Semiconductor Instruments
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| Brand | SAMCO |
|---|---|
| Origin | Japan |
| Model | UV-300H |
| Maximum Sample Diameter | Ø800 mm (8-inch) |
| Operating Environment | Ambient Atmospheric Pressure |
| Heating Stage Temperature Range | Room Temperature to 150 °C |
| Safety Features | Interlocked Lid, Ozone Catalyst Scrubber, N₂ Purge Cycle, Thermal Fuse Protection, Emergency Stop |
| Compliance | Designed for ISO Class 5–7 Cleanroom Integration |
| Brand | SciDre |
|---|---|
| Origin | Germany |
| Model | HKZ |
| Maximum Melting Zone Temperature | Up to 3000 °C |
| Melting Zone Pressure Range | 10–300 bar (selectable) |
| Vacuum Level | 1×10⁻⁵ mbar |
| Atmosphere Options | Ar, O₂, N₂, air, or custom gas mixtures |
| Xenon Lamp Power Options | 3 kW, 5 kW, 6.5 kW |
| Sample Rod Diameter | 6.8 mm or 9.8 mm |
| Pulling Rate | 0.1–50 mm/h |
| Rotation Speed | 0–70 rpm |
| Brand | SCIL |
|---|---|
| Origin | Netherlands |
| Model | LabSCIL |
| Wafer Size | Up to 8-inch (200 mm) |
| Alignment Accuracy | < 1 µm |
| Imprint Technology | Low-Force Soft-Mold Substrate-Conformal Nanoimprint |
| Compatible Resists | Thermal Sol-Gel, UV Sol-Gel, UV Organic |
| Wafer Thickness Range | 0.3–2.5 mm |
| Footprint (W×L×H) | 1.8 × 1.4 × 2.2 m |
| Resist Application | External Spin-Coater Required |
| Compliance | Designed for ISO Class 5–7 cleanroom integration |
| Software | SCIL Control Suite with Audit Trail & Parameter Logging |
| Origin | USA |
|---|---|
| Manufacturer Type | Authorized Distributor |
| Import Status | Imported |
| Models | SCS112 / SCSe124 / SCSe126 |
| Cleaning Method | Wet Chemical & DI Water-Based Cleaning |
| Equipment Type | Single-Wafer Manual Processing Station |
| Maximum Substrate Diameter | 8 in (SCS112) or 10 in (SCSe124/SCSe126) |
| System Dimensions (W×D×H) | 26 in × 21 in × 40 in |
| Spindle Speed | Up to 2500 rpm |
| Control Architecture | Microprocessor-Based with Touchscreen GUI (SCSe124/SCSe126) or Keypad Interface (SCS112) |
| Preset Recipes | 3 (SCS112) or 10 (SCSe124/SCSe126) |
| Mechanical Arms | 1 (SCS112), 2 (SCSe124), or 4 (SCSe126) |
| Chamber Material | Chemically Resistant Polypropylene |
| Exhaust Configuration | Radial Laminar Flow Chamber (SCSe124/SCSe126) |
| Drying Options | High-velocity N₂ purge, IR heating lamp, or heated DI water rinse |
| Safety Features | Interlocked lid, positive-pressure chamber cover, emergency stop circuitry |
| Power Supply | 220 VAC, 10 A, 50/60 Hz |
| Brand | Semetrol |
|---|---|
| Origin | USA |
| Model | Semetrol DLTS |
| Temperature Range | 25 K – 700 K |
| Cooling | Closed-Cycle Liquid Helium Refrigerator |
| Capacitance Measurement Frequency | 1 MHz |
| Capacitance Sensitivity | 1 fF |
| Voltage Range | ±100 V (Boonton), ±10 V (DAQ) |
| Voltage Resolution | 0.3 mV (DAQ, <20 V), 1 mV (<20 V), 10 mV (>20 V) |
| Pulse Width Range | 5 μs – >0.1 s (DAQ), 15 ms – >0.1 s (Boonton) |
| Pulse Amplitude | up to 200 V (Boonton), up to 20 V (DAQ) |
| Slew Rate | <20 V/ms (Boonton), 20 V/μs (DAQ) |
| Current Limit | 5 mA |
| Sampling Rate | down to 1 μs |
| Record Length | >10,000 points |
| Time Resolution | 50 ns |
| Capacitance Resolution | <50 aF |
| Automatic Zeroing | Yes |
| Auto-Ranging | Yes |
| Response Time | ~25 μs |
| Compensation Range | 256 pF |
| Test Signal Levels | 15, 30, 50, 100 mV |
| Filtering | Auto-detection and sinusoidal noise suppression |
| Brand | SENTECH (Germany) |
|---|---|
| Origin | Germany |
| Model | Etchlab 200 |
| RF Power | 600 W @ 13.56 MHz |
| Vacuum System | 360 L/s Turbo-Molecular Pump + Rotary Vane Backing Pump |
| Wafer Capacity | Up to 200 mm (8-inch) |
