Zhengye XK32A Automated PCB Line Width Measurement System
| Brand | Zhengye |
|---|---|
| Origin | Guangdong, China |
| Manufacturer Type | OEM/ODM Manufacturer |
| Country of Origin | China |
| Model | XK32A |
| Pricing | Available Upon Request |
Overview
The Zhengye XK32A Automated PCB Line Width Measurement System is a fourth-generation optical metrology platform engineered for high-precision, non-contact dimensional inspection of printed circuit board (PCB) features during mid-process fabrication. It operates on the principle of high-resolution digital image acquisition combined with sub-pixel edge detection algorithms, enabling quantitative analysis of critical geometric parameters—including line width (upper and lower profiles), line spacing (pitch), circular via diameters, and gold finger trace dimensions—on both inner and outer layer panels prior to solder mask application. Designed specifically to meet the stringent tolerances demanded by 5G RF substrates, HDI, and advanced packaging boards, the XK32A delivers repeatable measurements at micron-level resolution under controlled illumination and mechanical stability, supporting process validation and statistical process control (SPC) in ISO 9001- and IPC-A-600-compliant manufacturing environments.
Key Features
- Fourth-generation optical architecture featuring industrial-grade CMOS sensor with adjustable magnification optics and coaxial LED illumination for consistent contrast across copper, etched resist, and bare substrate surfaces
- Real-time image capture and automated measurement workflow—no manual threshold tuning required for standard FR-4, polyimide, or ceramic-based PCBs
- Dual-profile line width analysis: simultaneous quantification of top-edge (upper幅) and bottom-edge (lower幅) widths to assess sidewall taper and etch uniformity
- Integrated calibration verification using NIST-traceable reticle standards; supports daily system performance qualification per IPC-TM-650 2.2.15
- Ruggedized gantry design with precision linear stages and vibration-dampened base, ensuring positional repeatability better than ±1.5 µm over full field-of-view (FOV)
- Modular software interface compatible with factory MES integration via OPC UA or CSV export, supporting audit-ready data logging
Sample Compatibility & Compliance
The XK32A accommodates rigid, flex, and rigid-flex PCB panels up to 610 mm × 610 mm (24″ × 24″) and thicknesses ranging from 0.05 mm to 6.0 mm. It supports inspection of fine-pitch features down to 25 µm line/space, including microvias (≥80 µm diameter), buried vias, and impedance-controlled trace geometries. All measurement protocols align with IPC-6012, IPC-6013, and IPC-A-600 Section 2.7 (Dimensional Requirements). The system’s measurement uncertainty budget has been validated per ISO/IEC 17025 guidelines and includes documented Gage R&R studies demonstrating <10% P/T ratio for critical dimensions at 95% confidence.
Software & Data Management
The proprietary Zhengye Vision Metrology Suite (v4.2+) provides intuitive GUI-driven measurement setup, multi-point auto-focus, batch report generation (PDF/Excel), and SPC charting (X-bar/R, Cp/Cpk). Raw images and coordinate data are stored with embedded metadata—including operator ID, timestamp, panel ID, and environmental conditions (ambient temperature/humidity logged via optional sensors). Audit trail functionality complies with FDA 21 CFR Part 11 requirements for electronic records and signatures, including user access controls, change history, and immutable log archiving. Data export supports industry-standard formats (Gerber-compatible DXF overlay, CSV coordinate lists) for cross-platform FA and yield analysis.
Applications
- Pre-solder mask inline verification of etch quality on multilayer and HDI PCBs
- Process capability assessment for AOI/AVI correlation studies and DOE validation
- Failure analysis support for open/short root cause identification in high-frequency laminates
- Supplier qualification testing per IPC-6012 Class 2/3 acceptance criteria
- Line width trend monitoring across multiple shifts to detect tool wear or chemistry drift in etching lines
FAQ
What is the minimum measurable line width and spacing supported by the XK32A?
The system achieves reliable detection and measurement of features as narrow as 25 µm under optimal lighting and focus conditions, with typical measurement repeatability of ±0.8 µm (2σ) for copper traces on standard FR-4.
Does the XK32A support automatic defect classification (e.g., bridging, undercut, notching)?
Yes—the software includes configurable pass/fail logic based on user-defined tolerance bands and rule-based pattern recognition for common anomalies such as line narrowing, isolated shorts, and incomplete etch.
Can the system be integrated into an existing factory automation infrastructure?
It supports Ethernet/IP, Modbus TCP, and RESTful API interfaces for bidirectional communication with MES, ERP, and central SPC servers, enabling fully automated job dispatch and result feedback loops.
Is remote support and software update capability available?
All units ship with secure remote desktop access enabled (opt-in), allowing Zhengye Field Application Engineers to perform diagnostics, calibration assistance, and version upgrades without onsite intervention.
What documentation is provided for regulatory compliance and validation?
Each shipment includes IQ/OQ documentation templates, calibration certificate (traceable to CNAS-accredited lab), Gage R&R study report, and SOP drafts aligned with ISO 13485 and IATF 16949 requirements where applicable.
