Empowering Scientific Discovery

Weina (Hong Kong) Technology Co., Ltd.

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BrandLogomatic
OriginGermany
ModelQ2/Q2+
Applicable Wafer Sizes6" and 8"
Max Ingot Length60 mm
Chuck Center Height125 mm
Machine Dimensions (L×W×H)1.8 m × 1.8 m × 1.9 m
Weight4.5 ton
Power Consumption4 kW
Spindle Speed3500 rpm
Integrated X-ray Orientation SystemYes
Peel Grinding TechnologyYes
Automated Notch & Flat MachiningYes
Optical Notch Profile InspectionYes
Real-time Acoustic Emission & Force SensingYes
Digital Twin Process SimulationYes
Centrifugal Pure Water Supply System (shared across up to 8 units)Yes
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