| Gas Inlets | 2–12 Configurable Lines |
| Chamber Access | Top-Opening Lid Design |
| Footprint | Compact Benchtop Layout |
| Optional Add-ons | Residual Gas Analyzer (RGA), Optical Emission Spectroscopy (OES), Sample Temperature Control (SLI), High-Vacuum Pressure Monitoring (TP) |
| Origin | Germany |
|---|---|
| Manufacturer Type | Authorized Distributor |
| Origin Category | Imported |
| Model | Etchlab 200 |
| Etching Principle | Equipped with magnetic-field-enhanced Inductively Coupled Plasma (ICP/ISM) or Non-Linear Discharge (NLD) plasma source |
| Etch Rate | Up to 1 µm/min (material and process dependent) |
| Wafer Size Compatibility | 100–200 mm (standard), upgradable to 300 mm |
| Selectivity | Up to 1:20 (e.g., SiO₂:Si) |
| Uniformity | ±5% across wafer |
| Residue Level | <1% (post-etch residue coverage) |
| Aspect Ratio Capability | Up to 1:20 (depth:width) |
| Brand | SENTECH |
|---|---|
| Origin | Germany |
| Model | MDPinline |
| Application | In-line quantitative minority carrier lifetime mapping of silicon wafers |
| Measurement Principle | Microwave-detected photoconductance decay (µ-PCD) |
| Scan Speed | <1 second per wafer |
| Integration | Conveyor-compatible, no moving mechanical parts |
| Compliance | Designed for semiconductor manufacturing environments compliant with ISO 9001 and SEMI S2/S8 safety standards |
| Software Interface | Ethernet-enabled, supports SECS/GEM protocol for factory automation integration |
| Data Output | Full-wafer lifetime map (pixel-resolved), dual-line resistivity profile, CSV/HDF5 export |
| Calibration | Traceable to NIST-traceable reference wafers |
| Operating Environment | Class 1000 cleanroom compatible (ISO 4), 18–28 °C, <60% RH non-condensing |
| Power Supply | 100–240 V AC, 50/60 Hz, <500 W |
| Brand | SENTECH |
|---|---|
| Origin | Germany |
| Model | MDPspot |
| Type | Contactless, Microwave Photoconductance Decay (μ-PCD) Based Lifetime Tester |
| Sample Handling | Manual Z-axis adjustment (up to 156 mm height) |
| Measurement Mode | Single-point, non-contact, room-temperature operation |
| Material Compatibility | Crystalline and multicrystalline silicon wafers & bricks |
| Compliance | Designed for R&D and process monitoring in PV and semiconductor fabrication environments |
| Software | MDP Control Suite (Windows-based, real-time visualization, CSV export, GLP-compliant data logging) |
| Brand | SENTECH |
|---|---|
| Origin | Germany |
| Model | SENTECH Multi-Chamber Platform |
| Etching Principle | Capacitively Coupled Plasma (CCP) and/or Inductively Coupled Plasma (ICP) |
| Chamber Configuration | Modular multi-port transfer chamber (3–6 ports) |
| Wafer Handling | Load-lock pre-vacuum chamber and/or vacuum cassette station |
| Maximum Wafer Size | 200 mm |
| Integration Capabilities | ICP etcher, RIE etcher, ALD, PECVD, ICPECVD modules |
| Control Interface | GUI-based process control software compliant with industrial automation standards |
| Brand | SENTECH |
|---|---|
| Origin | Germany |
| Manufacturer Type | Authorized Distributor |
| Origin Category | Imported |
| Model | SENTTECH Cluster System |
| Price | Upon Request |
| Brand | SENTECH |
|---|---|
| Origin | Germany |
| Model | SENDIRA |
| Spectral Range | 400–6,000 cm⁻¹ (1.7–25 µm) |
| Detector Options | DTGS or MCT |
| Integrated FTIR Platform | Compatible with Thermo Fisher iS50 |
| Software | SpectraRay/4 + Dedicated FTIR Control Suite |
| Optical Configuration | Purged ellipsometer optics, motorized goniometer, horizontal sample stage, auto-collimating telescope |
| Application Domain | Vibrational spectroscopic ellipsometry for thin-film metrology |
| Brand | SENTECH |
|---|---|
