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| Brand | TPT |
|---|---|
| Origin | Germany |
| Model | HB75 |
| Z-Axis Drive | Motorized |
| Control Interface | 6.5" TFT Touchscreen |
| Placement Accuracy | Sub-10 µm (typical, under optimized conditions) |
| Chip Size Range | 100 µm × 100 µm to 10 mm × 10 mm |
| Placement Time | 1–10,000 ms (optional extension to 20,000 ms) |
| Placement Force | 10–150 cN·m (350 cN·m optional) |
| Vacuum Source | Integrated pump |
| Nozzle Diameter | Ø1.58 mm, 19 mm length |
| Z-Travel | 17 mm |
| Arm Length | 165 mm |
| X-Y Manipulator Range | ±10 mm |
| Mechanical Lever Ratio | 6:1 |
| Temperature Control | Up to 250 °C ±1 °C |
| Power Supply | 100–240 VAC, ±10%, 50/60 Hz, max. 10 A |
| Dimensions (W×D×H) | 680 × 640 × 490 mm |
| Net Weight | 42 kg |
| Brand | TPT |
|---|---|
| Origin | Germany |
| Model | HB75 |
| Mounting Type | Desktop |
| Control Interface | 6.5" TFT Touchscreen |
| Placement Accuracy | ±2 µm (typical, under calibrated lab conditions) |
| Chip Size Range | 100 µm × 100 µm to 10 mm × 10 mm |
| Z-Axis Stroke | 17 mm (motorized) |
| Placement Force Range | 10–150 cN·m (350 cN·m optional) |
| Placement Time | 1–10,000 ms (extendable to 20,000 ms) |
| Dispensing Capability | Optional adhesive dispensing module |
| Dip-Coating Function | Integrated |
| Vacuum Source | Onboard integrated vacuum pump |
| Motion Architecture | True orthogonal X-Y-Z kinematics |
| Tool Changer | Rotating nozzle turret |
| Programmable Recipes | Up to 100 stored programs |
| Operating Modes | Manual, semi-automatic, and step-by-step guided placement |
| Heating Stage | Optional temperature-controlled platform (up to 250 °C ±1 °C) |
| Power Supply | 100–240 V AC, ±10%, 50/60 Hz, max. 10 A |
| Dimensions (W×D×H) | 680 × 640 × 490 mm |
| Net Weight | 42 kg |
| Brand | PROCESS INSTRUMENTS |
|---|---|
| Origin | USA |
| Manufacturer Type | Authorized Distributor |
| Origin Category | Imported |
| Model | TA7000 |
| Pricing | Available Upon Request |
| Brand | Truth Instruments Company Limited |
|---|---|
| Origin | Anhui, China |
| Manufacturer Type | Authorized Distributor |
| Country of Origin | China |
| Model | PLD-400 |
| Base Pressure | 5×10⁻⁹ mbar |
| Substrate Heating Range | Room Temperature to 1200 °C |
| Target Configuration | Six 1-inch or Three 2-inch targets (motorized rotation and revolution) |
| Substrate Size | Up to 2-inch wafers |
| Optional Add-ons | Liquid Nitrogen Cryo-Cooling Stage, Load-Lock Transfer Module, Reactive Gas Inlet System (O₂, N₂, Ar), In-situ Quartz Crystal Microbalance (QCM), Predefined Process Recipe Management, High-Pressure RHEED (up to 1×10⁻⁵ mbar), Electron Gun for LEED |
| Brand | Truth Instruments Company Limited |
|---|---|
| Origin | Shandong, China |
| Manufacturer Type | Authorized Distributor |
| Country of Origin | China |
| Model | Wafer-MOKE |
| Pricing | Available Upon Request |
| Sample Size | Up to 300 mm (12-inch) wafers, downward compatible with fragments |
| Vertical Field Range | ±2.4 T |
| In-Plane Field Range | ±1.3 T |
| Field Resolution | 0.01 mT |
| Field Uniformity | Better than ±1% over Ø1 mm |
| Kerr Rotation Resolution | 0.3 mdeg (RMS) |
| Throughput | 12 WPH (9 sites, 200 mm wafer, ±1.3 T) |
| Sample Repositioning Accuracy | <10 µm |
