Zhengye ZYXG5010 BGA Non-Destructive X-ray Inspection System
| Brand | Zhengye |
|---|---|
| Origin | Guangdong, China |
| Manufacturer Type | OEM Manufacturer |
| Country of Origin | China |
| Model | ZYXG5010 |
| Pricing | Available Upon Request |
Overview
The Zhengye ZYXG5010 BGA Non-Destructive X-ray Inspection System is an industrial-grade microfocus X-ray imaging platform engineered for high-precision internal defect analysis of ball grid array (BGA) packages and other electronics assemblies. Operating on the principle of transmission radiography, the system generates real-time digital X-ray images by directing a controlled X-ray beam through the sample onto a high-sensitivity image intensifier or flat-panel detector. This enables non-invasive visualization of solder joint integrity, voiding, bridging, misalignment, missing balls, and interconnect anomalies—without disassembly or destructive cross-sectioning. Designed specifically for quality control laboratories and production line inline inspection environments, the ZYXG5010 delivers consistent spatial resolution suitable for detecting sub-100 µm features in PCB-level packaging, supporting failure analysis (FA), process validation, and incoming material inspection workflows.
Key Features
- Triaxial Motorized Motion Control: Independent X-, Y-, and Z-axis movement of both the X-ray tube and image intensifier ensures precise geometric magnification control and optimal source-to-object-to-detector alignment. All axes utilize precision ground ball screws and synchronous belt-driven stepper motors for repeatable positioning accuracy within ±2 µm.
- Automated CNC Path Programming: Supports user-defined inspection routines with programmable waypoints, dwell times, and exposure parameters. Ideal for low-to-medium volume production lots requiring consistent reinspection of identical component locations across multiple units.
- Intuitive Navigation Interface: Features a large-scale real-time navigation window overlaying the live radiograph. Clicking any region within this preview triggers automatic stage repositioning to center the selected area under the focal spot—reducing operator dependency and minimizing setup time.
- Integrated Metrology Suite: Embedded measurement algorithms support calibrated linear distance, circle diameter, concentricity assessment, point-to-center offset, and angular deviation calculations—all traceable to NIST-traceable calibration standards applied during factory commissioning.
- Real-Time Image Processing Engine: Provides dynamic contrast enhancement, noise reduction, edge sharpening, and grayscale inversion. Captured frames are saved in DICOM 3.0, TIFF, PNG, and JPEG formats with embedded metadata including acquisition timestamp, kV/mA settings, magnification factor, and coordinate position.
Sample Compatibility & Compliance
The ZYXG5010 accommodates standard PCB substrates up to 300 mm × 300 mm and component heights up to 80 mm, with optional custom fixtures available for specialized carriers (e.g., JEDEC trays, reflow carriers). It complies with IEC 61340-5-1 (ESD protection), GB/T 18801–2015 (Chinese national standard for X-ray equipment safety), and meets electromagnetic compatibility requirements per GB 4824–2019. While not certified to ISO/IEC 17025 for accredited testing labs, its measurement repeatability (<2% RSD over 20 repeated measurements at fixed geometry) supports internal QA/QC documentation aligned with ISO 9001:2015 and IPC-A-610 Class 2/3 acceptance criteria.
Software & Data Management
The proprietary inspection software runs on Windows 10 IoT Enterprise and includes full audit trail functionality compliant with FDA 21 CFR Part 11 requirements—including electronic signatures, user role-based access control (admin/operator/viewer), and immutable log records of all image captures, measurements, and parameter modifications. Data export supports CSV for SPC integration and XML for MES connectivity. Raw image archives are stored in encrypted local RAID-1 arrays or configurable network-attached storage (NAS) endpoints, with optional TLS 1.2–secured remote viewing via browser-based thin client.
Applications
- Failure analysis of BGA, CSP, QFN, and WLCSP packages in lithium-ion battery management systems (BMS) and power electronics modules
- Process capability studies for reflow soldering, underfill dispensing, and thermal compression bonding
- Incoming inspection of contract-manufactured PCBA assemblies prior to functional test
- Root cause investigation of field return units exhibiting intermittent electrical faults
- Verification of void content in solder joints per IPC-J-STD-005 and IPC-A-610 revision G guidelines
FAQ
What is the minimum detectable feature size under standard operating conditions?
Typical resolution is ≤100 µm at 5× geometric magnification; actual resolvable detail depends on source focal spot size, detector pixel pitch, and object-to-detector distance.
Does the system support automated pass/fail classification based on user-defined thresholds?
Yes—the software allows rule-based logic configuration (e.g., “void area >15% of solder pad = reject”) with visual alert overlays and batch summary reports.
Is radiation shielding integrated into the enclosure?
Yes—the cabinet meets GBZ 117–2015 leakage dose limits (<1 µSv/h at 5 cm from surface) and includes interlocked door sensors that halt X-ray generation upon opening.
Can third-party metrology software be integrated?
DICOM-compliant image export and standardized TCP/IP communication protocols enable interoperability with common FA platforms such as Olympus Stream, Carl Zeiss ZEN, and Thermo Scientific Pathfinder.
What maintenance schedule is recommended for long-term stability?
Annual recalibration of geometric magnification and intensity linearity is advised; X-ray tube lifetime is rated at ≥5,000 hours under nominal 90 kV/100 µA operation.
