ULTRAT Manual/Automated Wet Bench Batch Wafer, Substrate & Photomask Cleaning System
| Brand | ULTRAT |
|---|---|
| Origin | South Korea |
| Manufacturer Type | Authorized Distributor |
| Category | Imported Equipment |
| Model Variants | UltraT-Manual / UltraT-Automated / UltraT-Wet Bench / UltraT-Batch |
| Pricing | Available Upon Request |
Overview
The ULTRAT series is a precision-engineered wet cleaning platform designed specifically for the semiconductor and flat-panel display (FPD) industries. It employs proven physical and chemical cleaning methodologies—including high-pressure deionized (DI) water jets, atomized spray nozzles, rotating brush modules, and ultrasonic-assisted rinsing—to remove sub-micron particulates, organic residues, metallic contaminants, and native oxides from silicon wafers, glass substrates, quartz photomasks, and other critical lithography-grade surfaces. Unlike optical inspection tools, the ULTRAT system functions as a process-critical front-end cleaning station, directly supporting defect reduction in photolithography, thin-film deposition, and etch readiness workflows. Its modular architecture allows integration into Class 1–100 cleanroom environments and supports both manual loading and fully automated FOUP/FOSB-compatible handling.
Key Features
- Supports substrates up to 250 mm (10-inch) diameter with precise rotational control via brushless DC spindle motor — configurable for speed ramping, dwell time, and bidirectional rotation.
- Dual-arm configuration option enables simultaneous top-side and bottom-side cleaning or sequential multi-step processing (e.g., pre-rinse → brush scrub → megasonic rinse → spin-dry).
- Independent polypropylene process chamber ensures chemical compatibility with HF, SC1, SC2, piranha, and DI water-based chemistries; resistant to corrosion and particle shedding.
- Microprocessor-based controller stores up to 10 user-defined cleaning recipes with full parameter logging (rotation speed, arm travel position, nozzle activation sequence, dwell duration, temperature setpoints).
- Integrated safety interlocks include lid-position sensing, liquid-level monitoring, emergency stop circuitry, and real-time fault diagnostics displayed via touchscreen GUI.
- Advanced drying module combines variable-speed spin-drying (0–3000 rpm) with optional heated DI water rinse (up to 80°C), nitrogen gas assist (≥99.999% purity), and IR heating lamp arrays for residue-free surface conditioning.
Sample Compatibility & Compliance
The ULTRAT system accommodates standard wafer formats (100 mm to 250 mm), rigid and flexible glass substrates (up to 600 × 700 mm for Wet Bench variants), and photomasks (6-inch and 9-inch quartz plates with chrome or MoSi layers). All wetted materials comply with SEMI F57 standards for semiconductor equipment construction. The control software supports audit trails and electronic signature functionality aligned with FDA 21 CFR Part 11 requirements when configured with optional GMP-compliant firmware. System operation meets ISO 14644-1 Class 5 cleanroom specifications when installed with appropriate exhaust and DI water recirculation filtration.
Software & Data Management
The embedded HMI features a 7-inch capacitive touchscreen running a deterministic real-time OS. Operators define recipes using intuitive graphical controls—drag-and-drop step sequencing, numeric parameter entry, and visual feedback for fluid flow status and motor positioning. All process logs (timestamped start/stop, recipe ID, operator ID, sensor readings) are exported in CSV format via USB or Ethernet. Optional OPC UA server integration enables connectivity with MES platforms such as Siemens Opcenter Execution Semiconductor or Applied Materials EnduraLink for SPC-driven process monitoring and traceability.
Applications
- Pre-lithography wafer cleaning to reduce pattern collapse and bridging defects.
- Post-etch and post-CMP residue removal prior to metrology or inspection.
- Photomask cleaning for EUV and DUV mask shops requiring ≤50 nm particle removal efficiency.
- Substrate preparation for OLED, microLED, and TFT-LCD manufacturing lines.
- R&D-scale cleaning validation under controlled DOE conditions (e.g., varying DI water resistivity, spray pressure, or brush contact force).
FAQ
What substrate thicknesses can the ULTRAT handle?
Standard configurations support substrates from 0.1 mm (flexible glass) to 2.0 mm (silicon wafers); custom chuck designs accommodate warped or beveled wafers up to 50 µm TTV.
Is the system compatible with ozone-enhanced cleaning chemistries?
Yes — optional ozone injection ports and stainless-steel wetted components (grade 316L) enable stable operation with dissolved ozone concentrations up to 10 ppm at pH 6–7.
Can cleaning data be exported to a central LIMS?
Yes — through the optional Ethernet/IP or Modbus TCP interface, raw log files and summary reports are transmitted in structured JSON or XML schema per customer-defined mapping.
Does the ULTRAT meet SEMI S2/S8 safety certification requirements?
All shipped units include third-party SEMI S2 (safety) and S8 (ergonomics) compliance documentation; factory acceptance testing includes full hazard analysis per ISO 13849-1 PL e.
What maintenance intervals are recommended for pump and nozzle assemblies?
DI water pumps require quarterly filter replacement and annual bearing inspection; atomized nozzles should be ultrasonically cleaned every 200 operating hours and replaced after 1,000 hours of continuous use.