| Uptime | ≥90% |
| EFEM Integration | Optional |
| Brand | TRY |
|---|---|
| Model | Customized |
| Application Scope | High-power IC packaging (e.g., IGBT modules), semiconductor manufacturing, materials R&D, automotive electronics |
| XY Stage | 150 × 150 mm |
| Max Shear Force Capacity | 1000 kg |
| Compliance | ASTM F468, ISO 13473-2, JEDEC JESD22-B116 (Bond Strength), MIL-STD-883 Method 2011 |
| Sensor Technology | Digital load cell with thermal drift compensation |
| Control Interface | Touchscreen HMI + Ethernet/RS232 for integration into factory MES/LIMS |
| Software | TRY-BondTest Suite v3.2 with audit trail, user role management, and 21 CFR Part 11–compliant electronic signatures |
| Brand | TSD |
|---|---|
| Origin | Beijing, China |
| Manufacturer Type | Authorized Distributor |
| Country of Origin | China |
| Model | IHG-2010 |
| Price | Upon Request |
| Maximum Wafer Size | 6-inch (150 mm) |
| Grinding Wheel OD | Ø200 mm |
| Spindle Speed Range | 0–3000 rpm |
| Chuck Table Speed | 0–400 rpm |
| Z-Axis Travel | 70 mm |
| Z-Axis Feed Rate | 0.1–1000 µm/sec (optional high-resolution mode: 0.01 µm/sec) |
| Industry Compliance Options | SECS/GEM interface, MES integration support |
| Brand | TSD |
|---|---|
| Model | IVG Series |
| Origin | Beijing, China |
| Type | Semi-Automatic Dual-Axis Wafer Thinning System |
| Maximum Wafer Size | 200 mm (IVG-2020) / 300 mm (IVG-3020) |
| Grinding Wheel OD | 203 mm / 303 mm |
| Spindle Power | 6.0 kW / 9.5 kW |
| Spindle Speed | 0–6000 rpm / 0–4000 rpm |
| Chuck Rotation Speed | 0–380 rpm |
| Z-Axis Feed Rate | 0.1–1000 µm/sec |
| In-Line Thickness Measurement Range | 0–4800 µm |
| Thickness Repeatability | ±1 µm |
| Non-Contact Gauging (NCG) | Optional |
| Brand | TSD |
|---|---|
| Model | IVG-2040 / IVG-3040 |
| Max Wafer Size | 200 mm (8") / 300 mm (12") |
| Grinding Wheel OD | 203 mm / 303 mm |
| Spindle Power | 6.0 kW / 9.5 kW |
| Spindle Speed | 0–6000 rpm / 0–4000 rpm |
| Table Speed | 0–380 rpm |
| Z-Axis Feed Rate | 0.1–1000 µm/sec |
| In-Line Thickness Measurement Repeatability | ±0.001 mm |
| In-Line Thickness Range (OMM) | 0–4800 µm |
| Integrated Auto Load/Unload | Yes |
| Non-Contact Gauging (NCG) | Optional |
| Brand | TSD |
|---|---|
| Origin | Beijing, China |
| Model | POLI-500 |
| Maximum Wafer Size | 200 mm (8-inch) |
| Platen Diameter | 508 mm (20 inch) |
| Platen Speed | 30–200 rpm |
| Carrier Head Speed | 30–200 rpm |
| Downforce Range | 70–500 g/cm² |
| Pressure Actuation | Pneumatic bladder-based compliant loading |
| Conditioning | Oscillating arm-type conditioner with optional reciprocating mode |
| Process Monitoring | Optional friction force & temperature sensing |
| Endpoint Detection | Optional Electrochemical Endpoint Detection (EPD) |
| Slurry Delivery | Three independent peristaltic pump channels |
| Loading Interface | Semi-automatic tray-based wafer handling |
| Brand | TSD |
|---|---|
| Origin | Beijing, China |
| Model | TMP-150A / TMP-200A |
| Wafer Size | 4"/6" (TMP-150A), 4"/6"/8" (TMP-200A) |
| Platen Diameter | 406 mm (TMP-150A), 508 mm (TMP-200A) |
| Platen & Carrier Rotation Speed | 0–120 rpm |
| Wafer Backside Pneumatic Pressure | 70–500 g/cm² |
| Retaining Ring Pressure | 70–700 g/cm² |
| Conditioner Type | Swing-Arm Diamond Dresser |