| Origin | Germany |
| Model | SI 500 D |
| Plasma Source | Planar Triple-Spiral Antenna (PTSA) |
| Substrate Temperature Range | RT to +350 °C |
| Vacuum System | Fully Integrated, High-Stability |
| Process Compatibility | SiO₂, SiNₓ, SiONₓ, a-Si, SiC, TEOS-derived films |
| Substrate Size | Up to 200 mm wafers or carrier-mounted substrates |
| Optional Features | Load-lock integration, Laser Endpoint Detection, Substrate Biasing, He-backside Cooling with Real-Time Backside Temperature Sensing |
| Control Architecture | SENTECH Fieldbus-Based SCADA Software with Audit-Trail-Capable UI |
| Compliance Context | Designed for GLP/GMP-aligned R&D and pilot-line fabrication |
| Origin | Germany |
|---|---|
| Manufacturer Type | Authorized Distributor |
| Origin Category | Imported |
| Model | SI 500 |
| Price | USD 295,000 (FOB Hamburg) |
| RF Source Frequency | 13.56 MHz |
| ICP Power | 1200 W |
| Bias RF Power | 600 W |
| Plasma Source | Planar Triple Spiral Antenna (PTSA) |
| Endpoint Detection | Interferometric In-situ Monitoring |
| Vacuum System | High-throughput Dry Pumping with Independent Gas Flow & Pressure Control |
| Software | SENTECH Advanced Plasma Process Control (APPC) v5.x |
| Brand | Shenyang K.Y. |
|---|---|
| Origin | Liaoning, China |
| Manufacturer Type | Authorized Distributor |
| Country of Origin | China |
| Model | PVD400 |
| Instrument Type | Magnetron Sputtering Coater |
| Application Field | Microelectronics |
| Substrate Size | Ø100 mm (1 × 4-inch wafer) |
| Targets | Three Ø50.8 mm (2-inch) Permanent-Magnet DC/RF Sputtering Targets |
| Maximum Substrate Temperature | 800 °C |
| Thickness Uniformity (within wafer) | ≤ ±3% |
| Base Vacuum | ≤ 6.6 × 10⁻⁵ Pa |
| Brand | SHNTI |
|---|---|
| Origin | Shanghai, China |
| Manufacturer Type | Authorized Distributor |
| Country of Origin | China |
| Model | IMD MPCVD Diamond Growth System |
| Crystal Material | Synthetic Diamond |
| Maximum Crystal Diameter | 2.2 inches (55.9 mm) |
| Typical Crystal Length (Constant-Diameter Zone) | 2–3 cm |
| Process Capability | High-Purity Diamond CVD Deposition, In-situ Thermal Annealing, Homoepitaxial & Heteroepitaxial Growth |
| Brand | Siegert Wafer |
|---|---|
| Origin | Germany |
| Model | Siegert Wafer Series |
| Material Options | Borofloat® 33, Fused Silica |
| Diameter | Up to 200 mm |
| Thickness | 0.5–2.0 mm |
| Shape | Round or Rectangular |
| Surface Coatings | ITO, Photoresist, Custom Thin-Film Layers |
| Compliance | ISO 14644-1 Class 5 Cleanroom Processing |
| Packaging | Vacuum-Sealed, Particle-Free Cassette |
| Brand | Sinton Instruments |
|---|---|
| Origin | USA |
| Model | WCT-120MX + Suns-VocMX |
| Minority Carrier Lifetime Range | 0.1 µs – 15 ms |
| Penetration Depth | 3 mm |
| Maximum Sample Diameter | 230 mm |
| Resistivity Range | 0.15 – 300 Ω·cm |
| Compatible Material | Silicon wafers |
| Brand | SOPTOP |
|---|---|
| Origin | Zhejiang, China |
| Manufacturer Type | Original Equipment Manufacturer (OEM) |
| Regional Classification | Domestic (China) |
| Model | AWL Series |
| Pricing | Upon Request |
| Primary Applications | Front-end & back-end wafer process monitoring, outgoing wafer quality control |
| Supported Wafer Diameters | 100 mm, 150 mm, 200 mm, 300 mm |
| Configurations | AWL046 (4″/6″), AWL068 (6″/8″), AWL812 (8″/12″) |
| Macro Inspection | 360° full-rotation stage with dual-side tilt (front-side max 70°, back-side 1 max 90°, back-side 2 max 160°) |
| Micro Inspection | Semi-apochromatic metallurgical objectives supporting brightfield, darkfield, DIC, and polarized light modes |
| Vacuum Chuck | Manual quick-release mechanism |
| Control System | Motorized precision stage with μm-level defect resolution |
