Semiconductor Instruments
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| Brand | JFP |
|---|---|
| Origin | France |
| Model | MPPS |
| Maximum Wire Saw Speed | 400 mm/s |
| Sample Stage | Vacuum-Chuck with Rotatable Platform (Max Ø200 mm) |
| Angular Adjustment Resolution | 0.006° (Range ±4°) |
| Scribing Stroke Length | 250 mm |
| Scribing Width | 240 mm |
| Positioning Accuracy | 0.01 mm |
| Max Sample Thickness | 10 mm |
| Adjustable Scribing Force | 5–581 g |
| Brand | JFP |
|---|---|
| Origin | France |
| Type | Manual Pull Testing System for Wire Bond Strength Evaluation |
| Measurement Principle | Mechanical Force Transduction via Precision Dial Gauge |
| Test Modes | Destructive and Non-Destructive Pull Testing |
| Vertical Travel Range | 10–150 mm (Coarse) + Micrometer-Driven Fine Adjustment (0.1 mm resolution) |
| Hook Tip Diameter | 15–50 µm |
| Max Test Wire/Die Bond Diameter | 200 µm |
| Z-Axis Control | Manual Handwheel |
| Damping Mechanism | Adjustable Mechanical Damping to Suppress Vibration Artifacts |
| Preset Force Threshold | User-Adjustable for Non-Destructive Mode |
| Compliance | Designed to Support ISO/IEC 17025 Traceability Requirements (Manual Recording Pathway) |
| Optional Accessories | High-Precision XYZ+Theta Stage (25 × 25 mm travel, 1 µm resolution |
| Brand | JFP |
|---|---|
| Origin | France |
| Type | Imported Semiconductor Assembly & Packaging Equipment |
| Model | PP Stacker |
| Application | Precision Pick-and-Place, Stacking & De-stacking of Laser Diode Bars |
| Compliance | Designed for ISO Class 5–7 cleanroom environments |
| Software | JFP StackerControl v3.2 with Audit Trail & Event Logging |
| Power Supply | 100/230 VAC, 1 kW |
| Pneumatic Requirements | Dry air at 5 bar, vacuum ≥90% |
| Dimensions (W×D×H) | 900 × 830 × 1750 mm |
| Throughput | 600 units/hour (single bar + single spacer cycle) |
| Pick-up Force | <5 g (non-damaging micro-handling) |
| XY Stage Resolution | 1 µm (micrometer-adjustable manual stage) |
| Vision System | Triple 5 MP color cameras (vertical orientation), independent digital video control, LED illumination (adjustable intensity), field-of-view up to 20 mm, continuous optical zoom, 11× digital zoom, PIP mode (3 windows), calibrated scale bar (0.6 mm @ 20×) |
| Sample Compatibility | Laser diode bars (max. 18 mm length |
| Tooling Options | Manual blue-tape ejection kit |
| Brand | JFP |
|---|---|
| Country of Origin | France |
| Model | PP6 / PP7 / MPS |
| Type | Manual Semiconductor Die Bonder & Pick-and-Place System |
| Compliance | Designed for ISO Class 5–7 cleanroom environments |
| Control Interface | Ergonomic joystick + 7-inch capacitive touchscreen |
| Optical System | UHD coaxial camera with adjustable magnification (10×–100×) |
| Bonding Capabilities | Epoxy, solder, eutectic, and formic acid-compatible chucks |
| Max Substrate Thickness | 100 mm |
| Min Die Size | 70 µm × 70 µm |
| Placement Accuracy | ±1 µm (repeatability under controlled lab conditions) |
| Optional Modules | Flip-chip alignment stage, dispensing module, ultrasonic bonding head, thermal chuck (60–250 °C) |
| Brand | JFP |
|---|---|
| Origin | France |
| Model | PP7 |
| Type | Semi-Automatic Pick-and-Place Die Bonder for Precision Semiconductor Assembly |
| Compliance | Designed for ISO Class 5–7 cleanroom environments |
| Mechanical Architecture | Vibration-isolated granite base with motorized Z-axis and coaxial optical alignment system |
| Imaging | Dual-axis programmable high-magnification telecentric optics with real-time focus tracking |
| Placement Accuracy | ≤ ±1.5 µm (3σ, under controlled environmental conditions) |
| Bond Height Independence | Achieved via dynamic focus-servo loop synchronized with Z-motion control |