| Conditioner Speed | 0–80 rpm |
| Loading Mode | Semi-Automatic |
| Brand | TSD |
|---|---|
| Origin | Beijing, China |
| Model | TMP-200S / TMP-300S |
| Wafer Size | 6–8 inch (TMP-200S), 8–12 inch (TMP-300S) |
| Platen Speed | 30–200 rpm |
| Carrier Head Speed | 30–200 rpm |
| Wafer Backside Pneumatic Pressure | 0–700 g/cm² |
| Zone-Based Pressure Control | 3-zone (TMP-200S), 3/6-zone (TMP-300S) |
| Retainer Ring Pressure | 0–700 g/cm² |
| Loading/Unloading | Semi-automatic dual-tray (load/unload trays) |
| Conditioning | Swing-arm diamond dresser |
| Brand | TSD |
|---|---|
| Origin | Beijing, China |
| Model Series | TSC-100 / TSC-300S / TSC-200L |
| Configuration Types | Single-Station / Indexing / Inline (Cassette-to-Cassette) |
| Wafer Compatibility | 4–12 inch (TSC-300S), 4–6 inch (TSC-100), 6–8 inch (TSC-200L) |
| Cleaning Modules | DI Water Pre-Rinse, Dual-Side PVA Brush Scrubbing, Optional Megasonics, N₂ Dry Blow-Off, High-Speed Spin Dry |
| Control System | PLC with HMI Touchscreen Interface |
| Automation Level | Manual Loading (TSC-100/TSC-300S), Fully Automated Dual-Arm Robotic Handler (TSC-200L) |
| Footprint | Compact Design Optimized for Cleanroom Space Efficiency |
| Output State | Wet-in, Dry-out Process Flow |
| Brand | TZTEK |
|---|---|
| Origin | Jiangsu, China |
| Manufacturer Type | Original Equipment Manufacturer (OEM) |
| Product Origin | Domestic (China) |
| Model | Spector |
| Pricing | Available Upon Request |
| Optical Modes | Reflective & Transmissive |
| Illumination Options | Visible Light & UV (365 nm) |
| CD Measurement Range | Down to 300 nm |
| 3σ Repeatability | Sub-1 nm (typical) |
| Maximum Mask Size Supported | 14-inch (355 mm) square or custom-shaped reticles |
| Interface Standard | SECS/GEM compliant |
| Brand | TZTEK |
|---|---|
| Origin | Jiangsu, China |
| Manufacturer Type | Original Equipment Manufacturer (OEM) |
| Country of Origin | China |
| Model | TB Series |
| Instrument Category | Optical Patterned Wafer Defect Inspection System |
| Primary Application | Semiconductor Wafer Defect Detection |
| Supported Wafer Diameters | 200 mm (8-inch), 300 mm (12-inch) |
| Compliance | Designed for integration into semiconductor front-end and back-end process lines |
| Brand | ULTECH |
|---|---|
| Origin | South Korea |
| Model | Micro-110 |
| Product Category | Vacuum Probe Station |
| Operation Type | Manual |
| Wafer Size Compatibility | 1–8 inch |
| Temperature Range Options | (a) –40 °C to 200 °C (Peltier), (b) –40 °C to 170 °C (Peltier), (c) RT to 450 °C (Ceramic Heater), (d) RT to 750 °C (Ceramic Heater), (e) 77 K to 300 K (Liquid Nitrogen Cryostat) |
| Vacuum Chamber | Hermetic Sealed with Optical Viewports |
| Gas Delivery | Mass Flow Controller (MFC)-Equipped Multi-Gas Inlet |
| Electrical Interface | Standard Coaxial & Triaxial Feedthroughs |
| Pricing | USD $150,000–$250,000 |
| Brand | ULTECH |
|---|---|
| Origin | South Korea |
| Model | MPS |
| Category | Vacuum Probe Station |
| Operation | Manual |
| Wafer Size Compatibility | 1″ to 8″ |
| Temperature Range Options | −40 °C to 200 °C (Peltier), −40 °C to 170 °C (Peltier), RT to 450 °C (Ceramic Heater), RT to 750 °C (Ceramic Heater), 77 K to 300 K (Liquid Nitrogen Cooling) |
