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| Origin | Imported |
|---|---|
| Manufacturer Type | Authorized Distributor |
| Model | CAMTEK Eagle-I / Eagle-AP / EagleT-i |
| Price Range | USD 650,000 – 1,050,000 |
| Inspection Throughput | Up to 50 million bump measurement points per wafer |
| 2D Detection Resolution | 0.2 µm |
| 3D Height Measurement Accuracy | ±0.05 µm (Measurement Range: 2–100 µm) |
| Minimum Detectable Feature Size | 2 µm bump / 2 µm line width |
| Defect Sensitivity | Down to 0.2 µm surface anomalies |
| Key | Origin: Imported |
|---|---|
| Manufacturer Type | Authorized Distributor |
| Model | Eagle-I |
| Inspection Speed | 50 million bump measurement points per wafer |
| 2D Detection Accuracy | 0.2 µm |
| 3D Height Measurement Accuracy | 0.05 µm (Measurement Range: 2–100 µm) |
| Brand | Camtek / FRT |
|---|---|
| Origin | Germany |
| Manufacturer Type | Authorized Distributor |
| Import Status | Imported |
| Model | MicroProf®100 |
| Detection Speed | Up to 50 million measurement points per wafer |
| 2D Lateral Resolution | 0.2 µm |
| 3D Vertical Height Accuracy | ±0.05 µm (measuring range: 2–100 µm) |
| Dual-Sided Measurement Capability | Yes (TTV/Bow/Warp/TIR/LTV) |
| Optical Principle | White-light Interferometry & Chromatic Confocal Sensing |
| Optional IR Sensor | Integrated for backside thickness monitoring of Si, GaAs, InP, SiC, GaN wafers |
| Compliance | SEMI Standard-compliant dual-probe architecture |
| Form Factor | Compact benchtop metrology platform |
| Origin | Imported |
|---|---|
| Manufacturer Type | Authorized Distributor |
| Model | EagleT-i |
| Price Range | USD 650,000 – 1,050,000 |
| Inspection Speed | Up to 50 million bump measurement points per wafer |
| 2D Detection Accuracy | 0.2 µm |
| 3D Height Measurement Accuracy | 0.05 µm (Measurement Range: 2–100 µm) |
| Minimum Detectable Line Width/Spacing | 2 µm (post-RDL) |
| Defect Detection Limit | 0.2 µm surface anomalies |
| Compatible Substrates | Flat and warped wafers, square dies, compound semiconductor substrates |
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