Suhwoo STRIP GRINDER SG-2000X Fully Automated Strip Grinding System
| Brand | SUHWOO |
|---|---|
| Origin | South Korea |
| Model | Suhwoo STRIP GRINDER SG-2000X |
| Strip Width Range | 62–95 mm |
| Strip Length Capacity | up to 259 mm |
| Height Detection Repeatability | ±3 µm |
| Tool Change Time | <30 minutes |
| Spindle Type | Custom High-Precision Air-Bearing Spindle |
| Cleaning & Drying | Integrated Automated Rinse and Spin-Dry Module |
| Compliance | Designed for ISO 14644-1 Class 5 Cleanroom Integration |
| Control Interface | Touchscreen HMI with Recipe Management and Audit Trail Logging |
Overview
The Suhwoo STRIP GRINDER SG-2000X is a fully automated precision grinding system engineered specifically for semiconductor strip-level processing in advanced packaging and heterogeneous integration workflows. Unlike conventional wafer-level grinders, the SG-2000X employs a dedicated strip-handling architecture that maintains mechanical stability and dimensional control during high-accuracy material removal from individual die strips—commonly used in fingerprint sensor modules, TMV (Through-Mold Via), TSV (Through-Silicon Via), and exposed-die fan-out applications. Its core operation relies on a closed-loop, servo-controlled grinding module combined with real-time height sensing via capacitive touch verification probes, enabling sub-micron repeatability in z-axis positioning. The system integrates a high-rigidity air-bearing spindle optimized for low-vibration, high-surface-integrity grinding of silicon, glass, and molded compound substrates—critical when preserving fine-pitch redistribution layers (RDL) or fragile micro-bumps during backgrind.
Key Features
- Fully automated material handling: robotic strip loading/unloading with vacuum gripper alignment and vision-assisted centering
- Integrated cleaning and spin-dry station compliant with semiconductor-grade DI water and N2 purge protocols
- Real-time height monitoring using dual-axis capacitive sensors with ±3 µm repeatability across full stroke range
- Modular consumable design: grinding wheels, dressing tools, and coolant nozzles are tool-free replaceable within 30 minutes
- Custom air-bearing spindle delivering stable rotational accuracy (<0.1 µm runout) at speeds up to 6,000 rpm
- Touchscreen HMI with recipe-based process control, parameter locking, and GLP-compliant audit trail logging
- Open communication architecture supporting SECS/GEM protocol for factory automation integration (300 mm SEMI E40/E87 compliant)
Sample Compatibility & Compliance
The SG-2000X accommodates strip formats ranging from 62 mm to 95 mm in width and up to 259 mm in length—covering standard JEDEC tray dimensions for QFN, WLCSP, and hybrid package substrates. It supports silicon, fused silica, molded epoxy (EMC), and thin-glass strips with thicknesses from 50 µm to 500 µm post-grind. All wet-process modules meet SEMI F57 standards for particle generation (<10 particles ≥0.5 µm per cm² per cycle). The system’s mechanical and electrical design conforms to IEC 60204-1 (safety of machinery) and ISO 13849-1 (PL e category). Optional validation packages include IQ/OQ documentation aligned with FDA 21 CFR Part 11 requirements for electronic records and signatures.
Software & Data Management
The embedded control software provides full traceability through time-stamped process logs—including spindle load profiles, Z-axis displacement curves, coolant flow rates, and sensor calibration history. Each grinding job generates a structured CSV report containing pre/post-height maps, surface roughness estimates (Ra/Rz), and thermal drift compensation values. Data export supports FTP, USB, and OPC UA interfaces. For contract manufacturing environments, multi-user role-based access control (RBAC) enforces SOP compliance: operators execute predefined recipes, while engineers retain configuration privileges. All software updates undergo version-controlled release testing per ISO/IEC 17025 internal validation procedures.
Applications
- Backgrind of fingerprint sensor strips prior to chip-on-film (COF) lamination
- Thickness uniformity control for TMV/TSV substrates after mold encapsulation
- Flash removal from over-molded die strips without damaging exposed copper pads
- Final thickness tuning of ultra-thin die (≤100 µm) before stacking or panel-level assembly
- Surface planarization of glass interposers used in 2.5D heterogeneous integration
- Pre-bond surface conditioning for hybrid bonding processes requiring ≤0.5 nm RMS roughness
FAQ
What strip thickness tolerances can the SG-2000X achieve across a 95 mm wide strip?
Typical total thickness variation (TTV) is ≤1.2 µm over full width under controlled ambient conditions (±0.5°C, ISO Class 5).
Is the system compatible with lead-free solder mask or polyimide-coated strips?
Yes—the low-heat grinding strategy and adjustable wheel feed rate prevent thermal delamination; compatibility confirmed for common PI grades (e.g., HD-3000, Pyralux AP).
Can the height detection system be recalibrated in-house?
Yes—calibration uses NIST-traceable gauge blocks and is guided by on-screen wizard; full procedure documented in the Maintenance Manual Rev. 3.2.
Does Suhwoo provide process development support for new strip materials?
Yes—customers may submit representative samples to Suhwoo’s Seoul Application Lab for feasibility testing, including cross-section SEM analysis and surface metrology reports.
What is the mean time between failures (MTBF) for the grinding spindle module?
Based on field data from 42 installed units (2021–2024), MTBF exceeds 12,500 operational hours under standard maintenance intervals.
