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| Brand | JFP |
|---|---|
| Origin | France |
| Equipment Type | Automatic Wire Bonder |
| Model | WB 200-e |
| Bonding Technology | Thermosonic Ball Bonding with 360° Rotational Capillary Actuation |
| Max. Z-Travel | 40 mm |
| Z-Axis Resolution | 0.23 µm |
| XY-Stage Range | 80 × 80 mm |
| XY/Z Resolution | 0.23 µm |
| Ultrasonic Power Range | 0–5 W |
| Frequency | 62 kHz (standard), optional 40/80 kHz |
| Bond Force Range | 10–150 cN |
| Bond Time Range | 0–2000 ms |
| Wire Diameter Support | Au/Al 17–50 µm, Ribbon 40–250 µm (w) × 12–25 µm (t) |
| Heating Stage Temp. Range | 60–250 °C (±1% accuracy) |
| Vision System | 5 MP industrial camera, 8× optical zoom, programmable coaxial & oblique LED illumination |
| Footprint | 640 × 710 × 550 mm |
| Weight | 60 kg |
| Brand | JFP |
|---|---|
| Origin | France |
| Type | Manual Pull Testing System for Wire Bond Strength Evaluation |
| Measurement Principle | Mechanical Force Transduction via Precision Dial Gauge |
| Test Modes | Destructive and Non-Destructive Pull Testing |
| Vertical Travel Range | 10–150 mm (Coarse) + Micrometer-Driven Fine Adjustment (0.1 mm resolution) |
| Hook Tip Diameter | 15–50 µm |
| Max Test Wire/Die Bond Diameter | 200 µm |
| Z-Axis Control | Manual Handwheel |
| Damping Mechanism | Adjustable Mechanical Damping to Suppress Vibration Artifacts |
| Preset Force Threshold | User-Adjustable for Non-Destructive Mode |
| Compliance | Designed to Support ISO/IEC 17025 Traceability Requirements (Manual Recording Pathway) |
| Optional Accessories | High-Precision XYZ+Theta Stage (25 × 25 mm travel, 1 µm resolution |
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