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| Brand | Korea Vacuum |
|---|---|
| Origin | South Korea |
| Model | PECVD/RIE |
| Heating Method | Hot-Wall |
| Application Domain | Semiconductor Fabrication |
| Gas Channels | 8 (4 for PECVD, 4 for RIE) |
| Deposited Films | SiOₓ, SiNₓ |
| Base Pressure | 1×10⁻⁷ Torr |
| Operating Pressure Range (PECVD) | 1×10⁻³ Torr |
| Operating Pressure Range (RIE) | 0.02–500 mTorr |
| Maximum Substrate Size | 8-inch (200 mm) |
| RF Source Power | 600 W, 13.56 MHz |
| RF Bias Power | 300 W, 13.56 MHz |
| Platen Temperature | Up to 400 °C |
| Pumping System | 200 L/sec corrosion-resistant turbomolecular pump (Pfeiffer TPH261PC) + BOC Edwards RV12 roughing pump |
| Gas Distribution | Showerhead-type for both PECVD and RIE |
| Substrate Handling | Manual loading with pneumatic top-hinged lid |
| Vacuum Gauges | Baratron capacitance manometer (RIE), BOC Edwards wide-range gauge (PECVD & RIE) |
| MFC Count | 4 (PECVD), 3 (RIE) |
| Cooling | Water-cooled platen and electrodes |
| Control Interface | LabVIEW-based PC control with automated pressure regulation and process sequencing |
| Brand | Kaufman & Robinson, Inc. (KRI) |
|---|---|
| Origin | USA |
| Model | EH 3000 HC |
| Discharge Voltage/Current | 50–300 V / up to 20 A |
| Beam Divergence (HWHM) | >45° |
| Cooling | Water-cooled |
| Compatible Gases | Ar, Xe, Kr, O₂, N₂ |
| Dimensions | Ø9.7" × H6" |
| Application | IBAD for high-density, uniform optical thin-film deposition |
| Brand | Kaufman & Robinson, Inc. |
|---|---|
| Origin | USA |
| Model | eH 400 |
| Discharge Voltage Range | 40–300 V DC |
| Discharge Current | Up to 5 A |
| Beam Diameter | ~4 cm |
| Beam Divergence (HWHM) | >45° |
| Anode Configuration | Modular, Grooved or Standard |
| Cooling | Water-Cooled Front Plate |
| Dimensions (D×H) | 3.7″ × 3.0″ |
| Operating Gases | Ar, Xe, Kr, O₂, N₂, Organic Precursors |
| Mounting Distance | 6–30″ |
| Gas Control Channels | 4 (programmable) |
| Compatible Vacuum Environments | Load-Lock & UHV Systems |
| Applications | Ion-Assisted Deposition (IAD), In-Situ Pre-Cleaning, Low-Energy Etching (≤300 eV), III-V Semiconductor Processing, Polymer Substrate Treatment |
| Brand | KRI (Kaufman & Robinson, Inc.) |
|---|---|
| Origin | USA |
| Model | KDC Series (KDC-10, KDC-40, KDC-75, KDC-100, KDC-160) |
| Beam Current | >10–650 mA |
| Acceleration Voltage | 100–1200 V |
| Grid Diameter | 1–16 cm Φ |
| Operating Gases | Ar, Kr, Xe, O₂, N₂, H₂ |
| Typical Chamber Pressure | < 0.5 mTorr |
| Beam Modes | Focused, Parallel, Divergent |
| Gas Flow Rate | 1–30 sccm |
| Dimensions (L × D) | 11.5–25.2 cm × 4–23.2 cm |
| Brand | KRI (Kimball Physics / Kaufman Research Institute) |
|---|---|
| Origin | USA |
| Model | KDC 100 |
| Ion Energy Range | 100–1200 eV |
| Max Ion Current | >400 mA |
| Grid Diameter | 12 cm |
| Cathode Configuration | Dual Filament |
| Magnetic Confinement | DC |
| Anode Voltage | 0–100 V DC |
| Neutralizer Options | Sidewinder Filament, LFN-2000, or standard filament |
| Beam Profile | Parallel or Divergent |
| Mounting | Quick-Release or Movable Flange |
| Operating Gas Compatibility | Inert (Ar, Xe), Reactive (O₂, N₂, CF₄), and Mixed Gases |
| Recommended Source-to-Substrate Distance | 8–36 inches |
| Gas Control Channels | Up to 4 independently regulated gas inlets |
| Optional | Motorized Tilt Mount for Beam Angle Adjustment |
