YXLON Cheetah Industrial Micro-CT System

Overview

The YXLON Cheetah Industrial Micro-CT System is a high-resolution, benchtop-capable X-ray inspection platform engineered for non-destructive evaluation (NDE) and laboratory-scale computed tomography (CT) in electronics, advanced packaging, aerospace components, and precision manufacturing. Built upon YXLON International GmbH’s legacy—originating from the merger of Feinfocus and YXLON under the COMET Group—the Cheetah integrates open-tube microfocus and nanofocus X-ray source technology with high-dynamic-range flat-panel detection to deliver sub-micron spatial resolution and exceptional image stability. Its core measurement principle relies on geometric magnification radiography and cone-beam micro-CT reconstruction, enabling both 2D real-time inspection and quantitative 3D volumetric analysis. The system is fully manufactured in Germany and conforms to stringent industrial design standards for thermal stability, mechanical repeatability, and long-term operational reliability.

Key Features

• Modular open-tube X-ray source with three selectable focal spot modes: microfocus (<1.0 µm), nanofocus (<0.3 µm), and high-power mode (<3.0 µm), each optimized for contrast-to-noise ratio and throughput trade-offs.
• Patented TXI (True X-ray Image) technology ensures consistent detector response and beam hardening compensation across varying kV/mA settings and exposure durations.
• AIM (Automatic Image Centering) algorithm dynamically adjusts source–detector alignment during multi-angle acquisition, maintaining region-of-interest centrality without manual recalibration.
• Motorized 5-axis motion system: X/Y translation stage (460 × 410 mm max scan area), Z-axis source/detector positioning, ±72.5° detector tilt, plus optional 360° rotary stage and manual ±30° sample tilt—enabling oblique-angle imaging and full 360° CT data acquisition.
• Y.μHD functional module (optional): Enhances edge sharpness and signal fidelity for high-aspect-ratio structures such as TSVs, copper pillars, and flip-chip interconnects; supports automated feature extraction and metrology-grade void quantification.
• FGUI software suite with integrated CNC programming, batch-mode BGA void analysis, wire bond curvature assessment, and time-stamped audit trails compliant with FDA 21 CFR Part 11 requirements.

Sample Compatibility & Compliance

The Cheetah accommodates samples up to 800 × 500 mm footprint and 300 mm height (with extended gantry options), supporting heterogeneous materials—from low-Z polymers and ceramics to high-density alloys and soldered PCBAs. Its dual-energy capability (adjustable kV range: 20–225 kV) allows material discrimination in layered assemblies. All hardware and firmware are developed in accordance with IEC 61000-6-2 (EMC immunity) and IEC 61000-6-4 (EMC emission) standards. System validation protocols support IQ/OQ/PQ documentation aligned with ISO/IEC 17025-accredited laboratories. CT reconstruction algorithms comply with ASTM E1441-22 for computed tomography in industrial applications, and raw projection data export enables third-party reconstruction using commercial or open-source tools (e.g., ASTRA Toolbox, TomoPy).

Software & Data Management

FGUI (Feinfocus Graphical User Interface) serves as the unified control and analysis environment. It provides real-time live imaging, programmable scan sequences, and post-processing modules for dimensional metrology, porosity mapping, and defect classification. All acquisitions include embedded metadata (source parameters, geometry, timestamp, operator ID), enabling traceable data lineage. Reports are exportable in PDF, CSV, and DICOM-CT formats. Optional Y.QuickScan™ module reduces full-volume CT acquisition time to under 60 seconds while preserving isotropic voxel resolution down to 1.5 µm. For regulated environments, FGUI supports electronic signatures, role-based access control, and immutable audit logs meeting GLP and GMP documentation requirements.

Applications

• Electronics failure analysis: BGA solder void quantification, wire bond deformation/breakage, silver paste delamination, TSV fill integrity, and flip-chip misalignment.
• Advanced packaging: Cu pillar height uniformity, underfill coverage, mold compound cracking, and interposer via inspection.
• Aerospace & automotive: Turbine blade cooling channel integrity, composite laminate fiber orientation, and weld seam porosity mapping.
• Research & development: In situ mechanical testing with synchronized X-ray imaging, battery electrode degradation tracking, and additive manufacturing defect correlation with process parameters.
• Quality assurance: Automated pass/fail decision logic based on user-defined thresholds for void volume %, crack length, or feature dimension deviation.

FAQ

Is the Cheetah system capable of true 3D micro-CT reconstruction?
Yes—the system includes a motorized rotary stage option and supports full 360° projection acquisition. With Y.QuickScan™ and standard reconstruction pipelines, it delivers isotropic voxel datasets suitable for quantitative volumetric analysis.
What regulatory standards does the FGUI software support for audit compliance?
FGUI supports 21 CFR Part 11-compliant electronic records and signatures when deployed with appropriate IT infrastructure controls, including secure login, change history logging, and report immutability.
Can the Cheetah be upgraded from 2D radiography to full micro-CT capability post-purchase?
Yes—CT functionality is enabled via optional hardware (rotary stage, enhanced cooling) and software license activation. No mechanical retrofitting is required beyond mounting accessories.
Does the system support automated reporting for production line integration?
Yes—FGUI includes customizable report templates with embedded pass/fail logic, statistical process control (SPC) charting, and direct database export (ODBC) for MES/ERP integration.
What is the minimum detectable feature size under optimal conditions?
Using nanofocus mode and high-contrast phantoms, the system achieves effective spatial resolution below 0.3 µm; practical resolution in real-world samples depends on material density, thickness, and contrast mechanisms.