Origin Category | Imported |
| Model | QC-100 |
| Pricing | Upon Request |
| Brand | ECI TECHNOLOGY |
|---|---|
| Origin | USA |
| Model | QL-10EZ |
| Sample Capacity | 15-position autosampler carousel |
| Automation Level | Fully automated CVS analysis with integrated syringe dispensing, electrode head exchange, and multi-task sequencing |
| Software Platform | Qualilab® v5.x with FDA 21 CFR Part 11–compliant audit trail, LIMS XML export (ASTM E1482), statistical process control (SPC) tools, and R&D mode |
| Compliance | Designed for GLP/GMP environments |
| Brand | ECOPIA |
|---|---|
| Origin | South Korea |
| Model | EPS-300 / EPS-500 / EPS-1000 |
| Type | Manual probe station |
| Category | Temperature-controlled probe station |
| Compliance | Designed for ISO/IEC 17025-compliant lab environments, compatible with ASTM F1768 and SEMI S2/S8 safety standards |
| Software Interface | Analog signal output (BNC), optional digital I/O for external controller integration |
| Stage Travel | X/Y fine adjustment via micrometer drives (10 µm resolution), Z-axis manual lift with locking mechanism |
| Maximum Wafer Size | EPS-300: up to 4″ |
| EPS-500 | up to 6″ |
| EPS-1000 | up to 8″ |
| Thermal Options | Optional heated chuck (−40 °C to +200 °C) available on EPS-500 and EPS-1000 |
| Vacuum Compatibility | Standard vacuum-compatible baseplate (10⁻³ mbar) for glovebox or controlled-atmosphere integration |
| Brand | ECOPIA |
|---|---|
| Origin | South Korea |
| Model | HMS-3000 / HMS-5000 |
| Current Source Range | 1 nA – 20 mA |
| Resistivity Range | 10⁻⁵ – 10⁷ Ω·cm |
| Carrier Concentration Range | 1×10⁷ – 1×10²¹ cm⁻³ |
| Mobility Range | 1 – 1×10⁷ cm²/V·s |
| Magnetic Field Options | 0.37 T, 0.55 T, 1 T fixed |
| Sample Temperature | Ambient or 77 K (liquid nitrogen) |
| Sample Size Compatibility | 5×5 mm to 20×20 mm (optional 30 mm or 2-inch wafers) |
| Software Platform | Windows XP–10 compatible |
| Compliance | CE certified (July 2004) |
| Brand | ECOPIA |
|---|---|
| Origin | South Korea |
| Model | RTP-1300 |
| Sample Size | 150 mm (6-inch compatible) |
| Max Temperature | 1200 °C |
| Max Ramp Rate | 150 K/s |
| Cool-down Rate | 200 K/s |
| Temp Accuracy | ±1% of setpoint |
| Temp Uniformity | ±1.5% across wafer |
| Atmosphere Options | Vacuum (10⁻³ Torr, optional mechanical pump), N₂, O₂, H₂, Ar, or ambient air |
| Heating Source | 12 or 18 halogen infrared lamps (1.2 kW each) |
| Control Software | Integrated RTP-specific GUI with recipe management, real-time profiling, and data logging |
| Power Supply | 220 V AC, single- or three-phase |
| Dimensions (W×D×H) | 500 × 400 × 500 mm |
| Net Weight | 60 kg |
| Brand | EHC |
|---|---|
| Origin | Japan |
| Model | KCRK-07 |
| Type | Precision Alignment Cell Fixture for Cholesteric Pitch Characterization |
| Application | Optical Metrology of Chiral Nematic Liquid Crystals |
| Origin | Japan |
|---|---|
| Manufacturer Type | Authorized Distributor |
| Origin Category | Imported |
| Model | EIS-200 |
| Pricing | Available Upon Request |
| Origin | Japan |
|---|---|
| Manufacturer Type | Authorized Distributor |
| Origin Category | Imported |
| Model | ELS-F125 |
| Pricing | Available Upon Request |
| Brand | ELIONIX INC. |
|---|---|
| Origin | Japan |
| Manufacturer Type | Authorized Distributor |
| Origin Category | Imported |
| Model | ELS-F150 |
| Price Range | USD 1.6–2.7 million (FOB Japan) |
| Brand | ZENO |
|---|---|
| Model | E100 |
| Type | Spectroscopic Ellipsometer |
| Form Factor | Benchtop |
| Measurement Principle | Null- and Rotating-Analyzer-Based Spectroscopic Ellipsometry (SE) |
| Wavelength Range | 240–1700 nm (configurable UV-VIS-NIR) |
| Spot Size | Standard 3 mm Ø |
| Substrate Compatibility | 4″ to 12″ wafers, irregular shapes, rigid/flexible substrates |
| Measured Parameters | Film thickness (sub-nm resolution), complex refractive index (n + ik), extinction coefficient (k), interfacial roughness, optical bandgap |
| Precision | ≤0.01 nm RMS repeatability on SiO₂/Si reference samples (t < 30 nm, n=30 measurements) |
| Compliance | ASTM F1599, ISO 15632, SEMI MF1530 |
| Software | ZENO-EllipSuite v4.x with GLP-compliant audit trail, user role management, and 21 CFR Part 11-ready data export |
| Automation Options | Motorized XYZ stage, auto-alignment module, wafer handler integration |
| Origin | Shanghai, China |
| Distribution | Authorized Global Distributor Network |
| Brand | EMU |
|---|---|
| Origin | United Kingdom |
| Manufacturer Type | Authorized Distributor |
| Origin Category | Imported |
| Model | Batch Aligner and Elevator |
| Wafer Diameters Supported | 75 mm, 100 mm, 125 mm, 150 mm, 200 mm |
| Alignment Reference | Flat or Notch |
| Lifting Mechanism | Dual Non-Vacuum Comb Lifters |
| Illumination | Configurable LED (Standard: Red or White) |
| Substrate Compatibility | Si, SiC, GaN, and Other Compound Semiconductors |
| Interface | Touchscreen HMI with Angle Selection for Edge Alignment |
| Brand | EMU |
|---|---|
| Origin | UK |
| Manufacturer Type | Authorized Distributor |
| Product Category | Imported Equipment |
| Model | IDWR |
| Price Range | USD 14,000 – 72,000 (FOB) |
| Compatible Wafer Diameters | 75 mm, 100 mm, 125 mm, 150 mm, 200 mm |
| Throughput | 25 wafers per batch in ≤ 120 seconds (including cassette mapping, batch alignment, and full-surface ID reading) |
| Imaging System | Cognex In-Sight 1741 Smart Camera |
| Read Targets | Laser-etched marks and Data Matrix codes on wafer frontside and backside |
| Interface Protocols | RS-232, Ethernet, SECS/GEM compliant |
| User Interface | Integrated industrial touchscreen with recipe management and maintenance diagnostics |