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| Brand | TESCAN |
|---|---|
| Origin | Czech Republic |
| Manufacturer Type | Original Equipment Manufacturer (OEM) |
| Instrument Type | Floor-standing SEM |
| Electron Source | Schottky Field Emission Gun |
| Secondary Electron Resolution | 1.0 nm @ 30 kV |
| Magnification Range | 2× to 1,000,000× |
| Accelerating Voltage | 50 V–30 kV (with beam deceleration mode) |
| Backscattered Electron Resolution | 2.0 nm @ 30 kV |
| Brand | TESCAN |
|---|---|
| Origin | Czech Republic |
| Manufacturer | TESCAN ORSAY HOLDING a.s. |
| Type | VEGA |
| Electron Source | Tungsten (W) Filament |
| Secondary Electron Resolution | 3.0 nm @ 30 kV |
| Magnification Range | 2× to 1,000,000× |
| Accelerating Voltage | 0.2–30 kV (continuously adjustable) |
| Backscattered Electron Resolution | 3.5 nm @ 30 kV |
| Brand | TESCAN |
|---|---|
| Origin | Czech Republic |
| Manufacturer Type | Original Equipment Manufacturer (OEM) |
| Import Category | Imported Instrument |
| Model | RISE Microscope |
| Electron Gun Type | Cold Field Emission |
| Secondary Electron Image Resolution | 1.0 nm @ 15 kV |
| Accelerating Voltage Range | 0.2–30 kV |
| Backscattered Electron Image Resolution | 1.0 nm @ 15 kV |
| Confocal Raman Spatial Resolution | 360 nm (with 532 nm laser) |
| Optical Architecture | Parallel-Axis Co-Localized SEM–Raman Design |
| Maximum Sample Chamber Capacity | Compatible with TESCAN’s Ultra-Large Chamber Platforms |
| Detector Compatibility | Full Integration with BSE, CL, EDS, and Other In-Chamber Detectors |
| Brand | TESCAN |
|---|---|
| Origin | Czech Republic |
| Manufacturer Type | Original Equipment Manufacturer (OEM) |
| Instrument Category | Imported |
| Model | TIMA-X FEG LMU/LMH |
| Electron Source | Cold Field Emission Gun (CFEG) |
| Secondary Electron Resolution | 1.2 nm @ 30 kV |
| Magnification Range | 1× to 1,000,000× |
| Accelerating Voltage | 0.2–30 kV |
| Backscattered Electron Resolution | 2.0 nm @ 15 kV |
| EDX Detector Configuration | Up to 4 Peltier-cooled Silicon Drift Detectors (SDD) |
| Sample Chamber | Large-volume, motorized multi-position stage accommodating up to seven 30 mm-diameter samples |
| Vacuum Mode | High Vacuum (standard), Low Vacuum (optional) |
| Platform Base | MIRA FEG SEM platform with differential pumping and gun isolation valve |
| Brand | TESCAN |
|---|---|
| Origin | Czech Republic |
| Manufacturer Type | Original Equipment Manufacturer (OEM) |
| Origin Category | Imported Instrument |
| Model | TENSOR |
| Pricing | Available Upon Request |
| Brand | TESCAN |
|---|---|
| Origin | Czech Republic |
| Manufacturer | TESCAN ORSAY HOLDING a.s. |
| Type | Floor-Standing SEM |
| Electron Source | Schottky Field-Emission Gun |
| Secondary Electron Resolution | 1.0 nm @ 30 kV |
| Backscattered Electron Resolution | 2.0 nm @ 30 kV |
| Magnification Range | ×2 to ×1,000,000 |
| Accelerating Voltage | 50 V (decelerated mode) to 30 kV |
| Chamber Configuration | AMU (Advanced Macro-Utility) Ultra-Large Specimen Chamber |
| Compliance | CE, ISO 9001, IEC 61000-6-3/6-4 |
| Brand | TESCAN |
|---|---|
| Origin | Czech Republic |
| Manufacturer Type | Original Equipment Manufacturer (OEM) |
| Instrument Type | Floor-Standing SEM |
| Electron Source | Thermal Field-Emission Gun (TFEG) |
| Secondary Electron Resolution | 0.9 nm @ 15 kV |
| Magnification Range | 2× to 2,000,000× |
| Accelerating Voltage | 200 V – 30 kV (with deceleration mode down to 50 V) |
| Backscattered Electron Resolution | 2.0 nm @ 30 kV (in low-vacuum mode) |
| Brand | TESCAN |
|---|---|
| Origin | Czech Republic |
| Manufacturer | TESCAN ORSAY HOLDING a.s. |
| Type | Imported High-Resolution Dual-Beam FIB-SEM |
| Model | TESCAN SOLARIS |
| Price Range | USD 1.3–2.0 million (FOB Europe) |
| Brand | TESCAN |
|---|---|
| Origin | Czech Republic |
| Manufacturer Type | Original Equipment Manufacturer (OEM) |