| Brand | SENTECH |
|---|---|
| Origin | Germany |
| Model | SpectraRay/4 |
| Software Type | Spectroscopic Ellipsometry Data Acquisition, Modeling & Analysis Platform |
| Material Database | Integrated Comprehensive Library (Oxides, Nitrides, Metals, Polymers, Amorphous Si, Organic Layers, etc.) |
| Dispersion Models | Cauchy, Tauc-Lorentz, Cody-Lorentz, Drude, Sellmeier, B-Spline, User-Defined Custom Models |
| Mapping Capabilities | 2D Color/Contour/Deviation/3D Surface Plots, Statistical Summary (Mean, Std Dev, Min/Max, Histograms) |
| Simulation Engine | Wavelength-, Angle-, Energy-, Temperature-, Time-Dependent Optical Response Modeling |
| Reporting | Export to Microsoft Word (*.doc), Full Experiment Archiving (Raw Data, Model Definitions, Fitting Logs, Annotations) |
| Scripting | Python-based Automation Interface for Hardware Control (Stages, Heaters, Cryostats, Environmental Chambers) |
| Compliance Support | Audit Trail Logging, User Access Levels, Electronic Signature Ready (FDA 21 CFR Part 11–ready architecture) |
| Brand | Truth Instruments Company Limited |
|---|---|
| Origin | Shandong, China |
| Manufacturer Type | Authorized Distributor |
| Country of Origin | China |
| Model | MCT 500 |
| Pricing | Available Upon Request |
| Brand | Spin-ION |
|---|---|
| Origin | France |
| Model | Helium-S® |
| Ion Species | He⁺ (also capable of H⁺ generation) |
| Implantation Energy Range | 1–30 keV |
| Energy Resolution | <50 eV |
| Beam Current Range | 1–50 μA (energy-dependent) |
| Typical Ion Flux | 1×10¹⁵ ions/cm²/min at 10 μA |
| Uniform Irradiation Area | 25 mm × 25 mm |
| Beam Uniformity | Intensity ±1%, Angular ±3° |
| Beam Purity | ≥99.99% (1:10⁴ contaminant ratio) |
| Vacuum Base Pressure | ≤1×10⁻⁷ mbar |
| Ion Source | Electron Cyclotron Resonance (ECR) |
| Beam Filtering | Wien Filter |
| Scanning | X-Y electrostatic deflection |
| Sample Holder | 25 mm diameter wafers/disks |
| Optional Accessories | In-situ heating stage (up to 500 °C), angular tilt module, load-lock rapid transfer chamber |
| Compliance | Designed for integration into UHV systems |
| Brand | Sindin |
|---|---|
| Model | ST-2100MW |
| Origin | Guangdong, China |
| Manufacturer Type | Original Equipment Manufacturer (OEM) |
| Regional Classification | Domestic (PRC) |
| Pricing | Available Upon Request |
| Brand | SUHWOO |
|---|---|
| Origin | South Korea |
| Model | Suhwoo STRIP GRINDER SG-2000X |
| Strip Width Range | 62–95 mm |
| Strip Length Capacity | up to 259 mm |
| Height Detection Repeatability | ±3 µm |
| Tool Change Time | <30 minutes |
| Spindle Type | Custom High-Precision Air-Bearing Spindle |
| Cleaning & Drying | Integrated Automated Rinse and Spin-Dry Module |
| Compliance | Designed for ISO 14644-1 Class 5 Cleanroom Integration |
| Control Interface | Touchscreen HMI with Recipe Management and Audit Trail Logging |
| Brand | Sumitomo |
|---|---|
| Origin | Japan |
| Manufacturer Type | Authorized Distributor |
| Origin Category | Imported |
| Model | SAW-20US |
| Price Range | USD 1,050,000 – 1,210,000 |
| Brand | SUNJUNE |
|---|---|
| Origin | Guangdong, China |
| Manufacturer | SUNJUNE Technology Co., Ltd. |
| Model | VP-RS15 |
| Etching Principle | Capacitively Coupled Plasma (CCP) |
| RF Power | 500 W |
| RF Frequency | 13.56 MHz |
| Etch Rate | High |
| Selectivity | PR/GaAs ≥ 4:1 |
| SiO₂/InP > 10 | 1 |
| Etch Profile | Isotropic |
| Residue Byproduct | CO₂ |
| Uniformity | <5% (across 4-inch wafer) |
| Aspect Ratio | ≥5:1 |
| Chamber Material | 304 Stainless Steel |
| Max. Operating Temperature | ≤45°C after 3 min full-power operation |
| Gas Inlets | 2 independent mass-flow-controlled ports |
