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| Brand | AXIS-TEC |
|---|---|
| Origin | Singapore |
| Manufacturer Type | Authorized Distributor |
| Product Origin | Imported |
| Model | AX-LS100 |
| Maximum Linear Cutting Speed | 800 mm/s |
| Application Scope | Semiconductor Wafer Dicing |
| Maximum Wafer Size | 300 mm (12-inch) |
| Laser Class | Class 1 Enclosure |
| Dimensions (W×L×H) | 1530 × 900 × 2229 mm |
| Weight | 750 kg |
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