| Substrate Compatibility | Wafers (up to 8″), ceramic packages, leadframes, and custom carriers with curvature compensation |
| Tooling Interface | Standard vacuum nozzle exchange (ISO 9409-1-22-6-40) |
| Software Platform | JFP ControlSuite v4.x with audit trail, user-level permissions, and exportable placement logs (CSV/Excel) |
| Brand | JFP |
|---|---|
| Origin | France |
| Model | S100 Semi-Automatic Scribe & Break System |
| Scribing force range | 10–80 g (constant-weight mechanism, optional auxiliary weights) |
| Diamond scribe tip | adjustable angle and rotational orientation |
| Wafer chuck capacity | up to 4-inch diameter |
| Die size compatibility | 100 µm × 100 µm minimum to 10 mm × 10 mm maximum |
| Wafer thickness tolerance | ≥50 µm |
| XY stage resolution | 0.23 µm |
| Optical imaging system | 22″ TFT display + ultra-HD color camera |
| Digital zoom | ×10 electronic |
| Break mode | manual or programmable auto-actuation |
| Break mechanism | top rubber clamping + bottom linear blade actuation |
| Control interface | 7″ capacitive touchscreen |
| Y-axis scribing speed | 0.1–20 mm/s |
| Power supply | 100/230 VAC, 1 kW |
| Pneumatic supply | 70 psi |
| Vacuum requirement | full vacuum (100%), 15 L/min flow rate |
| Dimensions (W×D×H) | 650 × 820 × 1500 mm (25 × 32 × 60 in) |
| Weight | 70 kg |
| Brand | JFP |
|---|---|
| Origin | France |
| Model | S200 Semi-Automatic Scriber and Breaker |
| Power Supply | 100–230 VAC, 1 kW |
| Air Pressure | 80 psi |
| Vacuum System | 100% vacuum, 15 L/min |
| Dimensions (W×D×H) | 650 × 820 × 1500 mm |
| Weight | 70 kg |
| Wafer Handling | 2″ to 8″ |
| Minimum Die Size | 100 µm × 100 µm |
| Maximum Die Size | 150 mm × 150 mm |
| Z-axis Force Range | 5–80 g (adjustable via calibrated weights) |
| Diamond Scribe Tip | Adjustable angle & rotation |
| XY Stage Resolution | 1 µm (display), ±5 µm (positioning accuracy) |
| Y-axis Scribing Speed | 0.1–100 mm/s |
| Optical System | 22″ TFT monitor, ultra-HD color camera, electronic zoom ×10, LED illumination, JFP crosshair reticle |
| Control Interface | 7″ touchscreen, programmable step indexing & vertical spacing, scribe count & die ID logging |
| Brand | JFP |
|---|---|
| Origin | France |
| Equipment Type | Automatic Wire Bonder |
| Model | WB 200-e |
| Bonding Technology | Thermosonic Ball Bonding with 360° Rotational Capillary Actuation |
| Max. Z-Travel | 40 mm |
| Z-Axis Resolution | 0.23 µm |
| XY-Stage Range | 80 × 80 mm |
| XY/Z Resolution | 0.23 µm |
| Ultrasonic Power Range | 0–5 W |
| Frequency | 62 kHz (standard), optional 40/80 kHz |
| Bond Force Range | 10–150 cN |
| Bond Time Range | 0–2000 ms |
| Wire Diameter Support | Au/Al 17–50 µm, Ribbon 40–250 µm (w) × 12–25 µm (t) |
| Heating Stage Temp. Range | 60–250 °C (±1% accuracy) |
| Vision System | 5 MP industrial camera, 8× optical zoom, programmable coaxial & oblique LED illumination |
| Footprint | 640 × 710 × 550 mm |
| Weight | 60 kg |
| Brand | JFP |
|---|---|
| Origin | France |
| Manufacturer Type | Authorized Distributor |
| Origin Category | Imported |
| Model | WB200e |
| Pricing | Upon Request |
| Brand | Guangzhou Jingying |
|---|---|
| Origin | Guangdong, China |
| Manufacturer Type | Direct Manufacturer |
| Country of Origin | China |
| Model | JY-CM001 |
| Flow Rate Range | 0–39 mL/min (adjustable) |
| Input Voltage | AC 220 V |
| Operating Modes | Etchant Dispense / Deionized Water Rinse / Standby |
| Safety Design | Closed-loop reagent handling with no manual pipetting required |
| Compliance | Designed for ISO/IEC 17025-compliant metallography labs |
| Brand | k-Space Associates |
|---|---|
| Model | kSA ACE |
| Origin | USA |
| Vacuum Compatibility | Ultra-High Vacuum (UHV) / High Vacuum |