| Vacuum Chamber | Yes, hermetic sealing |
| Gas Delivery | Mass Flow Controller (MFC)-equipped multi-gas inlet |
| Optical Access | Integrated viewport for microscope coupling |
| Electrical Interface | Standard coaxial and triaxial feedthroughs |
| Brand | ULTECH |
|---|---|
| Origin | South Korea |
| Model | ULTECH REAL RTP-100 |
| Instrument Type | High-Vacuum Rapid Annealing Furnace |
| Sample Chamber Dimensions | 870 mm × 650 mm × 620 mm |
| Temperature Range | 100–1250 °C |
| Maximum Ramp Rate | 10–200 °C/s |
| Annealing Temperature Accuracy | ±1.5 °C |
| Temperature Uniformity | ±1.5 °C |
| Vacuum Base Pressure | 5×10⁻³ Torr (standard), down to 5×10⁻⁶ Torr (with dual-stage molecular pump) |
| Gas Lines | Up to 3 MFC-controlled channels |
| Substrate Compatibility | 4-inch wafers |
| Brand | ULVAC KIKO |
|---|---|
| Origin | Japan |
| Model | CS-200Z |
| Configuration | Load-lock type, high-vacuum DC/RF magnetron sputtering system |
| Substrate Compatibility | Ti trays for Φ2″–Φ4″ wafers (max. Φ320 mm) and custom-shaped substrates (e.g., 50×50 mm²) |
| Control System | ULVAC GPCS-2700 integrated PLC + PC-based HMI (English interface) |
| Data Logging | Real-time parameter logging to PC with Excel export capability |
| Footprint | 1500 × 4500 mm (including service clearance) |
| Environment | Designed for Class 100–Class 1000 cleanroom integration |
| Brand | ULVAC KIKO |
|---|---|
| Origin | Japan |
| Model | IMX-350 |
| Product Type | Low-Energy, High-Beam-Current Implanter |
| Implantation Energy | 50 keV |
| Dose Range | 1×10¹⁶ ions/cm² |
| Wafer Size | 6-inch |
| Implant Species | p⁺ (Boron, Phosphorus, Arsenic compatible) |
| Beam Current Capability | High-current configuration |
| Ion Source Options | Liquid Metal Ion Source (LMIS), Dual Plasma Source (for O⁺, N⁺), Mass Analyzer Column |
| Imaging Resolution | 4 nm (dual-beam SEM column) |
| Positioning Accuracy | ≤20 nm (with piezo-driven stage and 1 nm optical encoder) |
| Brand | ULVAC KIKO |
|---|---|
| Origin | Jiangsu, China |
| Manufacturer Type | Authorized Distributor |
| Regional Classification | Domestic (PRC) |
| Model | Customized |
| Product Type | High-Energy Ion Implanter |
| Implant Dose Range | 1×10¹¹ – 1×10¹⁶ atoms/cm² |
| Wafer Sizes Supported | 2", 3", 4", 6", 8" |
| Available Ion Species | B, P, As, Al, S, H, Mg, Si |
| Single-Charge Ion Acceleration Energy | ≥200 keV (with deceleration down to 5 keV) |
| Dose Accuracy | ≤±1.5% |
| Ion Source Configuration | 5-channel solid-source vaporizer (up to 700 °C) |
| Tilt Angles | 0° and 7° (room-temperature stage) |
| Vacuum Performance | Ion Source ≤7×10⁻⁴ Pa |
| Brand | UniTemp |
|---|---|
| Origin | USA |
| Model | 2Z-HVS-200 |
| Vacuum Level | ≤1×10⁻⁶ hPa |
| Max Temperature | 450 °C |
| Programmable Steps | 100 per Recipe, 20 Recipes Stored |
| Optical Process Monitoring | 360° Quartz Viewing Cylinder |
| Cooling | Active Water-Cooled Lower Platen + External Closed-Loop Chiller Recommended (Optional Accessory WC-I) |
| Controller | Siemens SIMATIC® S7-1200 PLC with HMI Interface |
| Data Logging | Real-Time Temperature, Pressure, Gas Flow, and Time Stamping |
| Brand | UniTemp |
|---|---|
| Model | PTP-300 |
| Origin | Germany |
| Chamber Dimensions (Process Zone) | 305 mm × 305 mm × 25 mm |
| Chamber Height | 35 mm |
