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| Brand | ALPHA |
|---|---|
| Origin | Netherlands |
| Manufacturer Type | Authorized Distributor & Service Provider |
| Equipment Origin | Imported |
| Model | Stepper Photolithography System – Technical Support & Refurbishment Package |
| Pricing | Available Upon Request |
| Brand | ALPHA |
|---|---|
| Origin | Netherlands |
| Manufacturer Type | Authorized Distributor |
| Origin Category | Imported Equipment |
| Model | Refurbished Stepper Photolithography System |
| Pricing | Available Upon Request |
| Brand | Accretech (Tokyo Seimitsu) |
|---|---|
| Origin | Netherlands |
| Model | ChaMP-211 |
| Wafer Sizes Supported | 100 mm, 150 mm, 200 mm |
| Polishing Head Configurations | 2–8 inch |
| Automation Options | Optional auto-loader integration |
| Cleaning System | Integrated post-polish cleaning module |
| Endpoint Detection | Optional optical endpoint monitoring |
| Air-bearing Carrier Design | Yes |
| Edge Control | Ring-type independent pressure zones |
| Quick-change Retainer/Retaining Ring | <60-second swap time |
| Footprint | Compact design for R&D and pilot-line integration |
| Compliance | Designed to meet semiconductor cleanroom requirements (ISO Class 5 compatible), supports GLP/GMP-aligned process documentation workflows |
| Brand | Accretech (Tokyo Seimitsu) |
|---|---|
| Origin | Japan |
| Model | ChaMP-232 |
| Wafer Compatibility | Φ100 mm, Φ150 mm, Φ200 mm |
| Polishing Head Type | Pneumatic Floating Head with Zonal Pressure Control |
| Endpoint Detection | Integrated Optical End-Point Monitoring System |
| Cleaning Module | Integrated ChaMP Wet Cleaning System |
| Compliance | Designed for Semiconductor Front-End Manufacturing Environments |
| Vendor Status | Authorized Distributor (Non-OEM) |
| Import Category | Imported Equipment |
| Brand | ACCRETECH (Tokyo Seimitsu) |
|---|---|
| Origin | Japan |
| Manufacturer Type | Authorized Distributor |
| Origin Category | Imported |
| Model | 20 IBE-C |
| Pricing | Upon Request |
| Brand | Accretech (Tokyo Seimitsu) |
|---|---|
| Origin | Netherlands |
| Manufacturer Type | Authorized Distributor |
| Origin Category | Imported Instrument |
| Model | AD3000T-PLUS |
| Pricing | Upon Request |
| Brand | ACCRETECH (Tokyo Seimitsu) |
|---|---|
| Origin | Japan |
| Manufacturer Type | Authorized Distributor |
| Origin Category | Imported |
| Model | Hakuto IBE-4000 |
| Pricing | Upon Request |
| Brand | ACCRETECH (Tokyo Seimitsu) |
|---|---|
| Origin | Netherlands |
| Model | Fortia |
| Wafer Size Support | Φ200 mm |
| Application Focus | DC High-Current/High-Voltage, Avalanche (L-Load), and Wide-Temperature Range Characterization of Power Devices |
| Temperature Range | -65 °C to +300 °C (configurable) |
| Probe Card Compatibility | Up to 330 mm² PLP (Probe Landing Pad) |
| Interface Standards | GEM/SECS-II, TCP/IP, GB-IB, VegaNet |
| Motion Control | Integrated ATi Unit (ACCRETECH TESEC Interface) with DARUMA Stage and Pressurized Chuck |
| Safety Features | Fast Path Interruption during Avalanche Testing, Fault-Triggered Electrical Isolation |
| Brand | Accretech |
|---|---|
| Origin | Japan |
| Manufacturer Type | Authorized Distributor |
| Product Category | Imported Semiconductor CMP Equipment |
| Model | ChaMP-332 |
| Wafer Compatibility | Φ300 mm and Φ200 mm |
| Polishing Head Type | Pneumatic Floating Carrier with Zonal Pressure Control |
| Endpoint Detection | Integrated Optical End-Point Monitoring System |
| Cleaning System | Integrated ChaMP Wet-Cleaning Module |
| Edge Exclusion | ≤1.0 mm |
| Carrier Change Time | <60 seconds (ring-only replacement) |
| Compliance | Designed for ISO 14644-1 Class 5 cleanroom integration |
| Software Architecture | Windows-based control with audit trail and user access levels |
| Brand | Accretech |
|---|---|
| Origin | Netherlands |
| Manufacturer Type | Authorized Distributor |
| Product Origin | Imported |
