Empowering Scientific Discovery

Weina (Hong Kong) Technology Co., Ltd.

Categories
  • All
  • Favorite
  • Popular
  • Most rated
Added to wishlistRemoved from wishlist 0
Add to compare
BrandAcoulab
OriginSouth Korea
ModelSAM-DENEB
Instrument TypeDigital Scanning Acoustic Microscope
Scan Range (X-Y)350 mm × 350 mm
Spatial Resolution (X-Y)0.5 µm
Ultrasonic Transducer Frequency Range1–500 MHz
A/D Sampling Rate2 GHz
Analog Bandwidth1 GHz
X-Y Scan Speed1000 mm/s
X-Y Repeatability±0.5 µm
Z-Axis Scan Range70 mm
Z-Axis Resolution2.5 µm
Added to wishlistRemoved from wishlist 0
Add to compare
BrandAcoulab
OriginSouth Korea
ModelSAM-CYGNUS
Instrument TypeDigital
Wafer Compatibility4" and 6"
Ultrasonic Transducer Frequency Range1–500 MHz
A/D Sampling Rate2 GHz
Bandwidth1 GHz
XY Repeatability±2 µm
Z-Scan Range70 mm
Z-Resolution2.5 µm
Scan ModesA-scan, C-scan, T-scan, X-scan (multi-layer C-scan)
Integrated SystemsWafer Map module, BCR reader, Pre-aligner, Spin Coater, Water Jet Scanning, Safety Interlock & Alarm System
Motor DriveHigh-precision linear servo motors
Acoustic CouplingWater jet coupling
Added to wishlistRemoved from wishlist 0
Add to compare
BrandAcoulab
OriginSouth Korea
ModelSAM-SPICA
Instrument TypeDigital Scanning Acoustic Microscope
Transducer Frequency Range1–500 MHz
A/D Sampling Rate500 MHz
Signal Bandwidth1 GHz
XY Scan Speed1000 mm/s
XY Repeatability±0.5 µm
Scan ModesA-scan, B-scan, C-scan, X-scan (multi-layer C-scan)
Sample HandlingMotorized tilt/rotation/translation stage with liquid coupling tank compatibility
Added to wishlistRemoved from wishlist 0
Add to compare
BrandULTECH
OriginSouth Korea
ModelULTECH REAL RTP-100
Instrument TypeHigh-Vacuum Rapid Annealing Furnace
Sample Chamber Dimensions870 mm × 650 mm × 620 mm
Temperature Range100–1250 °C
Maximum Ramp Rate10–200 °C/s
Annealing Temperature Accuracy±1.5 °C
Temperature Uniformity±1.5 °C
Vacuum Base Pressure5×10⁻³ Torr (standard), down to 5×10⁻⁶ Torr (with dual-stage molecular pump)
Gas LinesUp to 3 MFC-controlled channels
Substrate Compatibility4-inch wafers
Added to wishlistRemoved from wishlist 0
Add to compare
BrandFastmicro
OriginNetherlands
ModelFM-PS-PFS-V02
Measurement PrincipleDark-field Mie scattering
Measurement Range0.5–150 µm
Repeatability≥90%
Measurement Interval≤10 s per scan
Field of View (FOV)Ø25 mm (on 50 mm replaceable substrate)
Environmental OperationAmbient pressure and vacuum-compatible
ComplianceISO 14644-9, ISO 14644-17
Output FormatsKLARF, Excel, PDF (ISO-compliant qualification reports)
SoftwareIntegrated real-time analysis with annotated imaging and 3D signal profiling
Added to wishlistRemoved from wishlist 0
Add to compare
BrandLogomatic
OriginGermany
ModelQ2/Q2+
Applicable Wafer Sizes6" and 8"
Max Ingot Length60 mm
Chuck Center Height125 mm
Machine Dimensions (L×W×H)1.8 m × 1.8 m × 1.9 m
Weight4.5 ton
Power Consumption4 kW
Spindle Speed3500 rpm
Integrated X-ray Orientation SystemYes
Peel Grinding TechnologyYes
Automated Notch & Flat MachiningYes
Optical Notch Profile InspectionYes
Real-time Acoustic Emission & Force SensingYes
Digital Twin Process SimulationYes
Centrifugal Pure Water Supply System (shared across up to 8 units)Yes
Added to wishlistRemoved from wishlist 0
Add to compare
BrandFastmicro
Country of OriginNetherlands
ModelFM-PS-PRS-V01
Detection PrincipleMie Scattering
Minimum Detectable Particle Size0.5 µm (PSL)
Measurement SpeedFull-surface imaging in seconds
Position Accuracy80 µm
Position Repeatability30 µm
Size Accuracy (PSL)<20% error
Surface Roughness RequirementRa < 50 nm
Output FormatsKLARF, Excel
InterfaceUSB, Ethernet
Contactless OperationYes
ComplianceDesigned for ISO 14644-1 cleanroom environments and SEMI S2/S8 safety standards
Show next
InstrumentHive
Logo
Compare items
  • Total (0)
Compare
0