AXIS-TEC PlasmaSTAR100/200 Modular RF Plasma Surface Treatment System
| Brand | AXIS-TEC |
|---|---|
| Origin | USA |
| Model | PlasmaSTAR100 / PlasmaSTAR200 |
| RF Frequency | 40 kHz (LF) or 13.56 MHz |
| RF Power | 600 W |
| Chamber Volume | 10 L |
| Chamber Material | Anodized Aluminum |
| Maximum Substrate Size | 8-inch wafer |
| Process Gas Pressure | 10 PSI |
| Control Interface | Touchscreen PC with Multi-step Programmable Logic |
| Vacuum System | Rotary Vane Pump (standard), optional Roots-boosted configuration |
| Gas Delivery | Mass Flow Controllers (MFCs) standard, downstream pressure controller optional |
Overview
The AXIS-TEC PlasmaSTAR100/200 is a modular, benchtop-capable radio frequency (RF) plasma surface treatment system engineered for precision material surface modification in R&D, process development, and low-to-medium volume production environments. Operating on either low-frequency (40 kHz) or industrial-standard 13.56 MHz RF excitation, the system generates stable, controllable non-thermal plasma in controlled gas atmospheres—enabling reproducible physical and chemical surface interactions without bulk thermal damage. Its core architecture leverages capacitive coupling (CCP) to generate uniform plasma density across diverse substrates, supporting both direct (in-chamber) and downstream (remote) plasma configurations. Designed for integration into cleanroom workflows—including laminar flow hoods and automated material handling platforms—the PlasmaSTAR platform delivers traceable, repeatable surface activation, cleaning, etching, and functionalization critical to semiconductor packaging, MEMS fabrication, biomedical device manufacturing, and advanced PCB assembly.
Key Features
- Modular chamber and electrode architecture: Interchangeable electrode modules—including water-cooled parallel-plate RIE electrodes, rotating tray electrodes for uniform surface exposure, downstream electrodes for ion-damage-sensitive applications, and cylindrical cage electrodes for general-purpose plasma processing.
- Flexible RF power delivery: Dual-frequency compatibility (40 kHz LF or 13.56 MHz) with auto-tuning matching network ensures optimal impedance matching across varying gas chemistries (O2, Ar, N2, CF4, H2, air) and pressure regimes.
- Robust vacuum infrastructure: Integrated oil-sealed rotary vane pump (corrosion-resistant inert oil standard); optional Roots-blown configurations available for faster pump-down and higher base vacuum (<10−2 mbar).
- Intuitive touchscreen control: Windows-based embedded PC with real-time parameter display (power, pressure, forward/reflected RF, gas flow), multi-step recipe storage (>100 protocols), and audit-trail-enabled operation logs.
- Scalable footprint and integration: PlasmaSTAR100 (800 × 850 × 525 mm; ~150 kg) and PlasmaSTAR200 (1033 × 850 × 635 mm; ~220 kg) both support tabletop placement or ISO Class 5–7 cleanroom integration; optional barcode-triggered recipe execution for GMP-aligned workflows.
- Material-compatible chamber design: 10 L anodized aluminum chamber with electropolished interior surfaces minimizes particle generation and enables rapid decontamination between processes.
Sample Compatibility & Compliance
The PlasmaSTAR100/200 accommodates substrates up to 200 mm (8-inch) diameter—including silicon wafers, glass slides, polymer films, ceramic packages, metal foils, and flexible printed circuits. Its modular electrode options allow optimization for conductive, insulating, or temperature-sensitive materials. The system meets fundamental safety requirements per UL 61010-1 and IEC 61000-6-3 (EMC). For regulated environments, the control software supports 21 CFR Part 11-compliant user access levels, electronic signatures, and immutable audit trails when configured with optional validation packages. Process documentation aligns with ISO 13485 (medical devices), IPC-CH-65B (PCB cleaning), and ASTM F2069 (plasma activation of polymers).
Software & Data Management
The embedded control interface runs on a real-time Windows OS with proprietary PlasmaControl™ software. It provides full programmability of RF power ramping, gas sequencing, pressure profiling, and dwell timing across up to 99 process steps per recipe. All operational parameters—including reflected power, chamber pressure (capacitance manometer), MFC setpoints, and temperature monitoring points—are logged at 1 Hz resolution and exportable in CSV or XML format. Optional network connectivity enables remote monitoring via Ethernet/IP or Modbus TCP, facilitating integration into MES or SCADA systems. Data integrity safeguards include cyclic redundancy checks (CRC), timestamped backups, and password-protected configuration lockdown.
Applications
- Pre-bond surface activation of Si, SiO2, and polyimide for anodic or fusion bonding
- Photoresist ashing and post-etch residue removal (O2/CF4 plasmas)
- Plasma-enhanced deposition precursor cleaning prior to ALD or PECVD
- Biocompatibility enhancement of PTFE, PET, and PDMS via amine or carboxyl group grafting
- Removal of organic contaminants and native oxides from Cu, Al, and Au metallizations
- Anisotropic RIE of SiO2 and SiNx using CHF3/Ar mixtures
- Surface hydrophilization of microfluidic channels and lab-on-chip substrates
- Encapsulation layer cleaning prior to underfill dispensing in flip-chip packaging
FAQ
What RF frequencies does the PlasmaSTAR support, and how do they affect process outcomes?
The system operates at either 40 kHz (LF) or 13.56 MHz (ISM band). LF excitation favors higher ion energy and directional bombardment—ideal for physical sputtering and anisotropic etching. 13.56 MHz yields higher electron density and lower ion energy, enabling gentler surface functionalization and uniform chemical activation.
Can the system handle corrosive process gases such as oxygen or fluorine-based chemistries?
Yes. The vacuum pump uses inert, corrosion-resistant oil, and all wetted gas path components (MFCs, valves, chamber seals) are rated for O2, CF4, SF6, and other reactive species per ASTM D471 compatibility standards.
Is remote diagnostics or preventive maintenance scheduling supported?
Standard firmware includes runtime hour counters, RF component health metrics, and vacuum pump status alerts. With optional service contract, AXIS-TEC provides secure remote access for firmware updates and predictive maintenance analytics.
Does the system comply with GLP or GMP documentation requirements?
When equipped with the Validation Support Package (VSP), the PlasmaSTAR100/200 meets ALCOA+ data integrity principles and supports IQ/OQ/PQ documentation templates aligned with FDA and EU Annex 11 expectations.
How quickly can electrode configurations be swapped between process types?
All chamber and electrode modules mount via standardized ISO-KF flanges and quick-disconnect electrical interfaces—typical reconfiguration time is under 20 minutes with no tools required beyond a torque wrench for final sealing verification.