| Substrate Compatibility | Standard Semiconductor Wafers (e.g., Si, GaAs, InP, sapphire) |
| Source Flexibility | Unlimited (compatible with effusion cells, e-beam evaporators, magnetron sputter targets, PLD plumes) |
| Base Rotation | Supported |
| Optical Configuration | Triple Hollow Cathode Lamp (HCL) Integration |
| Detection Principle | Atomic Absorption Spectroscopy (AAS) |
| Element Capacity | Up to 3 elements simultaneously |
| Calibration Light Source | Pulsed Xenon Flash Lamp |
| Thermal Stability | Actively Temperature-Stabilized Optical Path |
| Data Interface | TCP/IP + Analog Voltage Output (0–10 V, proportional to absorbance/growth rate) |
| Software | kSA ACE Control & Analysis Suite (Windows-based, GLP-compliant logging) |
| Brand | k-Space Associates |
|---|---|
| Origin | USA |
| Manufacturer Status | Authorized Distributor |
| Origin Category | Imported |
| Model | kSA XRF |
| Price Range | USD $50,000 – $500,000 |
| Brand | k-Space |
|---|---|
| Origin | USA |
| Manufacturer Status | Authorized Distributor |
| Product Origin | Imported |
| Model | kSA 400 |
| Pricing | Upon Request |
| Brand | McScience |
|---|---|
| Origin | South Korea |
| Model | K5000 |
| Category | Imported Semiconductor Inspection Instrument |
| Supplier Type | Authorized Distributor |
| Pricing | Available Upon Request |
| Brand | Kainova |
|---|---|
| Origin | Taiwan |
| Manufacturer Type | Authorized Distributor |
| Product Category | Domestic (Taiwan-made) |
| Model | KAM-201 |
| Pricing | Upon Request |
| Reticle Handling Compatibility | EUV & Optical Reticles |
| Bonding Precision | ±0.1 mm |
| Post-Bonding Optical Distortion | <2 nm |
| Bonding Force Range | 0.035–0.4 kN |
| Cleanroom Particle Control | 0 EA for particles >100 nm |
| AMHS Integration | SEMI E84/E87 compliant |
| Vision-Based Alignment | Real-time image registration with dynamic parallelism compensation |
| AOI Inspection | Dedicated structured-light illumination for pellicle defect detection |
| Automated End-Effector Exchange | Yes |
| KAX-311 Reticle Transfer Module | Integrated rotational, flipping, and cassette exchange functions |
| Brand | Kainova |
|---|---|
| Origin | Taiwan |
| Manufacturer Type | Authorized Distributor |
| Product Category | Domestic (Taiwan-made) |
| Model | KAR-211 |
| Pricing | Upon Request |
| Load Ports | 2–8 configurable |
| Motion Control | 5-axis dual-end-effector robot |
| Wafer Compatibility | 200 mm (8″), 300 mm (12″), and thinned wafers (≤725 µm) |
| Dual-Side Wafer ID Reading | OCR + barcode (SEMI P17 compliant) |
| Interface Standards | SECS/GEM v2.0, SEMI E84 OHT Handshake Protocol |
| Cleanroom Certification | ISO Class 3 (FS-209E Class 1) |
| Throughput | ≥700 WPH |
| Positioning Accuracy | ±0.05 mm |
| Airflow Design | FFU-controlled laminar downflow with CFD-validated uniform velocity profile (0.45 ±0.05 m/s) |
| Safety & Compliance | SEMI S2-0215 Certified |
| Brand | Kainova |
|---|---|
| Origin | Taiwan |
| Manufacturer Type | Authorized Distributor |
| Product Origin | Taiwan |
| Model | Kainova Tech KAS-381 / KAS-382 / KAP-541 |
| Pricing | Upon Request |
| Maximum Cassette Capacity (KAS-381) | 87 FOUPs (2175 wafers) |
| Throughput | ≥180 WPH |
| Cleanroom Classification | ISO Class 4 (FS-209E Class 10) |
| Compatible Wafer Sizes | 200 mm and 300 mm |
| Substrate Compatibility | Standard and thinned wafers |
| Operating Environment | Nitrogen-purged (KAS-381/KAS-382) |
| Cassette Handling | Fully automated lid actuation, dual-lane unpacking/packing, recipe-driven sorting, batch merging/splitting, and Wafer ID–based routing |
| Brand | NIPPON FILCON |
|---|---|
| Origin | Japan |
| Manufacturer Type | Authorized Distributor |
| Origin Category | Imported |
