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| Brand | ULTECH |
|---|---|
| Origin | South Korea |
| Model | ULTECH REAL RTP-100 |
| Instrument Type | High-Vacuum Rapid Annealing Furnace |
| Sample Chamber Dimensions | 870 mm × 650 mm × 620 mm |
| Temperature Range | 100–1250 °C |
| Maximum Ramp Rate | 10–200 °C/s |
| Annealing Temperature Accuracy | ±1.5 °C |
| Temperature Uniformity | ±1.5 °C |
| Vacuum Base Pressure | 5×10⁻³ Torr (standard), down to 5×10⁻⁶ Torr (with dual-stage molecular pump) |
| Gas Lines | Up to 3 MFC-controlled channels |
| Substrate Compatibility | 4-inch wafers |
| Brand | Logomatic |
|---|---|
| Origin | Germany |
| Model | Q2/Q2+ |
| Applicable Wafer Sizes | 6" and 8" |
| Max Ingot Length | 60 mm |
| Chuck Center Height | 125 mm |
| Machine Dimensions (L×W×H) | 1.8 m × 1.8 m × 1.9 m |
| Weight | 4.5 ton |
| Power Consumption | 4 kW |
| Spindle Speed | 3500 rpm |
| Integrated X-ray Orientation System | Yes |
| Peel Grinding Technology | Yes |
| Automated Notch & Flat Machining | Yes |
| Optical Notch Profile Inspection | Yes |
| Real-time Acoustic Emission & Force Sensing | Yes |
| Digital Twin Process Simulation | Yes |
| Centrifugal Pure Water Supply System (shared across up to 8 units) | Yes |
| Brand | Fastmicro |
|---|---|
| Country of Origin | Netherlands |
| Model | FM-PS-PRS-V01 |
| Detection Principle | Mie Scattering |
| Minimum Detectable Particle Size | 0.5 µm (PSL) |
| Measurement Speed | Full-surface imaging in seconds |
| Position Accuracy | 80 µm |
| Position Repeatability | 30 µm |
| Size Accuracy (PSL) | <20% error |
| Surface Roughness Requirement | Ra < 50 nm |
| Output Formats | KLARF, Excel |
| Interface | USB, Ethernet |
| Contactless Operation | Yes |
| Compliance | Designed for ISO 14644-1 cleanroom environments and SEMI S2/S8 safety standards |
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