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| Brand | JFP |
|---|---|
| Origin | France |
| Model | S100 Semi-Automatic Scribe & Break System |
| Scribing force range | 10–80 g (constant-weight mechanism, optional auxiliary weights) |
| Diamond scribe tip | adjustable angle and rotational orientation |
| Wafer chuck capacity | up to 4-inch diameter |
| Die size compatibility | 100 µm × 100 µm minimum to 10 mm × 10 mm maximum |
| Wafer thickness tolerance | ≥50 µm |
| XY stage resolution | 0.23 µm |
| Optical imaging system | 22″ TFT display + ultra-HD color camera |
| Digital zoom | ×10 electronic |
| Break mode | manual or programmable auto-actuation |
| Break mechanism | top rubber clamping + bottom linear blade actuation |
| Control interface | 7″ capacitive touchscreen |
| Y-axis scribing speed | 0.1–20 mm/s |
| Power supply | 100/230 VAC, 1 kW |
| Pneumatic supply | 70 psi |
| Vacuum requirement | full vacuum (100%), 15 L/min flow rate |
| Dimensions (W×D×H) | 650 × 820 × 1500 mm (25 × 32 × 60 in) |
| Weight | 70 kg |
| Brand | JFP |
|---|---|
| Origin | France |
| Equipment Type | Automatic Wire Bonder |
| Model | WB 200-e |
| Bonding Technology | Thermosonic Ball Bonding with 360° Rotational Capillary Actuation |
| Max. Z-Travel | 40 mm |
| Z-Axis Resolution | 0.23 µm |
| XY-Stage Range | 80 × 80 mm |
| XY/Z Resolution | 0.23 µm |
| Ultrasonic Power Range | 0–5 W |
| Frequency | 62 kHz (standard), optional 40/80 kHz |
| Bond Force Range | 10–150 cN |
| Bond Time Range | 0–2000 ms |
| Wire Diameter Support | Au/Al 17–50 µm, Ribbon 40–250 µm (w) × 12–25 µm (t) |
| Heating Stage Temp. Range | 60–250 °C (±1% accuracy) |
| Vision System | 5 MP industrial camera, 8× optical zoom, programmable coaxial & oblique LED illumination |
| Footprint | 640 × 710 × 550 mm |
| Weight | 60 kg |
| Brand | JFP |
|---|---|
| Origin | France |
| Type | Imported Semiconductor Assembly & Packaging Equipment |
| Model | PP Stacker |
| Application | Precision Pick-and-Place, Stacking & De-stacking of Laser Diode Bars |
| Compliance | Designed for ISO Class 5–7 cleanroom environments |
| Software | JFP StackerControl v3.2 with Audit Trail & Event Logging |
| Power Supply | 100/230 VAC, 1 kW |
| Pneumatic Requirements | Dry air at 5 bar, vacuum ≥90% |
| Dimensions (W×D×H) | 900 × 830 × 1750 mm |
| Throughput | 600 units/hour (single bar + single spacer cycle) |
| Pick-up Force | <5 g (non-damaging micro-handling) |
| XY Stage Resolution | 1 µm (micrometer-adjustable manual stage) |
| Vision System | Triple 5 MP color cameras (vertical orientation), independent digital video control, LED illumination (adjustable intensity), field-of-view up to 20 mm, continuous optical zoom, 11× digital zoom, PIP mode (3 windows), calibrated scale bar (0.6 mm @ 20×) |
| Sample Compatibility | Laser diode bars (max. 18 mm length |
| Tooling Options | Manual blue-tape ejection kit |
| Brand | UniTemp |
|---|---|
| Origin | USA |
| Model | 2Z-HVS-200 |
| Vacuum Level | ≤1×10⁻⁶ hPa |
| Max Temperature | 450 °C |
| Programmable Steps | 100 per Recipe, 20 Recipes Stored |
| Optical Process Monitoring | 360° Quartz Viewing Cylinder |
| Cooling | Active Water-Cooled Lower Platen + External Closed-Loop Chiller Recommended (Optional Accessory WC-I) |
| Controller | Siemens SIMATIC® S7-1200 PLC with HMI Interface |
| Data Logging | Real-Time Temperature, Pressure, Gas Flow, and Time Stamping |
| Brand | JFP |
|---|---|
| Origin | France |
| Type | Manual Pull Testing System for Wire Bond Strength Evaluation |
| Measurement Principle | Mechanical Force Transduction via Precision Dial Gauge |
| Test Modes | Destructive and Non-Destructive Pull Testing |
| Vertical Travel Range | 10–150 mm (Coarse) + Micrometer-Driven Fine Adjustment (0.1 mm resolution) |
| Hook Tip Diameter | 15–50 µm |
| Max Test Wire/Die Bond Diameter | 200 µm |
| Z-Axis Control | Manual Handwheel |
| Damping Mechanism | Adjustable Mechanical Damping to Suppress Vibration Artifacts |
| Preset Force Threshold | User-Adjustable for Non-Destructive Mode |
| Compliance | Designed to Support ISO/IEC 17025 Traceability Requirements (Manual Recording Pathway) |
| Optional Accessories | High-Precision XYZ+Theta Stage (25 × 25 mm travel, 1 µm resolution |
| Brand | JFP |
|---|---|
| Origin | France |
| Model | S200 Semi-Automatic Scriber and Breaker |
| Power Supply | 100–230 VAC, 1 kW |
| Air Pressure | 80 psi |
| Vacuum System | 100% vacuum, 15 L/min |
| Dimensions (W×D×H) | 650 × 820 × 1500 mm |
| Weight | 70 kg |
| Wafer Handling | 2″ to 8″ |
| Minimum Die Size | 100 µm × 100 µm |
| Maximum Die Size | 150 mm × 150 mm |
| Z-axis Force Range | 5–80 g (adjustable via calibrated weights) |
| Diamond Scribe Tip | Adjustable angle & rotation |
| XY Stage Resolution | 1 µm (display), ±5 µm (positioning accuracy) |
| Y-axis Scribing Speed | 0.1–100 mm/s |
| Optical System | 22″ TFT monitor, ultra-HD color camera, electronic zoom ×10, LED illumination, JFP crosshair reticle |
| Control Interface | 7″ touchscreen, programmable step indexing & vertical spacing, scribe count & die ID logging |
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