| Model | Kayaku Advanced Materials SU-8 2000 Series Photoresists |
| Pricing | Upon Request |
| Brand | KEJING |
|---|---|
| Model | OTF-1200X-4-C4LVS |
| Max Operating Temperature | 1100 °C (continuous at 1000 °C) |
| Heating Zone Length | 440 mm |
| Uniform Temperature Zone | 120 mm (±1 °C, 400–1100 °C) |
| Quartz Tube Dimensions | Outer Tube Ø100 × ID96 × 1400 mm |
| Gas Channels | 4 independent MFC-controlled lines (0–100 / 0–200 / 0–200 / 0–500 sccm) |
| Vacuum Level | 10⁻² Torr (mechanical pump) |
| Power Supply | 208–240 VAC, 50/60 Hz, single-phase, 2.5 kW |
| Cooling Method | Forced-air + sliding furnace displacement |
| Compliance | ASTM F2623 (CVD process validation), ISO 9001-certified manufacturing |
| Weight | 136 kg (300 lb) |
| Warranty | 12 months (excludes consumables: quartz tubes, O-rings, heating elements) |
| Brand | KEJING |
|---|---|
| Origin | Anhui, China |
| Model | OTF-1200X-4-III-9HV |
| Max. Operating Temperature | 1200 °C (continuous at 1100 °C) |
| Heating Rate | ≤20 °C/min |
| Tube Dimensions | 100 mm OD × 92 mm ID × 1400 mm L (fused quartz) |
| Vacuum Level | 10⁻⁵ Torr (turbo-molecular pump) |
| Mass Flow Controllers | 9-channel digital MFCs (CS200 series |
| ranges | 0–1000, 0–200, and 0–10 sccm |
| Power Supply | 7 kW, AC 208–240 V, single-phase, 50/60 Hz |
| Temperature Uniformity | ±1 °C over 500 mm constant-temperature zone |
| Certification | CE |
| Brand | KEJING |
|---|---|
| Model | OTF-1200X-4-R-II-AF |
| Maximum Operating Temperature | 1200 °C (≤1 h) |
| Continuous Operating Temperature | 1100 °C |
| Heating Zones | 2 × 200 mm (total 400 mm), each independently controlled |
| Uniform Temperature Zone | 200 mm (±1 °C at setpoint) |
| Tube Dimensions | Quartz, 100 mm OD × 1200 mm L (tapered ends: 60 mm OD) |
| Rotation Speed | 0–10 RPM (DC motor-driven) |
| Tilt Angle | Left 0–30°, Right 0–15° |
| Vacuum Level | 4.5×10⁻² Torr (mechanical pump) |
| Gas Flow Limit | ≤200 SCCM |
| Feed Rate | Up to 97 cm³/min (adjustable via potentiometer) |
| Collection Vessel | 1 L stainless steel canister with inert-atmosphere sealing |
| Power | 4 kW (furnace) + 200 W (feeder), AC 208–240 V, single-phase, 30 A circuit breaker required |
| Net Weight | 125 kg |
| Certifications | CE, UL/MET/CSA compliant (>24 V components), optional TÜV or CSA certification available upon customer request |
| Brand | Kingsemi |
|---|---|
| Model | KS-CF300/200-8SR |
| Origin | Liaoning, China |
| Equipment Type | Semiconductor Wet Cleaning System |
| Configuration | Dual-Stage Rotational Scrubbing with Edge & Backside Processing Capability |
| Control Interface | Customizable HMI with Digital Parameter Display & Industrial PC Data Logging |
| Compliance | Designed for ISO Class 1–5 cleanroom integration |
| Automation Interface | SECS/GEM compliant (optional) |
| Brand | KLA |
|---|---|
| Origin | Singapore |
| Manufacturer Type | Authorized Distributor |
| Origin Category | Imported |
| Model | Candela 8420 |
| Pricing | Available Upon Request |
| Instrument Category | Optical Non-Patterned Wafer Defect Inspection System |
| Primary Application | Surface Defect Detection on Unpatterned Wafers |
| Wafer Diameter | 2–8 inches |
| Throughput | 30 WPH |
| Resolution | 83 nm |
| Brand | KLA |
|---|---|
| Origin | Singapore |
| Manufacturer Type | Authorized Distributor |
| Origin Category | Imported |
| Model | CS20 |
| Quotation | Upon Request |
| Instrument Category | Optical Non-Patterned Wafer Defect Inspection System |
| Primary Application | Bare (Non-Patterned) Silicon Wafer Surface Defect Detection |
| Throughput | 30 WPH for 150 mm (6″) wafers, 27 WPH for 200 mm (8″) wafers |
| Resolution | 83 nm |
| Substrate Diameter Range | 50.8 mm – 200 mm (2″ – 8″) |
| Thickness Range | 350 µm – 1,100 µm |
