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Weina (Hong Kong) Technology Co., Ltd.

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BrandULTECH
OriginSouth Korea
ModelULTECH REAL RTP-100
Instrument TypeHigh-Vacuum Rapid Annealing Furnace
Sample Chamber Dimensions870 mm × 650 mm × 620 mm
Temperature Range100–1250 °C
Maximum Ramp Rate10–200 °C/s
Annealing Temperature Accuracy±1.5 °C
Temperature Uniformity±1.5 °C
Vacuum Base Pressure5×10⁻³ Torr (standard), down to 5×10⁻⁶ Torr (with dual-stage molecular pump)
Gas LinesUp to 3 MFC-controlled channels
Substrate Compatibility4-inch wafers
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BrandLogomatic
OriginGermany
ModelQ2/Q2+
Applicable Wafer Sizes6" and 8"
Max Ingot Length60 mm
Chuck Center Height125 mm
Machine Dimensions (L×W×H)1.8 m × 1.8 m × 1.9 m
Weight4.5 ton
Power Consumption4 kW
Spindle Speed3500 rpm
Integrated X-ray Orientation SystemYes
Peel Grinding TechnologyYes
Automated Notch & Flat MachiningYes
Optical Notch Profile InspectionYes
Real-time Acoustic Emission & Force SensingYes
Digital Twin Process SimulationYes
Centrifugal Pure Water Supply System (shared across up to 8 units)Yes
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BrandFastmicro
Country of OriginNetherlands
ModelFM-PS-PRS-V01
Detection PrincipleMie Scattering
Minimum Detectable Particle Size0.5 µm (PSL)
Measurement SpeedFull-surface imaging in seconds
Position Accuracy80 µm
Position Repeatability30 µm
Size Accuracy (PSL)<20% error
Surface Roughness RequirementRa < 50 nm
Output FormatsKLARF, Excel
InterfaceUSB, Ethernet
Contactless OperationYes
ComplianceDesigned for ISO 14644-1 cleanroom environments and SEMI S2/S8 safety standards
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