| Vacuum Display | Digital real-time readout |
| Control Interface | 7-inch capacitive touchscreen with embedded control software (Software Copyright No.: 2021SR1026389) |
| Safety Features | Automatic door interlock, pressure-sensing lid detection, post-process venting sequence |
| Warranty | 24 months parts and labor |
| Brand | SUNJUNE |
|---|---|
| Origin | Guangdong, China |
| Manufacturer Type | Original Equipment Manufacturer (OEM) |
| Product Category | Domestic |
| Model | VP-RS6 |
| Price Range | USD 7,000 – 14,000 |
| RF Power | 500 W |
| RF Frequency | 13.56 MHz |
| Chamber Material | 304 Stainless Steel |
| Max Operating Temperature (Chamber Wall) | ≤45 °C at Full Power (3 min) |
| Vacuum Display | Digital Pressure Readout |
| Gas Inlets | Dual Mass-Flow Controlled Ports |
| Control Interface | 7-inch Capacitive Touchscreen |
| Software Certification | China Copyright Registration No. 2021SR1026389 |
| Warranty | 24 Months Limited Hardware Warranty |
| Brand | SUNJUNE |
|---|---|
| Model | VS-Q Series |
| Origin | Guangdong, China |
| Manufacturer | SUNJUNE Technology Co., Ltd. |
| Construction | Stainless Steel Monolithic Enclosure |
| Vacuum Performance | ≤5 Pa (Mechanical Pump Only) / ≤1×10⁻⁵ Pa (MPU-90i Molecular Pump Unit) |
| Ultimate Vacuum (MPU-90i) | ≤1×10⁻⁶ Pa |
| Quartz Tube Dimensions Supported | OD 5–50 mm, Length 80–1500 mm |
| Rotation Speed | Adjustable |
| Vacuum Pumping Rate | Adjustable |
| Protective Gas Inlet Flow | Adjustable |
| Crystal Growth Capability | Black Phosphorus Crystals |
| Single-Crystal Growth Duration per Cycle | 12 h |
| Silicon Single-Crystal Constant-Diameter Length | 6 mm |
| Grown Crystal Diameter Range | 2–5 mm |
| Compliance | ASTM E29, ISO/IEC 17025 (for lab process validation), GLP-compliant operation mode supported |
| Control Interface | Touchscreen with IL Intelligent Logic Control Software |
| Operating Modes | Manual (independent mechanical pump control) & Automatic (interlocked mechanical + molecular pump sequencing) |
| Brand | SUNJUNE |
|---|---|
| Origin | Guangdong, China |
| Manufacturer | SUNJUNE Technology Co., Ltd. |
| Model | VS-Q1 |
| Crystal Type | Single Crystal |
| Max. Crystal Diameter | 2–5 mm |
| Isometric Growth Length (Si) | 6 mm |
| Typical Growth Cycle per Run | 10 h |
| Quartz Tube OD Range | 5–50 mm |
| Quartz Tube Length Range | 80–1500 mm |
| Base Pressure (Mechanical Pump) | < 5 Pa |
| Base Pressure (MPU-90i Molecular Pump Unit) | < 1×10⁻⁵ Pa |
| Ultimate Vacuum (MPU-90i w/ Full-Range Gauge) | ≤ 1×10⁻⁶ Pa |
| Rotational Speed | Adjustable |
| Vacuum Pumping Rate | Adjustable |
| Backfill Gas Flow | Adjustable |
| Compliance | CE-marked components, GLP-aligned operational logging capability |
| Brand | SUNJUNE |
|---|---|
| Origin | Guangdong, China |
| Manufacturer Type | Direct Manufacturer |
| Country of Origin | China |
| Model | VS-Q2 |
| Crystal Growth Capability | Single Crystal |
| Typical Growth Cycle per Run | 12 h |
| Diameter Control Precision (for Si single crystal) | ±0.05 mm over 6 mm isometric section |
| Usable Crystal Diameter Range | 2–5 mm |
| Quartz Tube Compatibility | OD 5–50 mm, Length 80–1500 mm |
| Base Vacuum (Mechanical Pump Only) | <5 Pa |
| Ultimate Vacuum (MPU-90i Molecular Pump Unit) | ≤1×10⁻⁶ Pa |
| Rotational Speed Control | Adjustable (0–30 rpm) |
| Vacuum Pumping Rate | Adjustable |
| Backfill Gas Flow Control | Programmable |
| Control Interface | Touchscreen with IL Intelligent Logic (IL) software |
| Operating Modes | Manual (independent pump control) & Auto (interlocked mechanical + molecular pump sequencing) |
| Compliance | Designed for GLP-compliant lab environments |