| Compliance | Designed for integration into UHV and HV vacuum systems (≤1×10⁻⁷ Torr base pressure) |
| Brand | KRI (Kaufman & Robinson, Inc.) |
|---|---|
| Origin | USA |
| Model | KDC Series (KDC-10, KDC-40, KDC-75, KDC-100, KDC-160) |
| Ion Extraction Aperture Diameter | 1 cm to 16 cm |
| Beam Voltage (Vb) | Up to 1000 V DC |
| Beam Current (Ib) | Up to 84 mA |
| Acceleration Voltage (Va) | −200 V DC |
| Operating Gas | Argon (Ar) |
| Confinement | DC Magnetic Confinement |
| Cathode | Thermionic Filament |
| Anode Voltage | 0–100 V DC |
| Grid Type | Dedicated Self-Aligning Grid |
| Compliance | Designed for integration into IBF systems compliant with ISO 10110-7 (optical surface form), SEMI F26 (silicon wafer processing), and GLP-aligned vacuum process environments |
| Brand | Kaufman & Robinson, Inc. |
|---|---|
| Origin | USA |
| Model | RFICP 140 |
| Anode RF Power | 1 kW (1.8 MHz) |
| Ion Beam Energy | 100–1200 eV |
| Max. Ion Current | >500 mA |
| Gas Compatibility | Ar, O₂, N₂, others |
| Gas Flow Rate | 5–40 sccm |
| Operating Pressure | <0.5 mTorr |
| Beam Aperture | 14 cm Ø |
| Grid Material | Molybdenum / Graphite |
| Beam Optics | OptiBeam™ self-aligning ion optics |
| Neutralizer | LFN 2000 |
| Dimensions | 25.1 cm H × 24.6 cm D |
| Flange | 12" CF |
| Brand | Kingsemi |
|---|---|
| Origin | Liaoning, China |
| Model | KS-FT200/300 (8"/12" Front-End Process) |
| Application | ArF/KrF/I-Line photoresists, PI, BARC, SOC, SOD, SOG |
| Integration | Compatible with track-to-scanner inline lithography systems |
| Certification | Compliant with SEMI S2/S8 safety standards, ISO 14644-1 Class 5 cleanroom operation |
| Architecture | Modular stackable design |
| Thermal Control | Optional high-precision hot/cold plates (±0.1°C uniformity) |
| Inspection | Optional integrated Wafer Edge Exposure (WEE) and Automated Optical Inspection (AOI) modules |
| Maintenance | Front-accessible modular units with tool-less panel removal |
| Brand | Kingsemi |
|---|---|
| Model | KS-S150 |
| Configuration | Star-type fully automated coater/developer |
| Substrate Compatibility | Sapphire, GaAs, SiC wafers (4", 6") |
| Throughput | ≥190 wafers/hour (coating module) |
| Photoresist Consumption | 0.6 mL per 4" wafer |
| Certification | CSA Certified |
| Origin | Liaoning, China |
| Equipment Type | Semiconductor Coater/Developer for Patterning Processes |
| Application Scope | LED-PSS, compound semiconductor fabrication, sensor ICs, optical communication chips, power devices, patterned sapphire substrates |
| Brand | Kingsemi |
|---|---|
| Model | KS-S150-6ST |
| Origin | Liaoning, China |
| Equipment Type | Semiconductor Resist Stripping System |
| Configuration | 6-Station Wet Processing Platform |
| Vacuum Handling | Dual-Vacuum Dual-Clamp High-Speed Robotic Arm |
| Alignment | Automated Wafer Centering (AWC) with Vision-Based Recognition |
| Bath Compatibility | Multi-Size & Multi-Angle Immersion Modules (150 mm to 200 mm wafers) |
| Pressure Control | Closed-Loop High-Pressure Fluid Delivery (±0.2 MPa accuracy) |
| Heating System | In-Line High-Pressure Resistant Heater (PID-controlled, ≤120 °C) |
| Chuck Type | Actively Clamped, Backside-Protected Electrostatic/ Mechanical Chuck |
| Chemical Recovery | Integrated Solvent Recovery and Recirculation Loop |
| Compliance | Designed for Class 100 Cleanroom Integration |
