Royce AP+ Automatic Die Sorter
| Brand | Royce |
|---|---|
| Origin | USA |
| Manufacturer Type | Authorized Distributor |
| Product Origin | Imported |
| Model | AP+ |
| Pricing | Available Upon Request |
| Chip Size Range (Tray) | 0.2 mm² – >25 mm² |
| Chip Size Range (Tape) | 0.5 mm² – ≤17 mm² |
| Input Formats | Tape & Reel Carriers, Waffle Packs, Gel-Paks (2"–4"), JEDEC Trays, Wafer Frames (up to Ø300 mm), Dicing Tape Rings |
| Output Formats | Carrier Tapes (8–24 mm width, heat-seal or pressure-seal), Waffle Packs, Gel-Paks (2"–4"), JEDEC Trays, Tape Frames, Dicing Tape Rings, Custom Fixtures |
| Placement Accuracy | ±12.5 µm (repeatability) |
| Pick Mechanism | Top-surface or edge-vacuum pickup using interchangeable tooling (Rubber, Vespel®, Tungsten Carbide, Elastomer) |
| Cycle Time | As low as 1.3 seconds per die (application-dependent) |
Overview
The Royce AP+ Automatic Die Sorter is a high-precision, vision-guided semiconductor handling system engineered for post-dicing wafer-level sorting and packaging of bare die in advanced assembly and test environments. Built upon Royce’s proprietary motion control architecture and integrated machine vision platform, the AP+ employs deterministic pick-and-place kinematics combined with real-time optical alignment to achieve sub-13 µm placement repeatability—critical for high-I/O, fine-pitch, and heterogeneous integration applications. Unlike legacy sorters relying on mechanical indexing or fixed-tooling approaches, the AP+ utilizes a modular end-effector system with programmable vacuum and edge-grip tooling, enabling seamless transition between surface-contact and non-contact die handling without hardware reconfiguration. Its design conforms to SEMI S2/S8 safety standards and supports integration into Class 100 cleanroom environments with ISO 14644-1 compliance.
Key Features
- Programmable multi-tool end-effector supporting surface vacuum pickup (rubber, elastomer, Vespel®, tungsten carbide tips) and non-contact Vespel® edge-grip—minimizing die chipping, particle generation, and surface contamination.
- Integrated high-resolution monochrome CCD imaging system with telecentric optics and LED ring illumination for real-time die orientation, edge detection, and defect flagging (e.g., cracked corners, chipped edges, metallization anomalies).
- Multi-format input/output flexibility: accepts wafers up to Ø300 mm mounted on standard dicing frames or tape rings; outputs to carrier tapes (8–24 mm width, heat-seal or pressure-seal compatible), JEDEC trays (JEDEC MO-178, MO-228), waffle packs, Gel-Paks (2″, 3″, 4″), and custom fixtures.
- Deterministic motion control with linear motor-driven X-Y-Z stages and direct-drive theta axis—enabling <1.3 s cycle time at full accuracy under typical production conditions (die size ≥1.0 mm², no manual intervention required).
- Onboard calibration routines compliant with ISO 9283 and VDI/VDE 2617 Part 6—ensuring traceable repeatability verification without external metrology equipment.
Sample Compatibility & Compliance
The AP+ accommodates a broad spectrum of die geometries and material systems encountered in compound semiconductor, SiC/GaN power device, MEMS, and advanced packaging workflows. It handles fragile die (e.g., thin GaAs RF chips, brittle silicon photonics arrays) and high-aspect-ratio structures (e.g., stacked die, fan-out wafer-level packages) via configurable acceleration profiles and dynamic force compensation. All handling sequences are validated against JEDEC J-STD-020 (moisture sensitivity), JESD22-A114 (ESD robustness), and IPC-A-610 (acceptability of electronic assemblies). System firmware supports audit trail logging aligned with FDA 21 CFR Part 11 requirements for electronic records and signatures when deployed in regulated manufacturing settings.
Software & Data Management
The AP+ runs Royce SortWare™ v5.x—a Windows-based HMI with role-based access control (operator, engineer, administrator), recipe management, and real-time SPC dashboards. Each sorting run generates timestamped XML log files containing die coordinates, orientation angle, image metadata, tooling ID, vacuum status, and pass/fail flags—exportable via OPC UA or FTP to MES/ERP platforms (e.g., Siemens Opcenter, Camstar, FactoryTalk). Optional data encryption and secure boot features meet IEC 62443-3-3 SL2 cybersecurity requirements. Software validation documentation (IQ/OQ/PQ protocols) is available for GMP/GLP-regulated facilities.
Applications
- High-mix, low-volume sorting of RF/mmWave die for 5G front-end modules.
- Sorting of ultra-thin (<50 µm) silicon interposers prior to hybrid bonding.
- Die selection and binning for heterogeneous integration (chiplets) in AI accelerator packaging.
- Post-laser-trimming sorting of precision analog/MEMS sensors requiring orientation-specific placement.
- Recovery and repackaging of known-good-die (KGD) from failed wafer-level test lots.
FAQ
What is the maximum wafer diameter supported by the AP+?
The system accepts wafers up to Ø300 mm when mounted on standard dicing frames or tape rings.
Does the AP+ support automatic tool changeover between vacuum and edge-grip modes?
Yes—tooling changes are software-triggered and executed within the same recipe without operator intervention.
Can the AP+ interface with third-party vision inspection systems?
It provides native GigE Vision and GenICam-compliant camera ports, enabling synchronization with external AOI stations for inline defect correlation.
Is offline programming supported for new die types?
Yes—SortWare™ includes an offline teach mode with CAD import (STEP, DXF) and simulated path validation before hardware deployment.
What level of cleanroom compatibility does the AP+ offer?
The system meets ISO Class 5 (Class 100) particulate requirements and includes optional nitrogen purge capability for moisture-sensitive die handling.