| Chamber Material | Anodized Aluminum or Optional Quartz Glass |
| External Dimensions | 600 mm × 1850 mm × 880 mm (W × D × H) |
| Gas Inlets | 2 × MFC-controlled lines |
| Vacuum Interface | DN25 KF flange |
| Microwave Generator | 2.45 GHz, 100–600 W (water-cooled, optional chiller) |
| Heating System | 24 IR lamps, total 18 kW |
| Control System | B&R SPS controller PP420 with LCD interface |
| Power Supply | 3/N/PE, AC 50/60 Hz, 230/400 V |
| Brand | UniTemp |
|---|---|
| Origin | Germany |
| Model | RTP-200-HV |
| Instrument Type | High-Vacuum Rapid Thermal Annealing Furnace |
| Sample Size | 200 mm (8-inch wafer) |
| Temperature Range | 0–1200 °C |
| Max. Ramp Rate | 150 °C/s |
| Max. Cool-down Rate | 200 °C/min (from 1000 °C to 400 °C) |
| Temperature Accuracy | < ±1% of setpoint |
| Temperature Uniformity | < ±1% across wafer surface |
| Vacuum Level | ≤1×10⁻⁶ hPa (high-vacuum configuration) |
| Heating Source | Dual-zone halogen lamp array (top & bottom) |
| Cooling Method | Water-cooled chamber + N₂ purge for substrate |
| Gas Control | Up to 4 MFC-controlled lines (N₂, Ar, O₂, H₂/N₂ mix) |
| Control System | SIMATIC S7-based PLC with 7″ HMI touchscreen |
| Program Storage | 50 multi-segment recipes (up to 50 steps each) |
| Dimensions (W×D×H) | 505 × 504 × 420 mm |
| Weight | ~55 kg |
| Brand | UniTemp |
|---|---|
| Model | VSS-300 |
| Origin | Germany |
| Chamber Dimensions | 350 × 350 × 75 mm (expandable to 300 mm height) |
| Max Ramp-Up Rate | 150 K/min |
| Max Ramp-Down Rate | 120 K/min |
| Bottom Heating Power | 2 × 12-lamp arrays, 18 kW total |
| Cooling | Water-cooled graphite plate (310 × 310 mm) |
| Control System | SIMATIC PLC with 7" touchscreen HMI |
| Programmable Steps | 50 programs × 50 steps each |
| Process Gas Flow | Standard 1.5 sL/min MFC (up to 4 gas lines optional) |
| Vacuum Options | MPC (10 hPa) or RVP (10⁻³ hPa) |
| Power Supply | 3-phase + N + PE, 230 V, CEE 3×32 A |
| Weight | ~140 kg |
| Compliance | Designed for ISO 9001-compliant SMT manufacturing environments |
| Enclosure Material | Polished aluminum chamber walls (stainless steel optional) |
| Brand | VC Plasma |
|---|---|
| Origin | Guangdong, China |
| Manufacturer Type | Authorized Distributor |
| Country of Origin | China |
| Model | AP-C350 |
| Pricing | Available Upon Request |
| Brand | VC Plasma |
|---|---|
| Origin | Guangdong, China |
| Manufacturer Type | Authorized Distributor |
| Country of Origin | China |
| Model | 441 |
| Quotation | Upon Request |
| Frame Material | Full Aluminum Extrusion |
| Enclosure | 441-Series Steel Sheet Housing |
| Motor-Controlled Axes | 3-axis (X/Y/Z) |
| Drive System | Stepper Motors + Synchronous Belt Transmission |
| Working Envelope | X: 400 mm |
| Y | 400 mm |
| Z | 100 mm |
| Compatible Processes | Low-temperature Plasma Cleaning, Dry Ice Jet Cleaning, Precision Dispensing |
| Brand | VC Plasma |
|---|---|
| Origin | Guangdong, China |
| Manufacturer Type | Authorized Distributor |
| Country of Origin | China |
| Model | MicroClean Series |
| Pricing | Available Upon Request |
| Brand | VC Plasma |
|---|---|
| Origin | Guangdong, China |
| Manufacturer Type | Authorized Distributor |
| Country of Origin | China |
| Model | VC-004 |
| Pricing | Available Upon Request |