| Brand | k-Space Associates |
|---|---|
| Origin | USA |
| Model | kSA MOS |
| Stress Measurement Range | 0.32 MPa – 7.8 GPa |
| Measurement Technology | Multi-Beam Optical Sensor (MOS) |
| Operating Temperature | Ambient to system process temperature (vacuum chamber compatible) |
| Compliance | Designed for UHV/MBE/MOCVD integration, vacuum-rated optical interface, ISO 9001-manufactured instrumentation |
| Brand | k-Space Associates |
|---|---|
| Origin | USA |
| Manufacturer Status | Authorized Distributor |
| Origin Category | Imported |
| Model | kSA MOS TS |
| Price Range | USD 70,000 – 115,000 (approx.) |
| Stress Measurement Range | MPa to GPa |
| Measurement Technology | Multi-Beam Optical Sensor (MOS) Laser Array |
| Operating Temperature Range | RT to 1000°C |
| Curvature Resolution | ≥100 km radius detection limit |
| XY Scan Range | up to 300 mm (optional) |
| XY Scan Speed | up to 20 mm/s |
| XY Step Resolution | 2 µm |
| Compatible Wafer Diameters | 50 mm, 75 mm, 100 mm, 150 mm, 200 mm, 300 mm |
| Temperature Uniformity | ±2°C |
| Environmental Control | Vacuum & low-pressure inert/oxidizing gas (N₂, Ar, O₂) |
| Brand | k-Space |
|---|---|
| Origin | USA |
| Manufacturer Status | Authorized Distributor |
| Product Origin | Imported |
| Model | kSA MOS UltraScan |
| Stress Measurement Range | 0.32 MPa – 7.8 GPa |
| Measurement Technology | Multi-Beam Optical Sensor (MOS) Laser Array |
| Operating Temperature | Ambient or Variable-Temperature Mode |
| Brand | Lake Shore |
|---|---|
| Origin | USA |
| Manufacturer Status | Authorized Distributor |
| Product Origin | Imported |
| Model | CPX |
| Pricing | Upon Request |
| Brand | Lake Shore |
|---|---|
| Origin | USA |
| Model | CPX-VF |
| Temperature Range | 1.9 K to 400 K |
| Magnetic Field | ±2.5 T (vertical, superconducting solenoid) |
| Sample Diameter | Up to 51 mm (2") |
| Vacuum Base Pressure | <5×10⁻⁷ Torr (with PS-HV-CPX) |
| Probe Capacity | Up to 6 arms |
| Microwave Frequency Range | DC–67 GHz |
| Positional Stability | <30 nm (with PS-PVIS option) |
| Hall Effect Measurement Capability | Yes |
| UHV & Transfer-Compatible Vacuum Chamber Options | Available |
| Brand | Lake Shore |
|---|---|
| Origin | USA |
| Model | CRX-4K |
| Temperature Range | 4.5 K to 350 K (optional up to 675 K) |
| Base Temperature | 4.5 K (2-probe configuration) |
| Vacuum Base Pressure | <1×10⁻⁵ Torr |
| Pumping System | TPS-FRG turbomolecular pump set |
| Sample Diameter | Standard 51 mm (2"), optional 102 mm (4") |
| Max Probe Count | 6 |
| DC/RF Probe Insulation | >100 GΩ |
| Microwave Frequency Range | DC to 67 GHz |
| Fiber-Optic Integration | Supported |
| Vibration Level | <1 µm |
| Landing Area | 25.4 mm diameter circle |
| Brand | Lake Shore |
|---|---|
| Origin | USA |
| Model | CRX-6.5K |
| Cooling Method | Two-Stage Closed-Cycle Refrigerator |
| Base Temperature | 8 K (2-probe configuration) to 10 K (6-probe configuration) |
| Temperature Control Range | 8.5–350 K (standard), extendable to 20–675 K with PS-HTSTAGE option |
| Vacuum Level | <5×10⁻⁴ Torr at room temperature, <1×10⁻⁵ Torr at base temperature, <5×10⁻⁵ Torr at max temperature |
| Sample Diameter Capacity | Up to 51 mm (2 in) |
| Probe Arm Capacity | Up to 6 arms |
| DC/RF Probe Insulation Resistance | >100 GΩ |
| Microwave Probe Frequency Range | DC to 67 GHz |
