YXLON FF35 CT X-ray System
| Brand | YXLON International GmbH |
|---|---|
| Origin | Germany |
| Manufacturer Type | Authorized Distributor |
| Origin Category | Imported |
| Model | Customized |
| Pricing | Upon Request |
| Radiation Source | Dual-tube microfocus/nanofocus X-ray (225 kV / 190 kV) |
| Sample Max. Diameter | 530 mm |
| Sample Max. Height | 800 mm |
| Max. Sample Weight | 27 kg |
| Spatial Resolution | Sub-micron (≤1 µm detectable defect) |
| Scan Modes | Cone-beam CT, Helical CT, QuickScan®, Quality Scan, Virtual Rotation Axis, FoV Expansion, Batch Scanning |
| Software Platform | Gemini CT |
| Metrology Accuracy (optional) | MPESD = 5.9 µm + L/75 (L in mm) |
| Compliance | SEMI® S2-0818, SEMI® S8-0218 |
Overview
The YXLON FF35 CT X-ray System is a high-performance, laboratory-grade computed tomography platform engineered for non-destructive 3D internal inspection, dimensional metrology, and materials characterization. Built upon dual microfocus/nanofocus X-ray source architecture and precision mechanical design, the system operates on the principle of cone-beam computed tomography (CBCT), where hundreds to thousands of 2D projection images—acquired as the sample rotates through 360°—are reconstructed into isotropic volumetric datasets using filtered back-projection or iterative algorithms. Its rigid granite base, active temperature stabilization, and vibration-damped gantry ensure long-term geometric stability essential for repeatable sub-micron defect detection (<1 µm) and traceable metrology. Designed explicitly for R&D laboratories and QA/QC environments, the FF35 meets SEMI® S2-0818 (safety) and SEMI® S8-0218 (electromagnetic compatibility and functional safety) standards—making it suitable for use in semiconductor cleanrooms and regulated industrial settings.
Key Features
- Dual X-ray source configuration: seamless one-button switching between 225 kV microfocus and 190 kV nanofocus tubes—enabling optimal contrast-to-noise ratio across diverse material densities and feature sizes.
- Gemini software platform: unified interface for acquisition, reconstruction, visualization, analysis, and reporting—with support for advanced trajectories (helical, circular, multi-axis), field-of-view expansion, and automated batch processing.
- Mechanical stability architecture: massive granite base with integrated thermal regulation minimizes thermal drift and mechanical hysteresis, ensuring reproducible alignment over extended scan durations.
- Flexible sample handling: accommodates specimens up to Ø530 mm × H800 mm and 27 kg, with programmable rotation stages, tilt axes, and optional robotic loading for unattended operation.
- Metrology-ready configuration: optional ISO 15530-3 compliant metrology package delivers calibrated volumetric measurement uncertainty per VDI/VDE 2630 Part 1.1, with maximum permissible error (MPESD) specified as 5.9 µm + L/75 (L in mm).
- Modular scanning modes: supports QuickScan® (rapid qualitative assessment), Quality Scan (high-SNR quantitative imaging), virtual rotation axis (for off-center or oversized parts), and helical CT for elongated components.
Sample Compatibility & Compliance
The FF35 CT system is validated for non-destructive evaluation of heterogeneous, high-value, and geometrically complex samples across multiple regulated sectors. Compatible specimen categories include: surface-mount electronic assemblies (SMD, BGA, flip-chip packages), additively manufactured metal and polymer components, lithium-ion battery cells and modules, injection-molded thermoplastics, MEMS/MOEMS devices, medical catheters and implants, lightweight aluminum and magnesium castings, and geological/biological archival specimens. All system hardware and software comply with SEMI® S2-0818 (safety) and SEMI® S8-0218 (EMC and functional safety) requirements. While not a medical device, its imaging performance aligns with ASTM E2737 (standard guide for computed tomography imaging) and supports GLP-compliant workflows when configured with audit-trail-enabled Gemini software and electronic signatures per FDA 21 CFR Part 11.
Software & Data Management
Gemini CT serves as the central software ecosystem—integrating acquisition control, GPU-accelerated reconstruction (FDK, SART, iterative regularization), volume rendering, segmentation, defect analysis (porosity, inclusions, cracks), wall thickness mapping, and GD&T metrology. Data management follows FAIR principles: raw projections and reconstructed volumes are stored in vendor-agnostic formats (DICOM-CT, TIFF stacks, HDF5), with metadata embedded per ASTM E2737 and ISO/IEC 11179. The platform supports automated report generation (PDF, HTML, Excel), DICOM export for PACS integration, and API-based connectivity to MES, PLM, and LIMS systems. Optional Gemini Connect enables remote monitoring, centralized license management, and secure cloud backup with role-based access control.
Applications
- Failure analysis: root-cause identification of voids, delaminations, solder joint fractures, and interfacial defects in electronics and composites.
- Process validation: verification of powder bed fusion consistency, binder jetting density uniformity, and die-cast porosity distribution.
- Dimensional inspection: first-article and periodic verification of internal features (cooling channels, lattice structures, undercuts) inaccessible to tactile CMMs.
- Material science research: 4D (time-resolved) in-situ CT for thermal cycling, mechanical loading, or electrochemical testing.
- Regulatory documentation: generation of auditable 3D evidence for PPAP submissions, AS9100 audits, and IATF 16949 process capability studies.
- Digital twin initialization: high-fidelity voxel models used for simulation boundary condition definition, FEA meshing, and AI training datasets.
FAQ
Is the FF35 CT system certified for use in semiconductor cleanroom environments?
Yes—the system complies with SEMI® S2-0818 and SEMI® S8-0218 standards and is routinely deployed in Class 100–1000 cleanrooms with appropriate HVAC integration and particle mitigation protocols.
Can the system perform traceable dimensional measurements meeting ISO 15530-3 requirements?
Yes—when equipped with the optional metrology package and calibrated reference artifacts, the FF35 achieves MPESD = 5.9 µm + L/75 (L in mm) in accordance with VDI/VDE 2630 Part 1.1.
Does Gemini software support automated defect classification using machine learning?
Gemini includes rule-based segmentation and thresholding tools; third-party ML plugins (e.g., Python-based PyTorch/TensorFlow interfaces) can be integrated via Gemini’s open API for custom classification pipelines.
What is the typical reconstruction time for a full-volume dataset at 1 µm voxel resolution?
Reconstruction time depends on dataset size and GPU configuration; typical 2000×2000×2000 voxel volumes reconstruct in under 8 minutes on an NVIDIA A100-equipped workstation.
Is remote operation and diagnostics supported?
Yes—Gemini Connect enables secure remote access, real-time system health monitoring, firmware updates, and collaborative troubleshooting with YXLON technical support engineers.