| Minimum Detectable Defect Size | 0.3 µm (PSL sphere equivalent, ≥95% capture rate on bare Si) |
| Defect Types | Particles, scratches (≥100 µm × 0.1 µm × 50 Å), pits (≥20 µm Ø × 50 Å depth), stains (≥20 µm Ø × 10 Å thickness), bumps |
| Detection Threshold | Signal amplitude > 3× peak-to-valley background noise |
| Brand | KLA |
|---|---|
| Origin | USA |
| Manufacturer | KLA Corporation |
| Product Type | Optical Patterned Defect Inspection System |
| Model | Candela® 6300 |
| Detection Sensitivity | Sub-0.1 Å surface roughness change |
| Spatial Bandwidth | 0.22–2000 µm |
| Measurement Modes | Radial & tangential topography profiling, roll-off analysis, texture uniformity, particle/scratch detection |
| Compliance | Designed for semiconductor and data storage manufacturing environments |
| Brand | KLA-Filmetrics |
|---|---|
| Origin | USA |
| Manufacturer Type | Authorized Distributor |
| Product Category | Imported |
| Model | Candela® 8720 |
| Instrument Type | Optical Patterned Wafer Defect Inspection System |
| Primary Application | Automated wafer inspection with Statistical Process Control (SPC) integration |
| Wafer Diameter | 200 mm |
| Detection Principle | Multi-angle elastic and inelastic scattering imaging |
| Key Capabilities | Simultaneous dual-angle scatterometry, surface topography mapping, reflectance profiling, phase contrast imaging, and photoluminescence (PL) detection |
| Compliance | Designed for semiconductor fab environments compliant with SEMI E30 (SECS/GEM), ISO 9001, and industry-aligned GLP/GMP data integrity expectations |
| Brand | KLA |
|---|---|
| Origin | Fujian, China |
| Manufacturer Type | Authorized Distributor |
| Country of Origin | China |
| Model | R50 |
| Price Range | USD $42,000 – $140,000 (FOB) |
| Automation Level | Fully Automated |
| Sheet Resistance Range | 5 mΩ/□ to 5 MΩ/□ |
| Measurement Accuracy | ±1% |
| Repeatability | <0.2% |
| XY Stage Options | 100 mm × 100 mm or 200 mm × 200 mm |
| Maximum Sample Diameter | 200 mm |
| Measurement Modes | Contact Four-Point Probe (4PP) and Non-Contact Eddy Current (EC) |
| Mapping Configurations | Linear, Rectangular, Polar, and User-Defined Grids |
| Compliance | ASTM F84, ISO 10474, SEMI MF67, USP <1031>, GLP/GMP-ready audit trail support |
| Brand | KLA |
|---|---|
| Origin | Guangdong, China |
| Manufacturer Type | Authorized Distributor |
| Country of Origin | China |
| Model | P7 |
| Price | USD 70,000 (FOB Shenzhen) |
| Brand | KLA |
|---|---|
| Origin | USA |
| Model | R54 |
| Automation Level | Semi-Automatic |
| Resistivity Measurement Range | 1 mΩ/□ to 200 Ω/□ |
| Resistivity Measurement Accuracy | < 0.02% |
| Z-Travel Range | 15 mm |
| XY Stage Type | Motorized |
| Max Sample Height | 15 mm |
| Max Sample Weight | 2.5 kg |
| 4PP Measurement Repeatability | < 0.02% |
| EC Measurement Repeatability | < 0.2% |
| Compatible Sample Sizes | Up to 300 mm Ø or A4 (210 × 297 mm) |
| Probe Configurations | Customizable rectangular, linear, polar, and user-defined mapping patterns |
| Dual-Mode Operation | Four-Point Probe (4PP) and Non-Contact Eddy Current (EC) |
| Brand | KLA |
|---|---|
| Origin | USA |
| Model | CS10 / CS20 |
| Detection Sensitivity | 80 nm particles |
| Sample Size Support | 2–8 inch wafers (standard), customizable fixtures |
| Operation Modes | Manual (CS10) / Automated Transport (CS20) |
| Optical Channels | 4-channel detection (scattered light, reflected light, phase shift, Z-height) |
| Environmental Class | ISO Class 4 (10 cleanroom equivalent) |
| Compliance | Designed for semiconductor fab environments |
| Software | Integrated defect classification, statistical distribution mapping, root-cause traceability, and automated pass/fail reporting |