| Optical Fiber Probe Compatibility | Yes (for electro-optic measurements) |
| Landing Area | 25.4 mm diameter circle |
| Vibration Level | <2 µm RMS |
| Thermal Stability | ±25 mK (<10 K), ±10 mK (11–350 K), ±50 mK (351–675 K) |
| Total Cool-down Time | 6.25 h (including 0.5 h pump-down, 3.5 h cooling, 2.25 h warm-up) |
| Brand | Lake Shore |
|---|---|
| Origin | USA |
| Manufacturer Status | Authorized Distributor |
| Origin Category | Imported |
| Model | CRX-EM-HF |
| Price | Upon Request |
| Temperature Range | 8 K to 400 K |
| Magnetic Field | ±0.6 T (horizontal, in-plane) |
| Max Sample Diameter | 25.4 mm (1 inch) |
| Vacuum Base Pressure | <1 × 10⁻⁵ Torr (at base temperature) |
| Probe Arms | Up to 4 |
| Sample Rotation | 360° optional |
| Probe Positioning Accuracy | <5 µm over full field sweep |
| DC/RF Insulation | >100 GΩ |
| Microwave Frequency Range | DC to 67 GHz |
| Optical Access | Fiber-coupled electro-optic probing supported |
| Brand | Lake Shore |
|---|---|
| Origin | USA |
| Manufacturer Type | Authorized Distributor |
| Origin Category | Imported |
| Model | CRX-VF |
| Pricing | Upon Request |
| Brand | Lake Shore |
|---|---|
| Origin | USA |
| Manufacturer Status | Authorized Distributor |
| Product Origin | Imported |
| Model | Custom |
| Pricing | Upon Request |
| Brand | Lake Shore |
|---|---|
| Origin | USA |
| Model | EMPX-H2 |
| Temperature Range | 3.2 K to 400 K |
| Magnetic Field | ±0.6 T (horizontal, in-plane) |
| Maximum Sample Diameter | 25.4 mm (1") |
| Magnetic Uniformity | 0.6% over Ø10 mm, 2.6% over Ø25 mm |
| Probe Position Stability | <5 µm across full field sweep |
| Vacuum Base Pressure | <1 × 10⁻⁵ Torr |
| Cooling Method | Continuous-flow cryogen (liquid He or N₂) |
| Sample Rotation | Optional 360° (PS-360-EMPX) |
| Probe Arms | Up to 4 |
| Microwave Frequency Support | DC–67 GHz |
| Electrical Isolation | >100 GΩ |
| Optical Integration | Fiber-coupled electro-optic measurement capability |
| Brand | Lake Shore |
|---|---|
| Origin | USA |
| Manufacturer Status | Authorized Distributor |
| Product Origin | Imported |
| Model | FWPX |
| Pricing | Upon Request |
| Brand | Lake Shore |
|---|---|
| Origin | USA |
| Model | PS-100 |
| Temperature Range | 4.2 K to 475 K (standard), down to 3.2 K with PS-LT option |
| Sample Diameter | up to 32 mm (1.25 in) |
| Vacuum Base Pressure | <1 × 10⁻⁵ Torr |
| Vibration | <300 nm (standard), <30 nm with PS-PVIS option |
| Probe Arms | up to 4 |
| Cooling Method | Continuous-flow liquid helium or liquid nitrogen |
| Thermal Stability | ±15 mK typical at 4.4–100 K (liquid helium) |
| Electrical Isolation | >100 GΩ |
| RF/Microwave Capability | DC–67 GHz (with optional microwave probes) |
| Optical Access | Fiber-optic probe compatibility for electro-optical measurements |
| Drop-in Area | 25.4 mm diameter circular zone |
| Thermal Sinking | Probe arms actively cooled to <35 K at base temperature |
| Control System | Compatible with Lake Shore Model 336 Temperature Controller |
| Brand | Lake Shore |
|---|---|
| Origin | USA |
| Manufacturer Status | Authorized Distributor |
| Product Origin | Imported |
| Model | TTPX |
| Pricing | Upon Request |
| Brand | Laurell |
|---|---|
| Origin | USA |
| Model | H6-15 |
| Maximum Speed | 12,000 rpm (at 100 mm Si wafer) |
| Substrate Compatibility | up to 300 mm wafers and 9″ × 9″ (229 mm × 229 mm) square substrates |
