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| Brand | EVG (EV Group) |
|---|---|
| Origin | Austria |
| Equipment Type | Single-Wafer Wet Cleaning System |
| Wafer Diameter Support | 4–12 inch |
| Cleaning Method | Wet Chemical + DI Water Rinse + Optional Megasonics (1 MHz) / Brush / Diluted Chemistry |
| Throughput | 150 wafers/hour |
| Footprint | 2400 × 4720 × 2555 mm (W × L × H) |
| Process Compatibility | Co-D2W (Compound Die-to-Wafer) Bonding, Hybrid & Fusion Bonding Integration |
| Automation Interface | FOUP-to-FOUP and Cassette-to-Cassette |
| Edge & Backside Treatment | Optional |
| Cross-Contamination Control | Front-to-Back Isolation Architecture |
| Remote Diagnostics | Integrated Ethernet-based Service Protocol |
| Software Control | Fully Programmable Recipe Management with Audit Trail Logging |
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