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| Brand | Rayscience |
|---|---|
| Origin | USA |
| Manufacturer Type | Authorized Distributor |
| Product Category | Imported Semiconductor Instrument |
| Model | CDE ResMap |
| Automation Level | Fully Automated |
| Probe Tip Material | Tungsten Carbide |
| Typical Probe Load Force | 100–200 g |
| Compatible Wafer Sizes | 50 mm (2″) to 150 mm (6″) |
| Measurement Mode | Four-Point Collinear Probe (Van der Pauw geometry compatible) |
| Data Acquisition Rate | Up to 4,000 data points per measurement site |
| Interface | Windows-based GUI with recipe-driven operation |
| Calibration Interval | Extended (≥12 months under GLP-compliant usage) |
| Configurable Probe Heads | Dual–quadruple probe head options for 300 mm platform (not included in base model) |
| Brand | Jandel |
|---|---|
| Origin | United Kingdom |
| Model | Cartridge |
| Probe Spacing Options | 0.500 mm, 0.635 mm, 1.00 mm, 1.27 mm, 1.591 mm (±10 µm tolerance) |
| Tip Material | Tungsten Carbide (standard) |
| Tip Diameter | 0.4 mm (standard), 0.3 mm (for high-density spacing) |
| Tip Radius of Curvature | 12.5, 25, 40, 100, 150, 200, 300, or 500 µm |
| Flatness | ≥ ±0.025 mm |
| Tip Load Range | 10 g to 250 g |
| Insulation Resistance | ≥10¹³ Ω at 500 V (between adjacent probes) |
| Probe Arrangement | Linear or rectangular |
| Buffer Zone | 0.5 mm |
| Automation Level | Manual |
| Brand | Endress+Hauser Metrology |
|---|---|
| Country of Origin | Germany |
| Manufacturer Type | Authorized Distributor |
| Product Origin | Imported |
| Model | MX 203 |
| Pricing | Upon Request |
| Wafer Diameter Range | 50 mm – 450 mm (2″ – 18″) |
| Thickness Accuracy | ±0.5 µm |
| Thickness Resolution | 50 nm |
| Thickness Measurement Range | 100 µm – 1000 µm |
| Measurement Principle | Dual-Sided Capacitive Sensing |
| Automation Level | Manual Operation |
| Compatible Substrates | Si, SiC, GaN, GaAs, InP |
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