| Model | ChaMP-211 / ChaMP-232 / ChaMP-332 |
| Wafer Sizes Supported | 100 mm, 150 mm, 200 mm, and 300 mm |
| Head Configurations | 2–8 inch carrier compatibility |
| Footprint | Compact design optimized for R&D, pilot-line, and high-mix production environments |
| Brand | Accretech |
|---|---|
| Origin | Netherlands |
| Manufacturer Type | Authorized Distributor |
| Product Category | Imported Semiconductor Processing Equipment |
| Model | HRG3000RMX |
| Pricing | Available Upon Request |
| Origin | Imported |
|---|---|
| Manufacturer Type | Authorized Distributor |
| Model | CAMTEK Eagle-I / Eagle-AP / EagleT-i |
| Price Range | USD 650,000 – 1,050,000 |
| Inspection Throughput | Up to 50 million bump measurement points per wafer |
| 2D Detection Resolution | 0.2 µm |
| 3D Height Measurement Accuracy | ±0.05 µm (Measurement Range: 2–100 µm) |
| Minimum Detectable Feature Size | 2 µm bump / 2 µm line width |
| Defect Sensitivity | Down to 0.2 µm surface anomalies |
| Origin | Germany |
|---|---|
| Manufacturer Type | Authorized Distributor |
| Origin Category | Imported |
| Model | Etchlab 200 |
| Etching Principle | Equipped with magnetic-field-enhanced Inductively Coupled Plasma (ICP/ISM) or Non-Linear Discharge (NLD) plasma source |
| Etch Rate | Up to 1 µm/min (material and process dependent) |
| Wafer Size Compatibility | 100–200 mm (standard), upgradable to 300 mm |
| Selectivity | Up to 1:20 (e.g., SiO₂:Si) |
| Uniformity | ±5% across wafer |
| Residue Level | <1% (post-etch residue coverage) |
| Aspect Ratio Capability | Up to 1:20 (depth:width) |
| Brand | Bruker |
|---|---|
| Origin | Malaysia |
| Manufacturer Type | Authorized Distributor |
| Origin Category | Imported |
| Model | Dimension Icon |
| Instrument Type | Atomic Force Microscope |
| X-Y Positioning Noise (Closed-Loop) | ≤0.15 nm RMS (Standard Imaging Bandwidth, up to 625 Hz) |
| Z Positioning Noise (Closed-Loop) | 35 pm RMS (Standard Imaging Bandwidth, up to 625 Hz) |
| Maximum Sample Diameter | 210 mm |
| Sample Stage Travel Range | 150 mm |
| Origin | USA |
|---|---|
| Manufacturer Type | Authorized Distributor |
| Origin Category | Imported |
| Model | Nordson Dage Quadra™ 5 |
| Price Range | USD $130,000–$195,000 (est.) |
| Instrument Type | Scanning X-ray System |
| X-ray Tube Power | ≤10 W (0.35 µm spot size), ≤20 W (0.95 µm spot size) |
| X-ray Source | QuadraNT™ Sealed Transmission Tube |
| Detector | AspireFP™ Flat-Panel Detector |
| Integrated Micro-CT Stage | Yes |
| Thermal Stage for Reflow Simulation | Yes |
| Compliance Standards | IPC-A-610, IPC-7095, ISO/IEC 17025 (for lab accreditation), FDA 21 CFR Part 11 (software audit trail enabled) |
| Key | Origin: Imported |
|---|---|
| Manufacturer Type | Authorized Distributor |
| Model | Eagle-I |
| Inspection Speed | 50 million bump measurement points per wafer |
| 2D Detection Accuracy | 0.2 µm |
| 3D Height Measurement Accuracy | 0.05 µm (Measurement Range: 2–100 µm) |
| Origin | USA |
|---|---|
| Manufacturer Type | Authorized Distributor |
| Origin Category | Imported |
| Model | Sonoscan D9650 C-SAM |
| Instrument Type | Digital |
| Compliance | ASTM E1783, ISO/IEC 17025-compatible workflow support, GLP/GMP-ready audit trail (via Sonolytics software) |
| Brand | Camtek / FRT |
|---|---|
| Origin | Germany |
| Manufacturer Type | Authorized Distributor |
| Import Status | Imported |
| Model | MicroProf®100 |
| Detection Speed | Up to 50 million measurement points per wafer |
| 2D Lateral Resolution | 0.2 µm |
| 3D Vertical Height Accuracy | ±0.05 µm (measuring range: 2–100 µm) |
| Dual-Sided Measurement Capability | Yes (TTV/Bow/Warp/TIR/LTV) |
| Optical Principle | White-light Interferometry & Chromatic Confocal Sensing |
| Optional IR Sensor | Integrated for backside thickness monitoring of Si, GaAs, InP, SiC, GaN wafers |
| Compliance | SEMI Standard-compliant dual-probe architecture |
