MVSystems
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| Brand | MVSystems |
|---|---|
| Origin | USA |
| Model | Cluster |
| Substrate Size | 30 × 40 cm |
| Chamber Configuration | 8-port cluster architecture |
| Deposition Methods | Plasma-Enhanced CVD (PECVD), Hot-Wire CVD (HWCVD), DC/RF Sputtering |
| Control System | Fully computer-integrated with programmable process sequencing |
| Category | Cluster-Type Thin-Film Deposition System |
| Import Status | Imported Equipment |
| Brand | MVSystems |
|---|---|
| Origin | USA |
| Manufacturer Type | Authorized Distributor |
| Origin Category | Imported |
| Model | MVS |
| Pricing | Available Upon Request |
| Brand | MVSystems |
|---|---|
| Origin | USA |
| Manufacturer Type | Authorized Distributor |
| Import Status | Imported |
| Model | MVS-Sputter |
| Target Material Options | Single or Multi-Target Configuration |
| Target Diameter | Standard 2-inch (50.8 mm) or Custom (e.g., 3-inch, 4-inch) |
| Control Interface | Manual Knob + Analog Metering or Optional Digital PID Controller with RS-232/USB Output |
| Chamber Dimensions (W×D×H) | 180 × 180 × 220 mm (7.1 × 7.1 × 8.7 in) |
| Sample Stage Diameter | 100 mm (3.9 in), Adjustable Height & Tilt |
| Sputtering Gas Compatibility | Argon (Ar), Gold (Au), Platinum (Pt), Palladium (Pd), Chromium (Cr), Iridium (Ir), and Reactive Gases (e.g., O₂, N₂) for Oxide/Nitride Coating |
| Base Pressure | ≤5 × 10⁻⁶ Torr (achieved via dual-stage vacuum system: rotary vane pump + turbomolecular pump) |
| Deposition Uniformity | ±5% across 100 mm substrate (measured by quartz crystal microbalance and profilometry) |
| Film Thickness Control | Real-time monitoring via integrated quartz crystal thickness monitor (QCM), resolution: 0.1 Å |
| Brand | MVSystems |
|---|---|
| Origin | USA |
| Model | MVS-PECVD |
| Price | USD $1,000,000 |
| Chamber Configuration | Modular Cluster Tool (8–10 port), In-Line, or Single-Chamber Options |
| Substrate Compatibility | Rigid (15.6×15.6 cm, 30×40 cm) and Flexible Web (15–30 cm width) |
| Deposition Technologies | PECVD, HWCVD, Sputtering, Annealing |
| Vacuum Architecture | High-Vacuum (≤1×10⁻⁷ Torr base pressure) |
| Process Control | Fully Computer-Controlled with Real-Time Parameter Logging |
| In-Situ Characterization Option | Integrated UHV-compatible optical/electrical test module |
| Brand | MVSystems |
|---|---|
| Origin | USA |
| Model | Reel-to-Reel Cassette System |
| Web Width | 15 cm – 30 cm |
| Process Capabilities | PECVD, HWCVD, Sputtering |
| Patent | US Patent No. 6,258,408B1 |
| Architecture | 8-Port Cluster Tool with Robotic Cassette Transport |
| Control | Fully Computer-Controlled |
| Chamber Independence | Individual Chamber Servicing Enabled |
| Cross-Contamination Mitigation | Cassette-Based Isolation Between Process Steps |
| Compliance | Designed for GLP/GMP-aligned thin-film R&D environments |
| Brand | MVSystems |
|---|---|
| Origin | USA |
| Model | SiNx-PECVD |
| Throughput | >475 wafers/hr |
| SiNx Film Uniformity | <5% (1σ, across 156 mm × 156 mm wafer) |
| Deposition Technology | RF (13.56 MHz) Plasma-Enhanced CVD |
| Precursor Gases | Silane (SiH₄) and Ammonia (NH₃) |
| Substrate Temperature | 200–400 °C |
| Chamber Configuration | Single-wafer, Load-lock compatible |
| Process Control | Fully automated recipe-based operation with real-time RF power, pressure, and gas flow monitoring |