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| Brand | MPI |
|---|---|
| Origin | Taiwan |
| Model | TS150 & TS200 & TS300 |
| Probe Station Type | Manual RF Probe Station |
| Wafer Compatibility | 150 mm (6″), 200 mm (8″), 300 mm (12″) |
| Platen Lift Range | 0–300 µm / 3 mm (3-stage) |
| Positioning Repeatability | ±1 µm |
| XY-θ Motion Stage | 25 × 25 mm with micrometer adjustment |
| Z-Axis Fine Adjustment | 25 mm travel with 1 mm engraved scale |
| RF MicroPositioner Capacity | up to 4 four-port RF probes or 10 DC probes |
| Thermal Chuck Compatibility | ERS-series temperature-controlled chucks (–60 °C to +300 °C) |
| Optical Options | MPI SZ10 stereo zoom, MZ12 monocular zoom, 90° tilt standard |
| Vibration Isolation | Integrated damping base |
| EMI Shielding | Optional light-tight, EMI-shielded enclosure |
| Brand | RKD |
|---|---|
| Origin | USA |
| Model | Elite Etch Cu Chemical Decapsulation System |
| Fluid Delivery Precision | Micro-dosed HNO₃ / H₂SO₄ / mixed acid |
| Maximum Acid Flow Rate | 8 mL/min |
| Acid Temperature Control Range | 10–250 °C |
| Minimum Wire Diameter Compatible | 0.8 mil (20.3 µm) Cu |
| Safety Features | Dual-sealed fluid interfaces, real-time leak detection, N₂ pressure interlock, fiber-optic lid sealing verification, cooled waste acid collection (<90 °C) |
| Control Interface | External handheld keypad |
| Compliance | Designed for ISO/IEC 17025 lab environments |
| Brand | Hitachi |
|---|---|
| Origin | Japan |
| Model | IM400II / ArBlade 5000 |
| Sample Stage Cooling | Yes (Optional) |
| Vacuum Transfer Capability | Yes (Optional) |
| Dual-Stage Milling Mode | Yes |
| Touchscreen Interface | Yes |
| Maximum Cross-Section Width | 8 mm (±5 mm Traverse Range) |
| Ion Gun Configuration | PLUS Ion Gun (IM400II), PLUS II Ion Gun (ArBlade 5000) |
| Compliance | Designed for SEM/TEM sample preparation per ISO 14644-1 Class 5 cleanroom-compatible operation |
| Brand | RKD |
|---|---|
| Origin | USA |
| Model | RA-880 Laser Decapsulation System |
| Application | Semiconductor Plastic Encapsulant Removal |
| Compliance | Designed for ISO/IEC 17025-aligned failure analysis labs |
| Software Control | Windows-based real-time co-focal imaging & programmable laser scanning platform |
| Laser Type | Q-switched Nd:YAG (1064 nm) with variable pulse width and energy modulation |
| Focus Control | Auto-focus sensor with programmable depth-of-field (DOF) adjustment |
| Imaging | Integrated high-resolution coaxial CCD with 10×–50× optical zoom and real-time overlay of scan path |
| Pattern Definition | Vector-based graphical interface supporting DXF, JPEG, BMP import |
| Energy Management | Closed-loop pulse energy monitoring with ±2% stability |
| Reproducibility | <±3 µm positional repeatability across >1000 cycles |
| Maintenance | Solid-state laser source |
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