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| Brand | JIACO |
|---|---|
| Origin | Netherlands |
| Manufacturer Type | Authorized Distributor |
| Origin Category | Imported |
| Model | JIACO MIP |
| Pricing | Available Upon Request |
| Brand | Nisene |
|---|---|
| Origin | USA |
| Model | JetEtch Pro |
| Certifications | CE, SEMI S2-93, SEMI S2-2000 |
| Power | 350 W @ 95–130 VAC or 210–250 VAC |
| Dimensions (H×W×D) | 290 × 290 × 419 mm (11.5″ × 11.5″ × 16.5″) |
| Weight | 17 kg (38 lb) |
| Compressed Air | 4.2 kg/cm² (60–100 psi) |
| Nitrogen Supply | 2.8 L/min (0.1 ft³/min) |
| Etchant Flow Rates | Pulse mode: 1, 2, 5, or 1–10 mL/min |
| Vortex mode | 1–6 mL/min |
| Temperature Range | HNO₃: 20–90 °C |
| H₂SO₄ | 20–250 °C |
| Mixed acids | 20–100 °C |
| Etch Time | 1–1800 s (1 s increments) |
| Heating Ramp Time | 0–120 s (1 s increments) |
| Acid Reservoirs | Four 500 mL or 1 L bottles (33/38/40/45 mm cap diameter) |
| Programmable Methods | 100 user-defined protocols |
| Etchant Options | Fuming nitric acid, fuming sulfuric acid, concentrated sulfuric acid, nitric–sulfuric mixtures (ratios: 6:1, 5:1, 4:1, 3:1 in either direction) |
| Rinse Options | Cold H₂SO₄, cold HNO₃, or no rinse |
| Etch Modes | Vortex spray, pulsed spray, and dual-mode sequencing |
| Patented Processes | CuProtect™ (US Patent 8,945,343 B2), TotalProtect™ (US Patent 9,543,173 B2), PlasmaEtch™ (US Patent 9,548,227 B2) |
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