| Form Factor | Compact benchtop metrology platform |
| Origin | Germany |
|---|---|
| Manufacturer Type | Authorized Distributor |
| Origin Category | Imported |
| Model | Centrotherm c.RAPID 150 / RTP 150 |
| Instrument Type | High-Vacuum Rapid Thermal Annealing Furnace |
| Sample Size | 6-inch wafer or substrate |
| Operating Atmosphere | Ambient pressure or controlled vacuum (1–50 mbar) |
| Max. Ramp Rate | 150 K/s |
| Max. Cool-down Rate | 150 K/s |
| Temperature Accuracy | ±1 °C |
| Temperature Uniformity | ±0.5 °C across 6″ wafer |
| Max. Process Temperature | 1150 °C (unlimited dwell at ≤750 °C) |
| Heating System | 24 independently PWM-controlled lamp arrays |
| Cooling Water Requirement | 20 L/min |
| Exhaust Flow | 250 m³/h |
| Substrate Compatibility | Si, GaAs, SiC, GaN, Sapphire, graphite carriers |
| Brand | EVG (EV Group) |
|---|---|
| Origin | Austria |
| Equipment Type | Single-Wafer Wet Cleaning System |
| Wafer Diameter Support | 4–12 inch |
| Cleaning Method | Wet Chemical + DI Water Rinse + Optional Megasonics (1 MHz) / Brush / Diluted Chemistry |
| Throughput | 150 wafers/hour |
| Footprint | 2400 × 4720 × 2555 mm (W × L × H) |
| Process Compatibility | Co-D2W (Compound Die-to-Wafer) Bonding, Hybrid & Fusion Bonding Integration |
| Automation Interface | FOUP-to-FOUP and Cassette-to-Cassette |
| Edge & Backside Treatment | Optional |
| Cross-Contamination Control | Front-to-Back Isolation Architecture |
| Remote Diagnostics | Integrated Ethernet-based Service Protocol |
| Software Control | Fully Programmable Recipe Management with Audit Trail Logging |
| Origin | Germany |
|---|---|
| Manufacturer Type | Authorized Distributor |
| Origin Category | Imported |
| Model | SI 500 |
| Price | USD 295,000 (FOB Hamburg) |
| RF Source Frequency | 13.56 MHz |
| ICP Power | 1200 W |
| Bias RF Power | 600 W |
| Plasma Source | Planar Triple Spiral Antenna (PTSA) |
| Endpoint Detection | Interferometric In-situ Monitoring |
| Vacuum System | High-throughput Dry Pumping with Independent Gas Flow & Pressure Control |
| Software | SENTECH Advanced Plasma Process Control (APPC) v5.x |
| Brand | EV Group (EVG) |
|---|---|
| Origin | Austria |
| Manufacturer Type | Authorized Distributor |
| Product Origin | Imported |
| Model | EVG Mask Aligner Series |
| Exposure Mode | Proximity Mode |
| Resolution | ≥0.5 µm |
| Light Source | Mercury Arc Lamp |
| Wavelength | UV (i-line, g-line, h-line) |
| Illumination Uniformity | ±0.4% |
| Maximum Wafer/substrate Size | 2–8 inch (standard configuration) |
| Compatible Substrate Types | Si, SiC, GaAs, glass, quartz, flexible polymers |
| Alignment Accuracy | Sub-micron top-side and backside alignment |
| Vacuum Chuck Type | Pneumatic or electrostatic (model-dependent) |
| Brand | Bruker |
|---|---|
| Origin | Malaysia |
| Manufacturer Type | Authorized Distributor |
| Origin Category | Imported Instrument |
| Model | Hysitron TS 77 Select Nanoindenter |
| Instrument Type | Nanoindenter |
| Maximum Indentation Depth | µm |
| Effective Load Range | 100 nN – 10 mN |
| Load Resolution | <1 nN |
| Displacement Range | 1 nm – 10 µm |
| Displacement Resolution | <0.05 nm |
| Maximum Friction Force | 10 mN |
| Indenter Tip Geometry | Berkovich (triangular pyramid), Cube-corner, Flat-punch, and Custom trapezoidal tips |
| Thermal Drift | <0.05 nm/s |
| Origin | Imported |
|---|---|
| Manufacturer Type | Authorized Distributor |
| Model | EagleT-i |
| Price Range | USD 650,000 – 1,050,000 |
| Inspection Speed | Up to 50 million bump measurement points per wafer |
| 2D Detection Accuracy | 0.2 µm |
| 3D Height Measurement Accuracy | 0.05 µm (Measurement Range: 2–100 µm) |
| Minimum Detectable Line Width/Spacing | 2 µm (post-RDL) |
| Defect Detection Limit | 0.2 µm surface anomalies |
| Compatible Substrates | Flat and warped wafers, square dies, compound semiconductor substrates |
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