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Ultrafast Technologies (Hong Kong) Limited

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BrandRayscience
OriginUSA
Manufacturer TypeAuthorized Distributor
Product CategoryImported Semiconductor Instrument
ModelCDE ResMap
Automation LevelFully Automated
Probe Tip MaterialTungsten Carbide
Typical Probe Load Force100–200 g
Compatible Wafer Sizes50 mm (2″) to 150 mm (6″)
Measurement ModeFour-Point Collinear Probe (Van der Pauw geometry compatible)
Data Acquisition RateUp to 4,000 data points per measurement site
InterfaceWindows-based GUI with recipe-driven operation
Calibration IntervalExtended (≥12 months under GLP-compliant usage)
Configurable Probe HeadsDual–quadruple probe head options for 300 mm platform (not included in base model)
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BrandJandel
OriginUnited Kingdom
ModelCartridge
Probe Spacing Options0.500 mm, 0.635 mm, 1.00 mm, 1.27 mm, 1.591 mm (±10 µm tolerance)
Tip MaterialTungsten Carbide (standard)
Tip Diameter0.4 mm (standard), 0.3 mm (for high-density spacing)
Tip Radius of Curvature12.5, 25, 40, 100, 150, 200, 300, or 500 µm
Flatness≥ ±0.025 mm
Tip Load Range10 g to 250 g
Insulation Resistance≥10¹³ Ω at 500 V (between adjacent probes)
Probe ArrangementLinear or rectangular
Buffer Zone0.5 mm
Automation LevelManual
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