| Import Category | Imported Instrument |
| Model | TIMA-X |
| Electron Gun Type | Cold Field Emission |
| Secondary Electron Image Resolution | 1.2 nm @ 30 kV |
| Magnification Range | 1× to 1,000,000× |
| Accelerating Voltage | 0.2–30 kV |
| Backscattered Electron (BSE) Image Resolution | 2.0 nm @ 15 kV |
| Brand | TESCAN |
|---|---|
| Origin | Shanghai, China |
| Manufacturer Type | Original Equipment Manufacturer (OEM) |
| Product Category | Domestic |
| Model | FIB/SEM Column Upgrade Service |
| Instrument Form Factor | Floor-Standing |
| Electron Source Type | Thermal Field Emission |
| Microscope Class | Ultra-High-Resolution Field-Emission SEM/FIB |
| Secondary Electron Imaging Resolution | ≤1.6 nm (Brightbeam), ≤5 nm (e-CLIPSE+), ≤2.5 nm (DeepFIB), ≤25 nm (PFIB), ≤5 nm (Veloce), ≤30 nm (iVeloce) |
| Accelerating Voltage Range | 0.5–30 keV (e-beam) |
| Backscattered Electron Imaging Resolution | Comparable to SE resolution under optimized conditions |
| Ion Beam Current Range | Up to 125 nA (DeepFIB), up to 3.5 µA (PFIB), up to 50 nA (Veloce), up to 1 µA (iVeloce) |
| Field of View (at 10 keV) | 1250 × 1250 µm (±10%) for e-CLIPSE+, PFIB, iVeloce |
| Brand | TESCAN |
|---|---|
| Origin | Czech Republic |
| Manufacturer | TESCAN s.r.o. |
| Type | Imported Instrument |
| Model | TESCAN VEGA COMPACT |
| Electron Source | Tungsten Filament |
| Secondary Electron Resolution | 3.0 nm @ 30 kV |
| Magnification Range | 2× to 1,000,000× |
| Accelerating Voltage | 200 V – 30 kV (continuously adjustable) |
| Backscattered Electron Resolution | 3.5 nm @ 30 kV |
| Brand | TESCAN |
|---|---|
| Origin | Czech Republic |
| Manufacturer Type | Original Equipment Manufacturer (OEM) |
| Origin Category | Imported |
| Model | NanoSpace |
| Price Range | USD 1.9M – 3.2M |
| Main Chamber Base Pressure | 5 × 10⁻¹⁰ mbar |
| Bake-Out Temperature | Up to 120 °C |
| Sample Transfer Time (Atmosphere → UHV Main Chamber) | ≤30 min |
| Stage X/Y Travel Range | 100 mm ± 50 nm |
| BrightBeam e-Optics Resolution | <1.6 nm @ 12 mm WD, 0.5–30 keV, beam current: few pA to >350 nA |
| e-CLIPSE+ e-Optics Resolution | 5 nm @ 1 pA, 0.5–30 keV, beam current: 1 pA–2.5 µA @ 30 keV, FOV @ 10 keV: 1250 × 1250 µm (±10%) |
| DeepFIB Ga⁺ Source Resolution | 2.5 nm @ 1 pA, 250 V–30 keV, max ion current: 125 nA |
| PFIB Gas Field Ion Source (Xe⁺/O₂⁺/Ar⁺/He⁺/N⁺) | 25 nm @ 1 pA @ 3 keV, beam current up to 3.5 µA, FOV @ 10 keV: 1250 × 1250 µm (±10%), Si milling rate: 800 µm³/s |
| Veloce LMAIS (AuGe/AuSi/Bi) | 5 nm @ 1 pA, mass range: 14 (Si⁺) to 613 (AuSi⁺), 1–30 keV, max current: 50 nA |
| iVeloce Wien-filtered Gas Ion Source (Xe⁺/O₂⁺/Ar⁺/He⁺/N⁺) | 3–30 keV, max current: 1 µA, FOV @ 10 keV: 1250 × 1250 µm (±10%) |
| Brand | TESCAN |
|---|---|
| Origin | Czech Republic |
| Manufacturer Type | Original Equipment Manufacturer (OEM) |
| Origin Category | Imported Instrument |
| Model | TESCAN AMBER |
| Price Range | USD 920,000 – 1,315,000 |
| Brand | TESCAN |
|---|---|
| Origin | Czech Republic |
| Manufacturer Type | Original Equipment Manufacturer (OEM) |
| Category | Imported Instrument |
| Model | TESCAN SOLARIS X |
| Price Range | USD 1.3M – 1.9M |
| Brand | TESCAN |
|---|---|
| Origin | Czech Republic |
| Manufacturer Type | Original Equipment Manufacturer (OEM) |
| Origin Category | Imported Instrument |
| Model | TESCAN AMBER X |
| Price Range | USD 1.3–2.0 million |
| Brand | TESCAN |
|---|---|
| Origin | Czech Republic |
| Manufacturer Type | Original Equipment Manufacturer (OEM) |
| Instrument Type | Floor-Standing SEM |
| Electron Source | Schottky Field-Emission Gun (FEG) |
| Secondary Electron Resolution | 0.6 nm @ 15 kV |
| Magnification Range | 2× to 2,000,000× |
| Accelerating Voltage | 0.2–30 kV (deceleration mode down to <50 V) |
| Backscattered Electron Resolution | 1.6 nm @ 15 kV |
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