| Control Interface | Wireless tablet with Laurell Touch software |
| Firmware Upgradability | Field-upgradable via downloadable updates |
| Software | Spin3000 PC-based process management suite (free, includes virtual simulation mode) |
| Enclosure Compatibility | Designed for integration into gloveboxes |
| Modular Expansion | Field-upgradable via plug-in modules |
| Compliance | Supports GLP/GMP traceability requirements through audit-ready process logging |
| Brand | Laurell |
|---|---|
| Origin | USA |
| Model | WS-650-8B |
| Maximum Substrate Size | 200 mm wafer or 178 mm × 178 mm square substrate |
| Max Speed | 12,000 rpm (at 100 mm Si wafer) |
| Controller | 650 Series Microprocessor-Based Process Controller |
| Software | Spin3000 PC Control & Simulation Suite (free, optional but fully compatible) |
| Housing Material | Chemically resistant solid copolymer blend (standard) or PTFE Hostaflon® TFM-1600 / Teflon® AF (optional, high-temp/ultra-clean) |
| Sealing | Proprietary labyrinth seal with N₂ purge capability |
| Compliance | Designed for ISO Class 5–4 cleanroom integration |
| Brand | Laurell |
|---|---|
| Origin | USA |
| Model | WS-650Mz-23N |
| Maximum Speed | 12,000 rpm |
| Acceleration | 0–12,000 rpm/sec |
| Speed Accuracy | ≤ ±1 rpm (NIST-traceable) |
| Speed Stability | < ±1% |
| Time Resolution | 0.1 sec (1–5999.9 sec/step) |
| Chuck Compatibility | Ø10–150 mm wafers or 125×125 mm square substrates |
| Chamber Diameter | 9.5 in (241 mm) |
| Controller | PLC-based with SPIN3000 software integration |
| Construction Material | NPP (Natural Polypropylene) |
| Programmability | 20 stored recipes, up to 51 steps per recipe |
| Vacuum System | Oil-free pump, 220–240 VAC, 50/60 Hz |
| Leveling | Included NIST-calibrated digital level |
| Brand | LEBO Science |
|---|---|
| Origin | Imported |
| Manufacturer Type | Authorized Distributor |
| Model | Customized-2 |
| Wafer Compatibility | Fragments to 200 mm (customizable up to 300 mm with quad-nozzle configuration) |
| Development Modes | Single-step & Multi-step Programmable Process |
| Max. Spin Speed | 3000 rpm (no-load) |
| Speed Resolution | ±1 rpm |
| Acceleration Range | 10–10,000 rpm/sec (no-load) |
| Step Duration Range | 0–3000 sec |
| Time Resolution | 0.1 sec |
| Nozzle Control | Motorized XYZ-positioning with programmable trajectory |
| Fluid Delivery | 1 dedicated developer channel + 1 deionized water rinse channel + 1 N₂ purge channel |
| Compliance | Designed for Class 100–1000 cleanroom environments |
| Software | Onboard HMI with 100 user-editable process recipes |
| Brand | LEBO Science |
|---|---|
| Origin | Jiangyin, Jiangsu, China |
| Model | UC100-SE |
| Rated Voltage | AC 220 V, 50 Hz |
| Lamp Power | 275–300 W |
| Lamp Lifetime | ≥8,000 h |
| Emission Wavelengths | 184/185 nm + 254 nm |
| Maximum Substrate Size | ≤8-inch (200 mm) |
| Dimensions (W×D×H) | 330 × 400–420 × 315 mm |
| Weight | 15–16 kg |
| Brand | LEI-TECH |
|---|---|
| Origin | Tianjin, China |
| Manufacturer Type | Original Equipment Manufacturer (OEM) |
| Product Category | Domestic |
| Model | LK-BY86 |
| Pricing | Upon Request |
| Instrument Type | Optical Patterned Defect Inspection System |
| Primary Applications | Front-end & back-end wafer process monitoring, outgoing wafer quality control, automated wafer handling |
| Compatible Wafer Diameters | 150 mm (6″), 200 mm (8″), 300 mm (12″) |